WO2008045375A3 - Methods and apparatus for loading and unloading substrate carriers on moving conveyors using feedback - Google Patents

Methods and apparatus for loading and unloading substrate carriers on moving conveyors using feedback Download PDF

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Publication number
WO2008045375A3
WO2008045375A3 PCT/US2007/021481 US2007021481W WO2008045375A3 WO 2008045375 A3 WO2008045375 A3 WO 2008045375A3 US 2007021481 W US2007021481 W US 2007021481W WO 2008045375 A3 WO2008045375 A3 WO 2008045375A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate carrier
loading
methods
substrate
feedback
Prior art date
Application number
PCT/US2007/021481
Other languages
French (fr)
Other versions
WO2008045375A2 (en
Inventor
Michael R Rice
Eric A Englhardt
Jeffrey C Hudgens
Katwyk Kirk Van
Original Assignee
Applied Materials Inc
Michael R Rice
Eric A Englhardt
Jeffrey C Hudgens
Katwyk Kirk Van
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc, Michael R Rice, Eric A Englhardt, Jeffrey C Hudgens, Katwyk Kirk Van filed Critical Applied Materials Inc
Publication of WO2008045375A2 publication Critical patent/WO2008045375A2/en
Publication of WO2008045375A3 publication Critical patent/WO2008045375A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67733—Overhead conveying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Abstract

The present invention provides systems and methods for loading and unloading substrate carriers onto and off of a transport system. The invention includes a substrate carrier handler adapted to transfer a substrate earner between a docking station and a transport system/ the substrate carrier handler including an end effector adapted to support the substrate carrier; a controller coupled to the substrate carrier handler and operative to control the substrate carrier handler such that the end effector of the substrate carrier handler is operative to selectively engage and disengage the substrate carrier to and from the transport system while the substrate carrier is in motion; and a sensor coupled to the controller and operative to provide a signal to the controller indicative of information about the substrate carrier.
PCT/US2007/021481 2006-10-04 2007-10-04 Methods and apparatus for loading and unloading substrate carriers on moving conveyors using feedback WO2008045375A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US82807006P 2006-10-04 2006-10-04
US60/828,070 2006-10-04

Publications (2)

Publication Number Publication Date
WO2008045375A2 WO2008045375A2 (en) 2008-04-17
WO2008045375A3 true WO2008045375A3 (en) 2008-07-10

Family

ID=39283398

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/021481 WO2008045375A2 (en) 2006-10-04 2007-10-04 Methods and apparatus for loading and unloading substrate carriers on moving conveyors using feedback

Country Status (2)

Country Link
TW (1) TWI358384B (en)
WO (1) WO2008045375A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8348973B2 (en) 2006-09-06 2013-01-08 Covidien Lp Bioactive substance in a barbed suture
US9398943B2 (en) 2009-11-30 2016-07-26 Covidien Lp Ventral hernia repair with barbed suture
US8414612B2 (en) 2010-11-08 2013-04-09 Covidien Lp Multifilament barbed suture
CN103089052B (en) * 2013-02-26 2015-02-25 湖北泉都立体车库设备有限公司 Anti-faulty-operation safety control system of automatic solid parking garbage
CN104635523A (en) * 2013-11-14 2015-05-20 沈阳新松机器人自动化股份有限公司 Non-contact power supply type feeding and discharging system
CN105789091B (en) * 2016-03-16 2020-04-24 沈阳拓荆科技有限公司 Load lock chamber and multi-chamber processing system using the same
CN108166822B (en) * 2017-11-28 2018-12-14 特斯联（北京）科技有限公司 A kind of artificial intelligence robot for vehicle service

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6068668A (en) * 1997-03-31 2000-05-30 Motorola, Inc. Process for forming a semiconductor device
US6214692B1 (en) * 1998-01-13 2001-04-10 Erich Thallner Method and apparatus for the aligned joining of disk-shaped semiconductor substrates
WO2002067298A2 (en) * 2001-01-03 2002-08-29 Applied Materials, Inc. Consecutive deposition system
EP1396874A2 (en) * 2002-08-31 2004-03-10 Applied Materials, Inc. Substrate carrier handler that unloads substrate carriers directly from a moving conveyor
US20050096794A1 (en) * 2003-10-29 2005-05-05 Applied Materials, Inc. Method and apparatus for monitoring the position of a semiconductor processing robot

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6068668A (en) * 1997-03-31 2000-05-30 Motorola, Inc. Process for forming a semiconductor device
US6214692B1 (en) * 1998-01-13 2001-04-10 Erich Thallner Method and apparatus for the aligned joining of disk-shaped semiconductor substrates
WO2002067298A2 (en) * 2001-01-03 2002-08-29 Applied Materials, Inc. Consecutive deposition system
EP1396874A2 (en) * 2002-08-31 2004-03-10 Applied Materials, Inc. Substrate carrier handler that unloads substrate carriers directly from a moving conveyor
US20050096794A1 (en) * 2003-10-29 2005-05-05 Applied Materials, Inc. Method and apparatus for monitoring the position of a semiconductor processing robot

Also Published As

Publication number Publication date
TW200833585A (en) 2008-08-16
TWI358384B (en) 2012-02-21
WO2008045375A2 (en) 2008-04-17

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