WO2008086640A1

WO2008086640A1 - A modularized back-board

Info

Publication number: WO2008086640A1
Application number: PCT/CN2007/000013
Authority: WO
Inventors: Xiangjun Wu
Original assignee: Zte Corporation
Priority date: 2007-01-04
Filing date: 2007-01-04
Publication date: 2008-07-24
Also published as: CN101401054B; CN101401054A

Abstract

A modularized back-board, includes a power bus, a control bus and a data bus, includes at least one sub back-board, each of the sub back-board only includes one kind of the power-bus, the control bus or the data bus.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to backplane technology and, more particularly, to a modular backplane. BACKGROUND OF THE INVENTION Backplanes have always been a specialized product in the PCB manufacturing industry. The design parameters are quite different from most other boards. Some of the most demanding requirements are met in production. Noise tolerance and signal integrity also require backplane design to follow unique design rules. These characteristics of the backplane lead to huge differences in manufacturing requirements such as equipment specifications and equipment processing. In the backplane, subrack, and chassis design of the current card structure, a large slab structure is used, that is, the backplane is usually a whole backplane, so the design of the subrack and the chassis is also integrated. In addition, in some standard backplanes, subracks, and chassis designs, the design method of the overmodulation module is also adopted, for example, in the PCI subrack, the CPCI subrack (please provide the Chinese and English names) or the general computer system. . The normal split mode is vertical split mode. For example, the number of slots in the main chassis is M, and then extended by the bridge module to reach N (N>M). Figure 1 illustrates a prior art backplane design. The backplane bus included in the backplane shown in Figure 1 can be divided into the following categories: power bus, management bus, and data (service) bus. The power bus completes the power supply of the internal plug-in board of the system. The management bus completes the management of each module or board as a whole, and the data (service) bus completes data exchange and transmission between each module or board. These types of buses usually have no signal cross-connections on the backplane. In this case, in the prior art shown in Fig. 1, a whole backplane is divided into a power bus area, a management bus area, and a data bus area. Usually, the whole slab design method is relatively common. The drawback is that once the backplane is designed, the number of slots, the connection between the management bus and the data bus cannot be changed. The second sub-module design method can extend the slot, but when expanding, an additional bridge module is required. Moreover, the connection relationship between the management bus and the data bus cannot be changed substantially. And the above design methods all have the problem of a long design cycle. SUMMARY OF THE INVENTION The object of the present invention is to complete the design of the backplane in a prior art, and the design of the backplane is sub-regional, phased, and sub-module. It is possible to assemble hardware systems with different characteristics by assembling according to different market demands. The present invention provides a modular backplane comprising a power bus, a management bus, and a data bus, including at least one sub-backplane, each sub-backplane including only one of a power bus, a management bus, and a data bus . In the above backplane, the sub-backplane includes: a power sub-backboard that includes only the power bus. In the above backplane, the sub-backplane includes: a management sub-board that includes only the management bus. In the above backplane, the sub-backplane includes: a data sub-backplane that includes only the data bus. In the above backplane, there is no signal crossing between the power bus, the management bus, and the data bus. In the above described back sheet, at least one of the sub-back sheets is physically separated. In the above described back sheet, at least one of the sub-back sheets can be mechanically matched to each other. In the above described backplane, at least one of the sub-backplanes is mechanically mated to each other to be reliably co-located. In the above backplane, the backplane is the backplane for the ATCA chassis. In the above-mentioned backplane, at least one sub-backboard is assembled according to whether the ATCA chassis is a double-star structure or a full-switch structure. With the method of the present invention, compared with the prior art, a modular design idea is adopted. A design method applied to the backplane and subracks and chassis. This design method can decompose a complex large system design into a smaller system design. Each small system (subsystem) can be developed independently without affecting each other. And can separately assemble different functions or performance systems through different performance or function sub-backplanes. Therefore, it is possible to complete a variety of different performance or different functional system designs at a small cost, reducing duplication of effort and improving design. Efficiency. A system completed using this design method can perform an independent upgrade of any subsystem without It affects the functionality of other subsystems, thus protecting the investment of the application. Other features and advantages of the invention will be set forth in the description which follows, and <RTIgt; The objectives and other advantages of the invention will be realized and attained by the <RTI The drawings are intended to provide a further understanding of the invention, and are intended to be a part of the description of the invention. In the drawings: Figure 1 shows a schematic view of a backplane design in accordance with the prior art; and Figure 2 shows a schematic diagram of a modular backplane design in accordance with an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The preferred embodiments of the present invention are described with reference to the accompanying drawings. In the backplane and chassis design of the current backplane-insert board structure, all kinds of buses have relatively clear boundaries. This type of design mainly comes from the modular design idea. The present invention provides a modular backplane comprising a power bus, a management bus, and a data bus, including at least one sub-backplane, each sub-backplane including only one of a power bus, a management bus, and a data bus . The idea of the invention mainly comes from the modular design idea. The backplane, subrack, chassis sub-area, and sub-module can be designed. The usual backplane bus can be divided into the following categories, power bus, management bus, and data (service) bus. The power bus completes the power supply of the internal plug-in board of the system. The management bus completes the management of each module or board as a whole, and the data (service) bus completes data exchange and transmission between each module or board. These types of buses usually have no signal cross-connections on the backplane. In this case, the design of a single backplane can be divided into a sub-system design of the power sub-backboard, the management sub-backboard, and the data sub-backplane. The implementation of the technical solution will be further described in detail below with reference to the accompanying drawings: 2 shows a schematic diagram of a modular backplane design in accordance with an embodiment of the present invention. As shown in FIG. 2, the sub-backplanes include: a power sub-backplane that includes only a power bus; a management sub-backplane that includes only a management bus; and a data sub-backplane that includes only a data bus. Preferably, the power bus, the management bus, and the data bus have no signal crossings with each other, and the sub-backplanes are physically separated but mechanically matched to each other. Moreover, the sub-backplanes are connected to each other by mechanical mating to reliably co-locate. The scope of the present invention relates only to the hardware design portion of the system backplane, subrack, and chassis, and does not affect other modules in the system or the board design and the software portion of the system. The premise of using the invention is that there is no cross-signal connection between the subsystems of each sub-area on the backplane, and the premise is that the logical sub-system design can be implemented in the back-board design, and the invention can be completed. The physical subsystem design described. The design of each subsystem of power, management, and data can be completed separately. Of course, the present invention does not limit the classification method of the system bus. Only cross-signal connections are required between the various classification systems. This limitation is only for the purpose of squeezing this design. If there are too many cross-signal connections between the subsystems, the economics and practicality of this design method will be reduced. In the practice of the present invention, changes to the backplane design methodology will involve a sub-frame and chassis upgrade method that meets the assembly and mechanical requirements of physically dividing the backplane. In addition, it should be noted that there is a common requirement between the modules inserted into the system or the signals of the boards, so that strong physical connections between the various sub-backplanes are required to meet the requirements of the common ground. Connection method The present invention is not limited. The requirements for the common ground connection are that it is easy to handle and the connection is stable and reliable. In a practical application, a typical application in which the present invention can be applied is the design of an ATCA chassis. The design of the ATCA chassis itself meets the basic requirements of modularization, and the sub-area design is carried out in the connector design of the backplane, which is divided into ΖΟΝΕ1, ZONE2, ZONE3, where ZONE1 completes the connection of the relevant power system, ZONE2 completes the board management and Interconnect, ZONE3 is the user's custom area. It can be seen that this classification of the ATCA chassis is fully consistent with the premise of the application of the present invention. In the ZONE2 design, ATCA is designed with many different performances. For example, its switching structure can be divided into dual star or dual-switch Full Mesh structure. In this case, the two structures can be completed by the present invention. The sub-backplane design eliminates the need to change the power sub-board design of the ZONE1 area and the custom area of the ZONE3 area, and complete the different performance of the ATCA chassis through the assembly of different sub-backplanes in different areas. Design. Compared with the prior art, the method of the present invention is a design method for applying a modular design idea to a backboard, a subrack, and a chassis. The design method can decompose a complex large system design into With smaller system design, each small system (subsystem) can be developed independently, without affecting each other, and can be assembled separately through different performance or functional sub-backplanes to complete different functions or performance systems. Therefore, a variety of different performance or different functional system designs can be completed at a small cost, reducing duplication of effort and improving design efficiency. A system implemented using this design method can perform independent upgrades of any subsystem without affecting the functions of other subsystems, thereby protecting the investment of the application. It will be apparent to those skilled in the art that the various modules or steps of the present invention described above can be implemented by a general-purpose computing device that can be centralized on a single computing device or distributed across a network of multiple computing devices. Alternatively, they may be implemented by program code executable by the computing device, such that they may be stored in the storage device by the computing device, or they may be separately fabricated into individual integrated circuit modules, or they may be Multiple modules or steps are made into a single integrated circuit module. Thus, the invention is not limited to any specific combination of hardware and software. It is to be understood that changes in these specific embodiments will be apparent to those skilled in the art without departing from the scope of the invention. The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes can be made to the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and scope of the present invention are intended to be included within the scope of the present invention.

Claims

Claim

A modular backplane comprising a power bus, a management bus, and a data bus, characterized by comprising at least one sub-backplane, each of the sub-backplanes including only a power bus, a management bus, and data One of the buses.

2. The backplane of claim 1, wherein the sub-backplane comprises:

The power subbackplane, which only includes the power bus.

3. The backplane according to claim 1, wherein the sub-backplane comprises:

Manage the child backplane, which only includes the management bus.

4. The backplane according to claim 1, wherein the sub-backplane comprises:

Data subbackplane, which only includes the data bus.

5. The backplane of claim 1, wherein the power bus, the management bus, and the data bus have no signal crossings with each other.

6. The backsheet of claim 5, wherein the at least one sub-backplane is physically separated.

7. The backsheet of claim 5, wherein the at least one sub-backplanes are mechanically matable with each other.

8. The backsheet of claim 7, wherein the at least one sub-backplanes are mechanically mated to each other to be securely co-located.

9. The backplane according to claim 8, wherein the backplane is a backplane for an ATCA (in Chinese and English name) chassis. The backplane according to claim 9, wherein the at least one sub-backboard is assembled according to whether the ATCA chassis is a double star structure or a full switch structure.