WO2008080274A1

WO2008080274A1 - Packaging structure of pcb and element module and packaging method of the same

Info

Publication number: WO2008080274A1
Application number: PCT/CN2007/001360
Authority: WO
Inventors: Guoyuan Deng; Juhang Zeng
Original assignee: Beijing Huaqi Information Digital Technology Co.Ltd; Shenzhen Aigo Research And Development Co. Ltd
Priority date: 2006-12-31
Filing date: 2007-04-24
Publication date: 2008-07-10
Also published as: CN101211882A; CN101211882B

Abstract

A packaging structure of PCB and element module, comprising PCB (2) and the element module (1); a through-hole (II) is formed in the center area of PCB (2), PCB (2) includes a first packaging surface (21) and a second packaging surface (22), the second soldering points (24) disposed on the edges of through-hole (II) of the first carrier surface and the first soldering points (23) disposed separately with the second soldering point at a certain distance; the element module (1) includes a first packaging surface (11) and a second packaging surface (12), the first packaging end points (14) disposed on the sides of the first packaging surface (11) and the second packaging end points (13) disposed separately with the first packaging end points (14) at a certain distance, the inner area surrounded by the second packaging end points (13) is an element module area (19); the element module area (19) of the first packaging surface of the element module (1) lies in the through-hole (II) of PCB, so that the first and second packaging end points of the element module are electrically contacted and soldered with the first and second soldering points of PCB respectively.

Description

Packaging structure and packaging method of printed circuit board and component module

The invention relates to a package structure of a printed circuit board, in particular to a package structure of a printed circuit board and an element module and a packaging method thereof, a packaged packaging process and a reduction in packaging difficulty. Background technique

The development of electronic technology has made the integration of components on the circuit board higher and higher, so that the solder packaging process of the printed circuit board also needs to adapt to the development of high integration of components.

The traditional method of soldering printed circuit boards and components is mainly to adopt the following method: The first method is to directly solder the components to the printed circuit board; the second method is to integrate the core components into functional modules, and the functional modules are The component-related pins are taken out from the periphery and soldered to the printed circuit board, and sealed with an organic bonding agent such as resin.

'The above-mentioned direct soldering of the first printed circuit board and components is suitable for soldering of components and printed circuit boards when the integration is not high. If the integration of components is high, printing will be caused by the small package components of the components. The wiring of the circuit board is more difficult, and the requirements for the manufacturing process of the printed circuit board are also increased, and the cost is increased. The above-mentioned second printed circuit board and the direct packaging of the functional modules integrate the core or key components into functional modules. To some extent, it is difficult to connect with the printed circuit board. However, when the function module leads to too many pins, the area of the functional module is increased, and the wiring of the printed circuit board is more difficult, which is not conducive to the printed circuit. The board is miniaturized and highly integrated.

Therefore, a package structure and a packaging method for simplifying a printed circuit board and a component module are provided, a wiring of the low printed circuit board is difficult, and a manufacturing process requirement of the printed circuit board is reduced. It has become an urgent need for the development of current integrated circuit product design quantitative engineering.

Summary of the invention

The invention provides a package structure of a printed circuit board and an element module, and a process of packaging the printed circuit board to reduce the difficulty of wiring the printed circuit board.

In order to achieve the above object, the present invention provides a package structure of a printed circuit board and an element module, including: a component module, the component module includes a first package surface and a second package surface opposite to the first package surface, the first a first package end point is disposed on a side of the package surface, a second package end point is disposed on the first package surface at a certain position from the first package end point, and an area enclosed inside the second package end point protrudes to form an element module area, the component The module area is located on a different plane from the first package surface and protrudes from the first package surface, the first package end point penetrates the first package surface up and down; and the printed circuit board includes the first bearing surface and the first bearing surface The printed circuit board is provided with a through hole that is hollowed up and down, and the first bearing surface is provided with a first welding point, and the first bearing surface at a certain position from the first welding point is disposed on the first bearing surface. a solder joint, the first solder joint penetrates the printed circuit board up and down; the component module area of the first package surface of the component module is received in the printed circuit The first package surface of the component module is carried on the first bearing surface of the printed circuit board, and the first package end point and the second package end point of the first package surface are respectively printed on the printed circuit board. a first solder joint of the first load-bearing surface, a second; an early electrical contact termination; the lower end surface of the component module region of the component module is flush with or higher than the second load-bearing surface of the printed circuit board The second bearing surface of the board.

The present invention still further provides a packaging method based on the above printed circuit board and component module, comprising:

Carrying the first package surface of the component module on the first bearing surface of the printed circuit board The module area in the middle of the component module is received in the through hole of the printed circuit board; the first package end point and the second package end point of the first package surface of the component module are respectively associated with the printed circuit board The first solder joint and the second solder joint of a bearing surface are aligned with the electrical contact and soldered.

It can be seen from the above that the package structure of the printed circuit board and the component module of the present invention accommodates a part of the component module area on the first package surface of the component module in the through hole by opening a hollow through hole on the printed circuit board. The second soldering end and the first and second soldering points of the first carrying surface are respectively soldered and packaged, thereby achieving electrical connection between the component module and the printed circuit board and performing electrical signal transmission. The invention accommodates the component module area of the component module in the through hole of the printed circuit board, and performs the soldering and packaging through the lead-out first and second soldering end points of the component module, thereby reducing the wiring difficulty of the printed circuit board and simplifying the soldering and packaging of the printed circuit board. Process, easy to solder and package, reduce manufacturing costs.

In addition, the component module of the package structure of the printed circuit board and the component module of the present invention can adopt the structural design of the components placed on both sides, thereby reducing the overall assembly height, facilitating the reduction of the module size, saving the assembly space, and facilitating assembly.

DRAWINGS

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a front elevational view showing a first package surface of a component module in a package structure of a printed circuit board and an element module of the present invention.

Figure 2 is a front elevational view showing the second package surface of the component module in the package structure of the printed circuit board and the component module of the present invention.

Figure 3 is a partial enlarged view of the first end of the component module of Figure 1.

4 is a component module of a package structure of a printed circuit board and an element module of the present invention Schematic representation of the first coal seam end of the multilayer structure.

Figure 5 is a front elevational view of the first carrying surface of the printed circuit board in the package structure of the printed circuit board and component module of the present invention.

Figure 6 is a front elevational view of the second bearing surface of the printed circuit board in the package structure of the printed circuit board and component module of the present invention.

Figure 7 is a partial enlarged view of a second solder joint of the printed circuit board of Figure 5.

Figure 8 is a front elevational view showing the connection/welding of the package structure of the printed circuit board of the present invention and the component module.

Figure 9 is a partial enlarged view of the first solder joint of the component module of Figure 8 after soldering and packaging the first solder joint of the printed circuit board.

Figure 10 is a partial enlarged view of the second solder joint of the component module of Figure 8 after soldering and packaging of the second solder joint of the printed circuit board.

Figure 11 is a side elevational view showing the connection/welding of the package structure of the printed circuit board of the present invention and the component module.

Fig. 12 is an enlarged schematic view showing the inner side of the portion XII in Fig. 11.

Fig. 13 is an enlarged schematic view showing the outer side at the position XII in Fig. 11.

detailed description

In order to further explain the technical means and functions taken by the present invention to achieve the intended purpose, the specific implementation manner, structural features and functions of the package structure and packaging method of the printed circuit board and the component module of the present invention are described in detail below with reference to the accompanying drawings and embodiments. described as follows.

Referring to FIG. 11, the package structure 3 of the printed circuit board and component module of the present invention includes the component module 1 and the printed circuit board 2. In a specific embodiment, a core that can achieve a certain function, The key components are designed as integrated component modules, such as integrating the image receiving and processing modules into image component modules, and integrating the processing components of the optical signals into optical component modules. The printed circuit board 2 is a common printed circuit board. In a specific implementation, it may be a printed circuit board designed as a multilayer structure of two or more layers. The component module 1 may also be designed as two or more layers. Layer structure.

Referring to FIGS. 1 and 2, the component module 1 includes a first package surface 11 and a second package surface 12 opposite to the first package surface 11. A plurality of first package end points 14 are juxtaposed on the periphery of the first package surface 11 , and a plurality of rectangular second package end points are disposed on the first package surface 11 extending from the first package end point 14 toward the center of the element module 1 at a certain interval. 13. The outer edge of the first mounting terminal 14 forms the outermost boundary of the component module 1, i.e., the region surrounded by the outermost edge of the first package terminal 14 is the peripheral boundary region 16 of the component module 1. The second package end point 13 encloses the inner perimeter boundary area I of the component module 1. The area enclosed by the inner side of the second package end 13 of the first package surface 11 further includes a rectangular mark area 15 in which the circuit and components are disposed, and the circuit and component package in the mark area 15 form the element module area 19. The area enclosed by the broken line in Fig. 1 is the element module area 19 protruding from the first package surface 11 of the element module 1. The component module region 19 is located on a different plane than the first package surface 11, i.e., the component module region 19 protrudes from the first package surface 11 by a certain height in the vertical height and protrudes from the first package surface 11. The area of the marking area 15 is slightly smaller than the area enclosed by the second bonding point 13 of the first package surface 11. The marking area 15 is provided with a plurality of silkscreen marks 151 spaced apart by a distance mark, and the silk screen mark 151 is used to facilitate the pin number identification of the first and second package terminals 13, 14 of the component module 1.

Referring to FIG. 3, the area of the second package surface 12 of the component module 1 and the first package surface The size of 11 is the same. The outer side of the first package end point 14 of the first package surface 11 extends through the outer side of the component module 1 to form the first package end point 14 of the second package face 12. The second package surface 12 further includes a rectangular marking area 17 in which circuitry and components are disposed. The area of the mark area 17 is slightly smaller than the boundary area 16 of the second package surface 12, which is larger than the mark area 15 of the first package surface 11. The marking area 17 is located on a different plane from the second package surface 12 such that the marking area 17 protrudes from the second package surface 12 by a certain height from the second package surface at a vertical height. The marking area 17 includes a silk screen marking 171 of the first package end point 14 and a plurality of silk screen markings 172 spaced apart by a distance mark for facilitating pin number identification of the first package end point 14 of the component module 1.

3 and FIG. 4 is a partial enlarged and multi-layered structural diagram of the first package end point 14 of FIG. The first package end point 14 includes an inner ring package pad 141 and an outer ring package pad 142. The inner ring package pad 141 is a semicircular soldering pad formed by a circular through hole cut-off half, and the inner ring package is soldered. The disk 141 penetrates the component module 1 up and down, and the outer ring package pad 142 is formed by a semi-raceway printed circuit; 1: Early disk. The semi-circular via pads of the inner ring package pads 141 are tin-plated//sink/gold-filled pads, and the semi-circular via pads of the inner ring package pads 141 are treated with an oxidation prevention process. 1 and 2, the inner ring package pad 141 of the first package end point 14 of the component module 1 of the package structure 3 of the present invention and the component module 1 of the component module penetrates the outer edge of the component module 1 up and down, such as As shown in FIG. 4, the component module 1 can adopt the structure of a multi-layer board, and is electrically connected through the inner peripheral pad of the first package terminal end 14 , and the first package end point formed by the pin drawn from the component module 1 The electrical signal connection to the external components is effected by vias 18 in the printed circuit board 2, i.e., through the vias 18 to the solder terminals of the signal lines of each layer. Referring to FIGS. 5 and 6, the printed circuit board 2 includes a first bearing surface 21 and a second bearing surface 22 opposite the first bearing surface 21. The first bearing surface 21 includes a first: dry contact 24, which is adjacent to the edge of the first bearing surface 21, and a second solder joint 23 formed at a certain position from the inner side of the first solder joint 24. The first solder joint 24 is a soldering end formed by a rectangular printed circuit. The inner portion of the central portion of the printed circuit board 2 is hollowed out to form a square through hole Π, that is, the area of the through hole II is larger than the element module region 19 of the component module 1, that is, the second solder joint 23 The area enclosed by the inner side is the size of the element module area 19. Further, the area of the through hole II may also be larger than the area of the element module region 19. The second ping joint 23 is located at the edge of the through hole II of the first bearing surface 21, and the first solder joint 24 is disposed at the edge along the edge of the printed circuit board 2, and the first bearing surface 21 at a position from the second soldering point 23 on. The first bearing surface 21 further includes a rectangular marking area 27 having an area slightly larger than the area enclosed by the first welding spot 24. The first bearing surface 21 of the printed circuit board 2 further includes a silk screen marking 271 of the first solder joint 24 and a plurality of silk screen markings 272 and auxiliary identification characters 273 spaced apart by a distance. The silk screen mark 272 and the auxiliary identification character 273 are used to facilitate the pin number identification of the first solder joint 24 of the printed circuit board 2. The area enclosed by the outermost edges of the printed circuit board 2 is the board peripheral boundary 26.

The area of the second bearing surface 22 of the printed circuit board 2 is the same as the area of the first bearing surface 21. A marking area 28 is disposed on the second bearing surface 22 from a peripheral boundary 26 of the printed circuit board. The screen marking area 28 is formed with silk screen marks at each of the spaced positions to form a silk screen marking 281 and an auxiliary identification character 282 for facilitating the printed circuit board 2. The pin number of the second pad 23 is identified. Convenient for welding when welding. The inner side edge 25 of the second solder joint 23 encloses the through hole II of the printed circuit board 2. Please refer to FIG. 7 as a partial enlarged view of the second solder joint 23 in FIG. The second weld spot 23 includes an inner ring welded plate 231 and an outer ring welded plate 232. The structure of the second solder joint 23 is the same as that of the outer ring pad of the component module 1. The inner ring soldering pad 231 has a circular through hole cut in half to form a semicircular soldering pad, and the inner ring is soldered to the disk 231. The lower ring soldering pad 232 is a semi-raceway-shaped pad formed by the printed circuit of the circuit board.

Referring to FIG. 8, the component module 1 and the printed circuit board 2 are solder-sealed, and the first package surface 11 of the component module 1 is placed on the through-hole 21 of the printed circuit board 2, and the mark of the first package surface 11 is made. The region 15 is housed in the through hole II such that the circuit in the marking region 17 of the second package surface 12 and the second bearing surface 22 of the printed circuit board 2 are positioned above the through hole II. The first package end point 14 and the second package end point 13 of the first package surface 11 of the component module 1 are respectively connected to the first solder joint 24 and the second solder joint 23 of the first bearing surface 21 of the printed circuit board 2, That is, the semi-circular first package end point 14 is electrically connected to the rectangular first solder joint 24 in a one-to-one correspondence, and the rectangular second package end point 13 is in one-to-one correspondence with the semi-circular second solder joint. Realize electrical connection. The first package end point 14 of the second package face 12 of the component module 1 is not in soldered contact with the printed circuit board 2, and the first pad contact 24 of the second carrier face 22 of the printed circuit board 2 does not participate in the soldering contact of the component module 1. Therefore, the circuit in the mark region 15 of the first package surface 11 of the component module 1 is located in the space formed by the through hole II of the printed circuit board 2, and the mark region 17 of the second package surface 12 and the second package surface 12 is located. Above the through hole II. It can be seen that after the component module 1 and the printed circuit board 2 are soldered and packaged, the height of the package structure 3 forming the printed circuit board and the component module of the present invention is only the height of the printed circuit board 2 and the second package surface 12 of the component module 1. The sum of the heights of the circuits in the marked area 17 is as shown in FIGS. 11 and 12. In summary, the package structure 3 of the printed circuit board and the component module of the present invention separates the first package end point 14 and the second package end point 13 of the first package surface 11 of the element module 1 from the first bearing surface of the printed circuit board 2, respectively. The first solder joint 24 and the second solder joint 23 of 21 are respectively welded and packaged, which reduces the packing density of the component module, reduces the difficulty of the packaging process, reduces the area of the component module, and increases the seismic resistance of the component module. When the module is damaged, the package structure of the invention also facilitates the disassembly and replacement of the component module, thereby reducing maintenance costs.

The package structure 3 of the printed circuit board and the component module of the present invention encapsulates the critical and core circuits into the component module 1, and then the pins of the component are taken out and the first package end point is formed only on the first package surface 11 of the component module 1. 14. The second package terminal 13 is configured to be hollowed out on the printed circuit board 2 to open a through hole II adapted to the size of the second bearing surface 12 of the component module 1, so that the component module 1 is first The circuit in the marking region 15 of the package surface 11 is completely accommodated in the through hole II without protruding the second bearing surface 22 of the printed circuit board 2, thereby making the entire height of the package structure 3 of the printed circuit board and the component module of the present invention. Only the sum of the height of the printed circuit board 2 and the height of the first soldering end 14 of the first package surface 11 of the component module 1 is higher than that of the conventional component module and the printed circuit board. Compared with the height of the printed circuit board, the package structure 3 of the printed circuit board and the component module of the present invention reduces the package height, saves assembly space, and facilitates printing Miniaturization and high integration of the board.

Claims

Claim

1. A package structure of a printed circuit board and a component module, comprising:

a component module, the component module includes a first package surface and a second package surface opposite to the first package surface, the side of the first package surface is provided with a first package end point, and the first package is located at a certain position from the end of the first package end a second package end point is disposed on the surface, and an area enclosed by the inner side of the second package end is an element module area, and the component module area is located on a different plane from the first package surface and protrudes from the first package surface, the first package end point And the printed circuit board includes a first bearing surface and a second bearing surface opposite to the first bearing surface, the printed circuit board is provided with a through hole for upper and lower hollowing, and the first bearing a second soldering point is disposed at an edge of the through hole of the surface, and a first soldering point is disposed on the first bearing surface at a certain position from the second soldering point, and the second soldering point penetrates the printed circuit board up and down;

The component module area of the first package surface of the component module is located in the through hole of the printed circuit board, and the first package surface of the component module is carried on the first bearing surface of the printed circuit board, the first The first package end point and the second package end point of the package surface are respectively electrically contact-welded with the first solder joint and the second solder joint of the first bearing surface of the printed circuit board, and the lower end surface of the component module area of the component module is The second carrying surface of the printed circuit board is flush or higher than the second carrying surface of the printed circuit board.

2. The package structure of a printed circuit board and an element module according to claim 1, wherein the area of the through hole is greater than or equal to the area of the element module area of the element module.

3. The package structure of a printed circuit board and an element module according to claim 1, wherein: the first package end of the first package surface of the component module comprises an inner ring package solder a disk and an outer ring package pad electrically connected to the inner ring package pad, wherein the second solder joint of the first bearing surface of the printed circuit board comprises an inner ring soldering pad and an external electrical connection with the inner ring pad The outer ring package pad of the first package end is soldered to the first solder joint, and the inner ring bond pad of the second termination point is soldered to the second package end.

The package structure of the printed circuit board and the component module according to claim 3, wherein: the inner ring package pad of the first package end point is a semi-circular through-hole soldering of the upper and lower through component modules The inner ring welding pad of the second soldering point is a semi-circular via hole extending through the printed circuit board.

The package structure of the printed circuit board and the component module according to claim 4, wherein the inner ring package pad and the semicircular through hole pad of the inner ring bonding pad are tinned or sun-plated. Tin or gold padding.

The package structure of the printed circuit board and the component module according to claim 5, wherein the inner ring encapsulating plate and the semicircular through hole pad of the inner ring bonding pad are anti-oxidation welding plate.

The package structure of the printed circuit board and the component module according to claim 3 or 4, wherein the outer ring package pad of the first package end point and the outer ring of the second solder joint are soldered The disk is a half runway type or a rectangular pad.

8. The package structure of a printed circuit board and an element module according to claim 1, wherein: the printed circuit board is a circuit board of two or more layers, and the component module is a multi-layer structure. Component module.

9. The package structure of a printed circuit board and an element module according to claim 1, wherein: the first package surface and the second package surface of the component module are marked with components The marked area, the first pad end mark of the component module, and a number of silkscreen marks spaced apart by a certain distance.

The package structure of the printed circuit board and the component module according to claim 1, wherein: the first bearing surface and the second bearing surface of the printed circuit board are marked with a marking area of the component module, and the first welding The silk screen mark of the end of the disk, a number of silk screen marks separated by a certain distance mark, and auxiliary identification characters of the pin number.

11. The method of packaging a printed circuit board and an element module according to claim 1, wherein the first package surface of the component module is carried on a first bearing surface of the printed circuit board, and the module in the middle of the component module The area is disposed in the through hole of the printed circuit board; the first soldering point of the first package end surface of the first package surface of the component module and the second package end point are respectively connected to the first soldering point of the first bearing surface of the printed circuit board, The second solder joint is aligned with the electrical contact and soldered.