WO2008073159A3 - Nanoscopic assurance coating for lead-free solders - Google Patents

Nanoscopic assurance coating for lead-free solders Download PDF

Info

Publication number
WO2008073159A3
WO2008073159A3 PCT/US2007/018121 US2007018121W WO2008073159A3 WO 2008073159 A3 WO2008073159 A3 WO 2008073159A3 US 2007018121 W US2007018121 W US 2007018121W WO 2008073159 A3 WO2008073159 A3 WO 2008073159A3
Authority
WO
WIPO (PCT)
Prior art keywords
lead
nanoscopic
free solders
assurance coating
assurance
Prior art date
Application number
PCT/US2007/018121
Other languages
French (fr)
Other versions
WO2008073159A2 (en
Inventor
Joseph D Lichtenhan
Andre Lee
Sukendu B Hait
Original Assignee
Hybrid Plastics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hybrid Plastics Inc filed Critical Hybrid Plastics Inc
Priority to JP2009525565A priority Critical patent/JP5221539B2/en
Priority to EP07870739A priority patent/EP2059349A4/en
Publication of WO2008073159A2 publication Critical patent/WO2008073159A2/en
Publication of WO2008073159A3 publication Critical patent/WO2008073159A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/296—Organo-silicon compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections

Abstract

Nanoscopic silicon containing agents including polyhedral oligomeric silsesquioxane and polyhedral oligomeric silicate are used to eliminate the formation of conductive metal whiskers at the surface of lead-free solders joints and atom migration in semiconductors.
PCT/US2007/018121 2006-08-18 2007-08-15 Nanoscopic assurance coating for lead-free solders WO2008073159A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009525565A JP5221539B2 (en) 2006-08-18 2007-08-15 Nanoscopic guarantee coating for lead-free solder
EP07870739A EP2059349A4 (en) 2006-08-18 2007-08-15 Nanoscopic assurance coating for lead-free solders

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US82279206P 2006-08-18 2006-08-18
US60/822,792 2006-08-18

Publications (2)

Publication Number Publication Date
WO2008073159A2 WO2008073159A2 (en) 2008-06-19
WO2008073159A3 true WO2008073159A3 (en) 2008-08-07

Family

ID=39512240

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/018121 WO2008073159A2 (en) 2006-08-18 2007-08-15 Nanoscopic assurance coating for lead-free solders

Country Status (6)

Country Link
EP (1) EP2059349A4 (en)
JP (1) JP5221539B2 (en)
KR (1) KR20090051741A (en)
SG (1) SG176498A1 (en)
TW (1) TW200831623A (en)
WO (1) WO2008073159A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100012708A1 (en) * 2008-07-16 2010-01-21 Schlumberger Technology Corporation Oilfield tools comprising modified-soldered electronic components and methods of manufacturing same
DE102008036090B4 (en) * 2008-08-04 2020-01-30 Te Connectivity Germany Gmbh Electrical contact pairing and method for producing and contacting such
CN102019514A (en) * 2010-06-01 2011-04-20 重庆大学 Trimethyl-silyl polysilsesquioxane particle reinforced type tin-silver-copper composite soldering paste and preparation method thereof
US10162393B2 (en) 2016-01-13 2018-12-25 Seagate Technology Llc Electrical connector with force balancing

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5730851A (en) * 1995-02-24 1998-03-24 International Business Machines Corporation Method of making electronic housings more reliable by preventing formation of metallic whiskers on the sheets used to fabricate them
US5753374A (en) * 1995-11-27 1998-05-19 Dow Corning Corporation Protective electronic coating
US6376769B1 (en) * 1999-05-18 2002-04-23 Amerasia International Technology, Inc. High-density electronic package, and method for making same
US20050013990A1 (en) * 2003-07-10 2005-01-20 Motorola, Inc. Silicone dispensing with a conformal film
US20060104855A1 (en) * 2004-11-15 2006-05-18 Metallic Resources, Inc. Lead-free solder alloy

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6045665B2 (en) * 1980-04-21 1985-10-11 日立化成工業株式会社 Moisture-proof insulation paint composition for mounted circuit boards
JP2738303B2 (en) * 1994-07-15 1998-04-08 株式会社デンソー Manufacturing method of electronic component mounted circuit board
JP2001189109A (en) * 2000-01-05 2001-07-10 Sumitomo Bakelite Co Ltd Resin composition for insulator, and insulator using the same
JP3975329B2 (en) * 2001-12-14 2007-09-12 信越化学工業株式会社 MOUNTING CIRCUIT BOARD PROTECTION COATING AGENT, MOUNTING SURFACE PREVENTION METHOD,
JP2005322659A (en) * 2004-05-06 2005-11-17 Matsushita Electric Ind Co Ltd Wiring board, its manufacturing method and semiconductor device
TW200630447A (en) * 2004-11-19 2006-09-01 Showa Denko Kk Resin cured film for flexible printed wiring board and production process thereof
EP1848762A4 (en) * 2005-02-14 2010-07-21 Hybrid Plastics Inc Porosity control with polyhedral oligomeric silsesquioxanes

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5730851A (en) * 1995-02-24 1998-03-24 International Business Machines Corporation Method of making electronic housings more reliable by preventing formation of metallic whiskers on the sheets used to fabricate them
US5753374A (en) * 1995-11-27 1998-05-19 Dow Corning Corporation Protective electronic coating
US6376769B1 (en) * 1999-05-18 2002-04-23 Amerasia International Technology, Inc. High-density electronic package, and method for making same
US20050013990A1 (en) * 2003-07-10 2005-01-20 Motorola, Inc. Silicone dispensing with a conformal film
US20060104855A1 (en) * 2004-11-15 2006-05-18 Metallic Resources, Inc. Lead-free solder alloy

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2059349A4 *

Also Published As

Publication number Publication date
JP5221539B2 (en) 2013-06-26
TW200831623A (en) 2008-08-01
EP2059349A4 (en) 2010-12-22
EP2059349A2 (en) 2009-05-20
JP2010502011A (en) 2010-01-21
SG176498A1 (en) 2011-12-29
WO2008073159A2 (en) 2008-06-19
KR20090051741A (en) 2009-05-22

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