WO2008041169A3 - Redundantable robot assembly for workpiece transfer - Google Patents

Redundantable robot assembly for workpiece transfer Download PDF

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Publication number
WO2008041169A3
WO2008041169A3 PCT/IB2007/053970 IB2007053970W WO2008041169A3 WO 2008041169 A3 WO2008041169 A3 WO 2008041169A3 IB 2007053970 W IB2007053970 W IB 2007053970W WO 2008041169 A3 WO2008041169 A3 WO 2008041169A3
Authority
WO
WIPO (PCT)
Prior art keywords
redundantable
assembly
robot assembly
robot
workpiece transfer
Prior art date
Application number
PCT/IB2007/053970
Other languages
French (fr)
Other versions
WO2008041169A2 (en
Inventor
Lutz Rebstock
Original Assignee
Dynamic Micro Systems
Lutz Rebstock
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/881,089 external-priority patent/US9122272B2/en
Priority claimed from US11/881,090 external-priority patent/US8182198B2/en
Application filed by Dynamic Micro Systems, Lutz Rebstock filed Critical Dynamic Micro Systems
Publication of WO2008041169A2 publication Critical patent/WO2008041169A2/en
Publication of WO2008041169A3 publication Critical patent/WO2008041169A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Abstract

A redundantable robotic mechanism is disclosed for improving reliability of transport equipment. The redundantable robot assembly typically comprises independent robots with separate controls, motors, linkage arms, or power, thus providing the capability of operation even if parts of the assembly are not operational or when parts of the assembly are removed for repair. The redundantable robot assembly can be also designed to allow in-situ servicing, e.g. servicing one robot when the other is running. The disclosed redundantable robot assembly provides virtual uninterrupted process flow, and thus greatly increases the yield for the manufacturing facility.
PCT/IB2007/053970 2006-10-06 2007-10-01 Redundantable robot assembly for workpiece transfer WO2008041169A2 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US84999706P 2006-10-06 2006-10-06
US60/849,997 2006-10-06
US11/881,090 2007-07-25
US11/881,089 2007-07-25
US11/881,089 US9122272B2 (en) 2006-10-06 2007-07-25 Redundantable robot assembly for workpiece transfer
US11/881,090 US8182198B2 (en) 2006-10-06 2007-07-25 Redundantable robot assembly for workpiece transfer

Publications (2)

Publication Number Publication Date
WO2008041169A2 WO2008041169A2 (en) 2008-04-10
WO2008041169A3 true WO2008041169A3 (en) 2008-07-10

Family

ID=39268870

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2007/053970 WO2008041169A2 (en) 2006-10-06 2007-10-01 Redundantable robot assembly for workpiece transfer

Country Status (1)

Country Link
WO (1) WO2008041169A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018104779A1 (en) * 2016-12-07 2018-06-14 Abb Schweiz Ag Deployment apparatus having a tether arm for an inspection vehicle

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998002911A1 (en) * 1996-07-15 1998-01-22 Semitool, Inc. Modular semiconductor workpiece processing tool
WO1999018603A1 (en) * 1997-10-08 1999-04-15 Applied Komatsu Technology, Inc. Modular substrate processing system
WO2005048313A2 (en) * 2003-11-10 2005-05-26 Blueshift Technologies, Inc. Methods and systems for handling workpieces in a vacuum-based semiconductor handling system
US20060182539A1 (en) * 1998-11-17 2006-08-17 Tokyo Electron Limited Vacuum process system
US20060182535A1 (en) * 2004-12-22 2006-08-17 Mike Rice Cartesian robot design

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998002911A1 (en) * 1996-07-15 1998-01-22 Semitool, Inc. Modular semiconductor workpiece processing tool
WO1999018603A1 (en) * 1997-10-08 1999-04-15 Applied Komatsu Technology, Inc. Modular substrate processing system
US20060182539A1 (en) * 1998-11-17 2006-08-17 Tokyo Electron Limited Vacuum process system
WO2005048313A2 (en) * 2003-11-10 2005-05-26 Blueshift Technologies, Inc. Methods and systems for handling workpieces in a vacuum-based semiconductor handling system
US20060182535A1 (en) * 2004-12-22 2006-08-17 Mike Rice Cartesian robot design

Also Published As

Publication number Publication date
WO2008041169A2 (en) 2008-04-10

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