WO2008011329A3 - Method and system for isolated and discretized process sequence integration - Google Patents
Method and system for isolated and discretized process sequence integration Download PDFInfo
- Publication number
- WO2008011329A3 WO2008011329A3 PCT/US2007/073368 US2007073368W WO2008011329A3 WO 2008011329 A3 WO2008011329 A3 WO 2008011329A3 US 2007073368 W US2007073368 W US 2007073368W WO 2008011329 A3 WO2008011329 A3 WO 2008011329A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- modules
- processing
- isolated
- substrate
- process sequence
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009520905A JP5389645B2 (en) | 2006-07-19 | 2007-07-12 | Method and system for integration of sequences of isolation and discretization processes |
EP07840397A EP2044623A4 (en) | 2006-07-19 | 2007-07-12 | Method and system for isolated and discretized process sequence integration |
KR1020097001016A KR101412398B1 (en) | 2006-07-19 | 2007-07-12 | Method and system for isolated and discretized process sequence integration |
CNA2007800265640A CN101490834A (en) | 2006-07-19 | 2007-07-12 | Method and system for isolated and discretized process sequence integration |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US83224806P | 2006-07-19 | 2006-07-19 | |
US60/832,248 | 2006-07-19 | ||
US11/672,473 US8815013B2 (en) | 2006-07-19 | 2007-02-07 | Method and system for isolated and discretized process sequence integration |
US11/672,473 | 2007-02-07 | ||
US11/672,478 | 2007-02-07 | ||
US11/672,478 US7867904B2 (en) | 2006-07-19 | 2007-02-07 | Method and system for isolated and discretized process sequence integration |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2008011329A2 WO2008011329A2 (en) | 2008-01-24 |
WO2008011329A3 true WO2008011329A3 (en) | 2008-03-20 |
Family
ID=38957500
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/073368 WO2008011329A2 (en) | 2006-07-19 | 2007-07-12 | Method and system for isolated and discretized process sequence integration |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2044623A4 (en) |
JP (1) | JP5389645B2 (en) |
KR (1) | KR101412398B1 (en) |
CN (1) | CN101490834A (en) |
WO (1) | WO2008011329A2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102075528B1 (en) * | 2013-05-16 | 2020-03-03 | 삼성디스플레이 주식회사 | Deposition apparatus, method for manufacturing organic light emitting display apparatus, and organic light emitting display apparatus |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4613981A (en) * | 1984-01-24 | 1986-09-23 | Varian Associates, Inc. | Method and apparatus for lithographic rotate and repeat processing |
US6675469B1 (en) * | 1999-08-11 | 2004-01-13 | Tessera, Inc. | Vapor phase connection techniques |
US20050029089A1 (en) * | 1999-01-26 | 2005-02-10 | Symyx Technologies, Inc. | Method and apparatus for creating radial profiles on a substrate |
US20050230765A1 (en) * | 2004-03-31 | 2005-10-20 | Eudyna Devices Inc. | Semiconductor device, mask for impurity implantation, and method of fabricating the semiconductor device |
US20060134347A1 (en) * | 2004-12-20 | 2006-06-22 | Shivkumar Chiruvolu | Dense coating formation by reactive deposition |
US20060134330A1 (en) * | 2004-12-22 | 2006-06-22 | Applied Materials, Inc. | Cluster tool architecture for processing a substrate |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4588167B2 (en) * | 2000-05-12 | 2010-11-24 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
MY141175A (en) * | 2000-09-08 | 2010-03-31 | Semiconductor Energy Lab | Light emitting device, method of manufacturing the same, and thin film forming apparatus |
US8900366B2 (en) * | 2002-04-15 | 2014-12-02 | Samsung Display Co., Ltd. | Apparatus for depositing a multilayer coating on discrete sheets |
JP2004349508A (en) * | 2003-05-22 | 2004-12-09 | Applied Materials Inc | Substrate processing method, mask member set, substrate processing apparatus, element or semiconductor device manufacturing method, and element or semiconductor device manufacturing condition determining method |
KR20060007211A (en) * | 2004-07-19 | 2006-01-24 | 삼성전자주식회사 | Exposure system |
-
2007
- 2007-07-12 WO PCT/US2007/073368 patent/WO2008011329A2/en active Application Filing
- 2007-07-12 KR KR1020097001016A patent/KR101412398B1/en active IP Right Grant
- 2007-07-12 JP JP2009520905A patent/JP5389645B2/en not_active Expired - Fee Related
- 2007-07-12 EP EP07840397A patent/EP2044623A4/en not_active Withdrawn
- 2007-07-12 CN CNA2007800265640A patent/CN101490834A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4613981A (en) * | 1984-01-24 | 1986-09-23 | Varian Associates, Inc. | Method and apparatus for lithographic rotate and repeat processing |
US20050029089A1 (en) * | 1999-01-26 | 2005-02-10 | Symyx Technologies, Inc. | Method and apparatus for creating radial profiles on a substrate |
US6675469B1 (en) * | 1999-08-11 | 2004-01-13 | Tessera, Inc. | Vapor phase connection techniques |
US20050230765A1 (en) * | 2004-03-31 | 2005-10-20 | Eudyna Devices Inc. | Semiconductor device, mask for impurity implantation, and method of fabricating the semiconductor device |
US20060134347A1 (en) * | 2004-12-20 | 2006-06-22 | Shivkumar Chiruvolu | Dense coating formation by reactive deposition |
US20060134330A1 (en) * | 2004-12-22 | 2006-06-22 | Applied Materials, Inc. | Cluster tool architecture for processing a substrate |
Non-Patent Citations (1)
Title |
---|
See also references of EP2044623A4 * |
Also Published As
Publication number | Publication date |
---|---|
EP2044623A2 (en) | 2009-04-08 |
KR20090060261A (en) | 2009-06-11 |
JP2009544173A (en) | 2009-12-10 |
WO2008011329A2 (en) | 2008-01-24 |
CN101490834A (en) | 2009-07-22 |
EP2044623A4 (en) | 2012-10-03 |
KR101412398B1 (en) | 2014-06-25 |
JP5389645B2 (en) | 2014-01-15 |
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