WO2008062036A3 - Board mounting of microphone transducer - Google Patents

Board mounting of microphone transducer Download PDF

Info

Publication number
WO2008062036A3
WO2008062036A3 PCT/EP2007/062688 EP2007062688W WO2008062036A3 WO 2008062036 A3 WO2008062036 A3 WO 2008062036A3 EP 2007062688 W EP2007062688 W EP 2007062688W WO 2008062036 A3 WO2008062036 A3 WO 2008062036A3
Authority
WO
WIPO (PCT)
Prior art keywords
board mounting
pcb
attached
microphone transducer
microphone
Prior art date
Application number
PCT/EP2007/062688
Other languages
French (fr)
Other versions
WO2008062036A2 (en
Inventor
Pirmin Herman Otto Rombach
Joerg Rehder
Original Assignee
Sonion Mems As
Pirmin Herman Otto Rombach
Joerg Rehder
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sonion Mems As, Pirmin Herman Otto Rombach, Joerg Rehder filed Critical Sonion Mems As
Priority to DE112007002856T priority Critical patent/DE112007002856T5/en
Priority to US12/516,120 priority patent/US8295528B2/en
Publication of WO2008062036A2 publication Critical patent/WO2008062036A2/en
Publication of WO2008062036A3 publication Critical patent/WO2008062036A3/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2811—Enclosures comprising vibrating or resonating arrangements for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/023—Screens for loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]

Abstract

A portable communication device assembly comprising a housing and a PCB provided therein. A microphone is provided at least partly within an aperture in the PCB, which aperture is positioned adjacent to a sound input of the housing. The microphone may be attached to a carrier element also attached to the PCB, and additional electronic components may be attached to the carrier element. Acoustic and/or electromagnetic shielding may be provided.
PCT/EP2007/062688 2006-11-23 2007-11-22 Board mounting of microphone transducer WO2008062036A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE112007002856T DE112007002856T5 (en) 2006-11-23 2007-11-22 PCB mounting of a microphone converter
US12/516,120 US8295528B2 (en) 2006-11-23 2007-11-22 Board mounting of microphone transducer

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DKPA200601546 2006-11-23
DKPA200601546 2006-11-23
US90394007P 2007-02-28 2007-02-28
US60/903,940 2007-02-28

Publications (2)

Publication Number Publication Date
WO2008062036A2 WO2008062036A2 (en) 2008-05-29
WO2008062036A3 true WO2008062036A3 (en) 2008-10-23

Family

ID=39430096

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2007/062688 WO2008062036A2 (en) 2006-11-23 2007-11-22 Board mounting of microphone transducer

Country Status (2)

Country Link
DE (1) DE112007002856T5 (en)
WO (1) WO2008062036A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2094028B8 (en) 2008-02-22 2017-03-29 TDK Corporation Miniature microphone assembly with solder sealing ring

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6018584A (en) * 1996-11-06 2000-01-25 Motorola, Inc. Electronic component assembly for an electronic device and method of assembling the same
US6178249B1 (en) * 1998-06-18 2001-01-23 Nokia Mobile Phones Limited Attachment of a micromechanical microphone
JP2002300684A (en) * 2001-03-30 2002-10-11 Nec Corp Microphone installation structure
JP2003087898A (en) * 2001-09-14 2003-03-20 Nec Corp Condenser microphone
US20040184632A1 (en) * 2003-02-28 2004-09-23 Minervini Anthony D. Acoustic transducer module

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7439616B2 (en) 2000-11-28 2008-10-21 Knowles Electronics, Llc Miniature silicon condenser microphone
US7382048B2 (en) 2003-02-28 2008-06-03 Knowles Electronics, Llc Acoustic transducer module
US20040267621A1 (en) 2003-06-27 2004-12-30 Schuller Robert J. Food product scale-based incentive system
DE602005010129D1 (en) 2004-01-12 2008-11-20 Sonion As Amplifier circuit for capacitive converters
DE602005004271T2 (en) 2005-06-28 2008-12-24 Research In Motion Ltd., Waterloo Communication device with shielded microphone
KR100644730B1 (en) 2005-08-20 2006-11-10 주식회사 비에스이 Silicon based condenser microphone

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6018584A (en) * 1996-11-06 2000-01-25 Motorola, Inc. Electronic component assembly for an electronic device and method of assembling the same
US6178249B1 (en) * 1998-06-18 2001-01-23 Nokia Mobile Phones Limited Attachment of a micromechanical microphone
JP2002300684A (en) * 2001-03-30 2002-10-11 Nec Corp Microphone installation structure
JP2003087898A (en) * 2001-09-14 2003-03-20 Nec Corp Condenser microphone
US20040184632A1 (en) * 2003-02-28 2004-09-23 Minervini Anthony D. Acoustic transducer module

Also Published As

Publication number Publication date
WO2008062036A2 (en) 2008-05-29
DE112007002856T5 (en) 2009-10-29

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