WO2008024761A3 - Electrical device having boardless electrical component mounting arrangement - Google Patents
Electrical device having boardless electrical component mounting arrangement Download PDFInfo
- Publication number
- WO2008024761A3 WO2008024761A3 PCT/US2007/076405 US2007076405W WO2008024761A3 WO 2008024761 A3 WO2008024761 A3 WO 2008024761A3 US 2007076405 W US2007076405 W US 2007076405W WO 2008024761 A3 WO2008024761 A3 WO 2008024761A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrical
- boardless
- component mounting
- mounting arrangement
- circuit
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/16—Making multilayered or multicoloured articles
- B29C45/1671—Making multilayered or multicoloured articles with an insert
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/04—Provision of filling media
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2106/00—Interior vehicle lighting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
- H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
- H05K1/187—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE112007001950T DE112007001950T5 (en) | 2006-08-21 | 2007-08-21 | Electrical device with platinum-free mounting arrangement for electrical components |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US83898206P | 2006-08-21 | 2006-08-21 | |
US60/838,982 | 2006-08-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008024761A2 WO2008024761A2 (en) | 2008-02-28 |
WO2008024761A3 true WO2008024761A3 (en) | 2008-07-17 |
Family
ID=39107592
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/076405 WO2008024761A2 (en) | 2006-08-21 | 2007-08-21 | Electrical device having boardless electrical component mounting arrangement |
Country Status (3)
Country | Link |
---|---|
US (2) | US7909482B2 (en) |
DE (1) | DE112007001950T5 (en) |
WO (1) | WO2008024761A2 (en) |
Families Citing this family (41)
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WO2008024761A2 (en) | 2006-08-21 | 2008-02-28 | Innotec Corporation | Electrical device having boardless electrical component mounting arrangement |
US7712933B2 (en) | 2007-03-19 | 2010-05-11 | Interlum, Llc | Light for vehicles |
US8408773B2 (en) | 2007-03-19 | 2013-04-02 | Innotec Corporation | Light for vehicles |
EP2240345B1 (en) * | 2007-12-12 | 2013-09-18 | Innotec, Corp. | Light for vehicles |
WO2009076579A2 (en) | 2007-12-12 | 2009-06-18 | Innotec Corporation | Overmolded circuit board and method |
CN101420007B (en) * | 2008-10-23 | 2010-12-29 | 旭丽电子(广州)有限公司 | Encapsulation construction and method for LED wafer |
DE102009042707A1 (en) * | 2009-09-24 | 2011-04-07 | P.H. Wert-Design E.K. | Lamp e.g. concrete ceiling lamp, has LEDs arranged on printed circuit board within lamp body that is formed by transparent or translucent plastic body, where LEDs are embedded in plastic body and designed as lighting units |
EP2317205A1 (en) * | 2009-10-27 | 2011-05-04 | Liang Meng Plastic Share Co. Ltd. | Housing of LED light source comprising electrical connector |
WO2011067115A1 (en) * | 2009-12-04 | 2011-06-09 | Osram Gesellschaft mit beschränkter Haftung | Led lighting module with co-molded metal contacts |
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JP6064584B2 (en) * | 2012-12-22 | 2017-01-25 | 日亜化学工業株式会社 | Light emitting device and manufacturing method thereof |
US20140208689A1 (en) | 2013-01-25 | 2014-07-31 | Renee Joyal | Hypodermic syringe assist apparatus and method |
US10551011B2 (en) * | 2013-01-25 | 2020-02-04 | Lumileds Llc | Lighting assembly and method for manufacturing a lighting assembly |
US9297675B2 (en) * | 2013-10-04 | 2016-03-29 | Tactotek Oy | Illuminated indicator structures for electronic devices |
CN107003468B (en) * | 2014-12-04 | 2020-10-27 | 交互数字Ce专利控股公司 | Device for transmitting light |
WO2016086394A1 (en) | 2014-12-04 | 2016-06-09 | Thomson Licensing | Device for transporting light |
US10443820B2 (en) | 2014-12-09 | 2019-10-15 | Current Lighting Solutions, Llc | Plastic LED fixture housing with outer frame |
WO2016185096A1 (en) * | 2015-05-19 | 2016-11-24 | Tactotek Oy | Thermoformed plastic cover for electronics and related method of manufacture |
US20170356640A1 (en) | 2016-06-10 | 2017-12-14 | Innotec, Corp. | Illumination assembly including thermal energy management |
JP6645413B2 (en) * | 2016-12-15 | 2020-02-14 | 豊田合成株式会社 | Electronic equipment |
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WO2019083787A2 (en) * | 2017-10-24 | 2019-05-02 | Innotec, Corp. | Plastic injection molding and process |
US10622511B2 (en) | 2017-11-03 | 2020-04-14 | Innotec, Corp. | Illuminated optical device |
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TWM601501U (en) * | 2018-12-21 | 2020-09-11 | 億光電子工業股份有限公司 | Light emitting device |
US10823388B2 (en) * | 2019-03-07 | 2020-11-03 | Current Lighting Solutions, Llc | Pressure equalized lighting subassembly |
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Also Published As
Publication number | Publication date |
---|---|
DE112007001950T5 (en) | 2009-07-02 |
US20110146068A1 (en) | 2011-06-23 |
US8764240B2 (en) | 2014-07-01 |
US7909482B2 (en) | 2011-03-22 |
WO2008024761A2 (en) | 2008-02-28 |
US20080062711A1 (en) | 2008-03-13 |
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