WO2007149475A3 - Method for packaging an optical mems device - Google Patents

Method for packaging an optical mems device Download PDF

Info

Publication number
WO2007149475A3
WO2007149475A3 PCT/US2007/014359 US2007014359W WO2007149475A3 WO 2007149475 A3 WO2007149475 A3 WO 2007149475A3 US 2007014359 W US2007014359 W US 2007014359W WO 2007149475 A3 WO2007149475 A3 WO 2007149475A3
Authority
WO
WIPO (PCT)
Prior art keywords
layer
backplate
transparent substrate
thicker
packaging
Prior art date
Application number
PCT/US2007/014359
Other languages
French (fr)
Other versions
WO2007149475A2 (en
Inventor
Nassim Khonsari
Clarence Chui
Original Assignee
Qualcomm Mems Technologies Inc
Nassim Khonsari
Clarence Chui
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qualcomm Mems Technologies Inc, Nassim Khonsari, Clarence Chui filed Critical Qualcomm Mems Technologies Inc
Priority to EP07809701A priority Critical patent/EP2029473A2/en
Publication of WO2007149475A2 publication Critical patent/WO2007149475A2/en
Publication of WO2007149475A3 publication Critical patent/WO2007149475A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00269—Bonding of solid lids or wafers to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/047—Optical MEMS not provided for in B81B2201/042 - B81B2201/045
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0109—Bonding an individual cap on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0172—Seals
    • B81C2203/019—Seals characterised by the material or arrangement of seals between parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/032—Gluing

Abstract

A microelectromechanical systems device (730) having a transparent substrate (710) joined to a planar backplate (720) with a raised perimeter structure (740a) forming a recessed cavity or cell (780). The raised perimeter structure (740a) is formed by applying a first layer (740a) around the peripheral area of the backplate (720) to form a recessed cell (780). A second layer (740b) is applied over the first layer. The first layer (740a) is thicker than the second layer (740b). The thicker layer (740a) comprises a viscous material. A second layer (740b) is a thinner adhesive layer, and is applied over the thicker layer (740a) to join the backplate (720) to the transparent substrate (710) to encapsulate the microelectromechanical systems device (730) formed on the transparent substrate (710).
PCT/US2007/014359 2006-06-21 2007-06-19 Method for packaging an optical mems device WO2007149475A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP07809701A EP2029473A2 (en) 2006-06-21 2007-06-19 Method for packaging an optical mems device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US81590506P 2006-06-21 2006-06-21
US60/815,905 2006-06-21

Publications (2)

Publication Number Publication Date
WO2007149475A2 WO2007149475A2 (en) 2007-12-27
WO2007149475A3 true WO2007149475A3 (en) 2008-06-05

Family

ID=38834091

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/014359 WO2007149475A2 (en) 2006-06-21 2007-06-19 Method for packaging an optical mems device

Country Status (3)

Country Link
US (1) US7826127B2 (en)
EP (1) EP2029473A2 (en)
WO (1) WO2007149475A2 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9261694B2 (en) 2005-02-23 2016-02-16 Pixtronix, Inc. Display apparatus and methods for manufacture thereof
US8310442B2 (en) 2005-02-23 2012-11-13 Pixtronix, Inc. Circuits for controlling display apparatus
US20070205969A1 (en) 2005-02-23 2007-09-06 Pixtronix, Incorporated Direct-view MEMS display devices and methods for generating images thereon
US8482496B2 (en) 2006-01-06 2013-07-09 Pixtronix, Inc. Circuits for controlling MEMS display apparatus on a transparent substrate
US9229222B2 (en) 2005-02-23 2016-01-05 Pixtronix, Inc. Alignment methods in fluid-filled MEMS displays
US7999994B2 (en) 2005-02-23 2011-08-16 Pixtronix, Inc. Display apparatus and methods for manufacture thereof
US9158106B2 (en) 2005-02-23 2015-10-13 Pixtronix, Inc. Display methods and apparatus
US9082353B2 (en) 2010-01-05 2015-07-14 Pixtronix, Inc. Circuits for controlling display apparatus
US8159428B2 (en) 2005-02-23 2012-04-17 Pixtronix, Inc. Display methods and apparatus
US8519945B2 (en) 2006-01-06 2013-08-27 Pixtronix, Inc. Circuits for controlling display apparatus
US8526096B2 (en) 2006-02-23 2013-09-03 Pixtronix, Inc. Mechanical light modulators with stressed beams
US7449765B2 (en) * 2006-02-27 2008-11-11 Texas Instruments Incorporated Semiconductor device and method of fabrication
KR100833508B1 (en) * 2006-12-07 2008-05-29 한국전자통신연구원 Mems package and package method thereof
US9176318B2 (en) 2007-05-18 2015-11-03 Pixtronix, Inc. Methods for manufacturing fluid-filled MEMS displays
US8169679B2 (en) 2008-10-27 2012-05-01 Pixtronix, Inc. MEMS anchors
US8379392B2 (en) 2009-10-23 2013-02-19 Qualcomm Mems Technologies, Inc. Light-based sealing and device packaging
US9090456B2 (en) * 2009-11-16 2015-07-28 Qualcomm Mems Technologies, Inc. System and method of manufacturing an electromechanical device by printing raised conductive contours
KR101659642B1 (en) 2010-02-02 2016-09-26 픽스트로닉스 인코포레이티드 Circuits for controlling display apparatus
EP2531881A2 (en) 2010-02-02 2012-12-12 Pixtronix Inc. Methods for manufacturing cold seal fluid-filled display apparatus
US9652703B1 (en) 2011-05-24 2017-05-16 Sandia Corporation Tag and seal employing a micromachine artifact
US8742570B2 (en) 2011-09-09 2014-06-03 Qualcomm Mems Technologies, Inc. Backplate interconnect with integrated passives
US9353313B2 (en) 2012-08-09 2016-05-31 Auburn University Microdevices and methods of manufacture
US9134552B2 (en) 2013-03-13 2015-09-15 Pixtronix, Inc. Display apparatus with narrow gap electrostatic actuators
US20160093070A1 (en) * 2014-09-26 2016-03-31 Pixtronix, Inc. Spacers of different sizes within seal to limit moisture ingress
CN111083315B (en) * 2018-10-19 2023-10-27 宁波舜宇光电信息有限公司 No-air-escape hole type photosensitive assembly, camera shooting module and manufacturing method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020000649A1 (en) * 1998-04-17 2002-01-03 Tilmans Hendrikus A.C. Method of fabrication of a microstructure having an internal cavity
EP1640326A2 (en) * 2004-09-27 2006-03-29 Idc, Llc Method and system for providing mems device package with secondary seal

Family Cites Families (121)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3704806A (en) 1971-01-06 1972-12-05 Le T Im Lensoveta Dehumidifying composition and a method for preparing the same
JPS5836030B2 (en) 1972-11-02 1983-08-06 株式会社クラレ Setuchiyakuzaisoseibutsu
US4036360A (en) 1975-11-12 1977-07-19 Graham Magnetics Incorporated Package having dessicant composition
US4074480A (en) 1976-02-12 1978-02-21 Burton Henry W G Kit for converting single-glazed window to double-glazed window
US4431691A (en) 1979-01-29 1984-02-14 Tremco, Incorporated Dimensionally stable sealant and spacer strip and composite structures comprising the same
FR2506026A1 (en) 1981-05-18 1982-11-19 Radant Etudes METHOD AND DEVICE FOR ANALYZING A HYPERFREQUENCY ELECTROMAGNETIC WAVE RADIATION BEAM
JPS5918136A (en) 1982-07-16 1984-01-30 Toyota Central Res & Dev Lab Inc Molded article of coated heat-insulating glass foam
US5172262A (en) 1985-10-30 1992-12-15 Texas Instruments Incorporated Spatial light modulator and method
US5835255A (en) 1986-04-23 1998-11-10 Etalon, Inc. Visible spectrum modulator arrays
US5091983A (en) 1987-06-04 1992-02-25 Walter Lukosz Optical modulation apparatus and measurement method
US4977009A (en) 1987-12-16 1990-12-11 Ford Motor Company Composite polymer/desiccant coatings for IC encapsulation
US4950344A (en) 1988-12-05 1990-08-21 Lauren Manufacturing Company Method of manufacturing multiple-pane sealed glazing units
US4954789A (en) 1989-09-28 1990-09-04 Texas Instruments Incorporated Spatial light modulator
US5381253A (en) 1991-11-14 1995-01-10 Board Of Regents Of University Of Colorado Chiral smectic liquid crystal optical modulators having variable retardation
GB9012099D0 (en) 1990-05-31 1990-07-18 Kodak Ltd Optical article for multicolour imaging
US5216537A (en) 1990-06-29 1993-06-01 Texas Instruments Incorporated Architecture and process for integrating DMD with control circuit substrates
US5018256A (en) 1990-06-29 1991-05-28 Texas Instruments Incorporated Architecture and process for integrating DMD with control circuit substrates
US5099353A (en) 1990-06-29 1992-03-24 Texas Instruments Incorporated Architecture and process for integrating DMD with control circuit substrates
US5304419A (en) 1990-07-06 1994-04-19 Alpha Fry Ltd Moisture and particle getter for enclosures
US5095375A (en) 1991-03-29 1992-03-10 Hughes Aircraft Company Holographic combiner edge seal design and composition
US5244707A (en) 1992-01-10 1993-09-14 Shores A Andrew Enclosure for electronic devices
US5212582A (en) 1992-03-04 1993-05-18 Texas Instruments Incorporated Electrostatically controlled beam steering device and method
FI96450C (en) 1993-01-13 1996-06-25 Vaisala Oy Single-channel gas concentration measurement method and equipment
US5293511A (en) 1993-03-16 1994-03-08 Texas Instruments Incorporated Package for a semiconductor device
US6674562B1 (en) 1994-05-05 2004-01-06 Iridigm Display Corporation Interferometric modulation of radiation
US5559358A (en) 1993-05-25 1996-09-24 Honeywell Inc. Opto-electro-mechanical device or filter, process for making, and sensors made therefrom
AU676299B2 (en) 1993-06-28 1997-03-06 Akira Fujishima Photocatalyst composite and process for producing the same
US20010003487A1 (en) 1996-11-05 2001-06-14 Mark W. Miles Visible spectrum modulator arrays
US7138984B1 (en) 2001-06-05 2006-11-21 Idc, Llc Directly laminated touch sensitive screen
US7123216B1 (en) 1994-05-05 2006-10-17 Idc, Llc Photonic MEMS and structures
US6040937A (en) 1994-05-05 2000-03-21 Etalon, Inc. Interferometric modulation
US6680792B2 (en) 1994-05-05 2004-01-20 Iridigm Display Corporation Interferometric modulation of radiation
US5703710A (en) 1994-09-09 1997-12-30 Deacon Research Method for manipulating optical energy using poled structure
US5553440A (en) 1994-10-20 1996-09-10 Ppg Industries, Inc. Multi-sheet glazing unit and method of making same
US5550373A (en) 1994-12-30 1996-08-27 Honeywell Inc. Fabry-Perot micro filter-detector
US6969635B2 (en) 2000-12-07 2005-11-29 Reflectivity, Inc. Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
US5739945A (en) 1995-09-29 1998-04-14 Tayebati; Parviz Electrically tunable optical filter utilizing a deformable multi-layer mirror
US5851609A (en) 1996-02-27 1998-12-22 Truseal Technologies, Inc. Preformed flexible laminate
US5815141A (en) 1996-04-12 1998-09-29 Elo Touch Systems, Inc. Resistive touchscreen having multiple selectable regions for pressure discrimination
US5939785A (en) 1996-04-12 1999-08-17 Texas Instruments Incorporated Micromechanical device including time-release passivant
EP0802125B1 (en) 1996-04-17 2001-06-27 Mitsubishi Gas Chemical Company, Inc. Package to hold a product under controlled environmental conditions, in particular for a glass item
US7471444B2 (en) * 1996-12-19 2008-12-30 Idc, Llc Interferometric modulation of radiation
GB9724077D0 (en) 1997-11-15 1998-01-14 Dow Corning Sa Insulating glass units
DE19824965A1 (en) 1998-06-04 1999-12-09 Metallgesellschaft Ag Hot melt adhesive for sealing the edge of laminated glass, process for producing the hot melt adhesive and its use
US6872984B1 (en) 1998-07-29 2005-03-29 Silicon Light Machines Corporation Method of sealing a hermetic lid to a semiconductor die at an angle
JP2000058593A (en) 1998-08-03 2000-02-25 Nec Corp Mounting structure of surface elastic wave element and mounting thereof
JP4336427B2 (en) 1999-10-01 2009-09-30 帝人株式会社 Surface protective film and laminate comprising the same
US6452238B1 (en) 1999-10-04 2002-09-17 Texas Instruments Incorporated MEMS wafer level package
WO2003007049A1 (en) 1999-10-05 2003-01-23 Iridigm Display Corporation Photonic mems and structures
US6400009B1 (en) 1999-10-15 2002-06-04 Lucent Technologies Inc. Hermatic firewall for MEMS packaging in flip-chip bonded geometry
US6661084B1 (en) 2000-05-16 2003-12-09 Sandia Corporation Single level microelectronic device package with an integral window
US6384473B1 (en) 2000-05-16 2002-05-07 Sandia Corporation Microelectronic device package with an integral window
US6762868B2 (en) 2000-11-16 2004-07-13 Texas Instruments Incorporated Electro-optical package with drop-in aperture
US6664779B2 (en) 2000-11-16 2003-12-16 Texas Instruments Incorporated Package with environmental control material carrier
WO2002042716A2 (en) 2000-11-27 2002-05-30 Microsensors Inc. Wafer eutectic bonding of mems gyros
US20020075551A1 (en) 2000-11-29 2002-06-20 Onix Microsystems, Inc Enclosure for MEMS apparatus and method of using the same
US20020096421A1 (en) 2000-11-29 2002-07-25 Cohn Michael B. MEMS device with integral packaging
US7307775B2 (en) 2000-12-07 2007-12-11 Texas Instruments Incorporated Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
US6906847B2 (en) 2000-12-07 2005-06-14 Reflectivity, Inc Spatial light modulators with light blocking/absorbing areas
US7123026B2 (en) 2001-01-23 2006-10-17 Nippon Telegraph And Telephone Corporation Surface shape recognition sensor and method of manufacturing the same
US6455927B1 (en) 2001-03-12 2002-09-24 Amkor Technology, Inc. Micromirror device package
KR100387239B1 (en) 2001-04-26 2003-06-12 삼성전자주식회사 MEMS Relay and fabricating method thereof
US6706316B2 (en) 2001-05-08 2004-03-16 Eastman Kodak Company Ultrasonically sealing the cover plate to provide a hermetic enclosure for OLED displays
US6589625B1 (en) 2001-08-01 2003-07-08 Iridigm Display Corporation Hermetic seal and method to create the same
US6778046B2 (en) 2001-09-17 2004-08-17 Magfusion Inc. Latching micro magnetic relay packages and methods of packaging
US6940636B2 (en) 2001-09-20 2005-09-06 Analog Devices, Inc. Optical switching apparatus and method of assembling same
US6590157B2 (en) 2001-09-21 2003-07-08 Eastman Kodak Company Sealing structure for highly moisture-sensitive electronic device element and method for fabrication
US6893574B2 (en) 2001-10-23 2005-05-17 Analog Devices Inc MEMS capping method and apparatus
US6819391B2 (en) 2001-11-30 2004-11-16 Lg. Philips Lcd Co., Ltd. Liquid crystal display panel having dummy column spacer with opened portion
KR100442830B1 (en) 2001-12-04 2004-08-02 삼성전자주식회사 Low temperature hermetic sealing method having a passivation layer
US6776538B2 (en) 2001-12-12 2004-08-17 Axsun Technologies, Inc. MEMS tunable optical filter system with moisture getter for frequency stability
US6936131B2 (en) 2002-01-31 2005-08-30 3M Innovative Properties Company Encapsulation of organic electronic devices using adsorbent loaded adhesives
US6621134B1 (en) 2002-02-07 2003-09-16 Shayne Zurn Vacuum sealed RF/microwave microresonator
US6791660B1 (en) 2002-02-12 2004-09-14 Seiko Epson Corporation Method for manufacturing electrooptical device and apparatus for manufacturing the same, electrooptical device and electronic appliances
US7045459B2 (en) 2002-02-19 2006-05-16 Northrop Grumman Corporation Thin film encapsulation of MEMS devices
US6603182B1 (en) 2002-03-12 2003-08-05 Lucent Technologies Inc. Packaging micromechanical devices
US6838309B1 (en) 2002-03-13 2005-01-04 Amkor Technology, Inc. Flip-chip micromachine package using seal layer
US20030183916A1 (en) 2002-03-27 2003-10-02 John Heck Packaging microelectromechanical systems
US6707351B2 (en) 2002-03-27 2004-03-16 Motorola, Inc. Tunable MEMS resonator and method for tuning
TW569407B (en) 2002-05-17 2004-01-01 Advanced Semiconductor Eng Wafer-level package with bump and method for manufacturing the same
US7034984B2 (en) 2002-06-19 2006-04-25 Miradia Inc. Fabrication of a high fill ratio reflective spatial light modulator with hidden hinge
FR2842380B1 (en) 2002-07-10 2008-04-18 Volubill METHOD AND SYSTEM FOR MANAGING THE SUPPLY TO A TERMINAL OF DATA MANAGED BY AN EXTERNAL NETWORK, AND CORRESPONDING INTERMEDIATE EQUIPMENT
JP2004047387A (en) 2002-07-15 2004-02-12 Fuji Electric Holdings Co Ltd Organic multicolor luminescent display device and its manufacturing method
US20040048027A1 (en) * 2002-09-06 2004-03-11 Hayes Michael W. Honeycomb cores for aerospace applications
US6887733B2 (en) 2002-09-11 2005-05-03 Osram Opto Semiconductors (Malaysia) Sdn. Bhd Method of fabricating electronic devices
US7388631B2 (en) 2002-10-10 2008-06-17 Samsung Electronics, Co., Ltd. Parallax compensating color filter and black mask for display apparatus
US7071594B1 (en) 2002-11-04 2006-07-04 Microvision, Inc. MEMS scanner with dual magnetic and capacitive drive
KR100474455B1 (en) 2002-11-08 2005-03-11 삼성전자주식회사 Method and device for mounting vacumm of micro electro mechanical system at wafer level
JP4342174B2 (en) 2002-12-27 2009-10-14 新光電気工業株式会社 Electronic device and manufacturing method thereof
US20040140557A1 (en) 2003-01-21 2004-07-22 United Test & Assembly Center Limited Wl-bga for MEMS/MOEMS devices
TW591778B (en) 2003-03-18 2004-06-11 Advanced Semiconductor Eng Package structure for a microsystem
US7015885B2 (en) 2003-03-22 2006-03-21 Active Optical Networks, Inc. MEMS devices monolithically integrated with drive and control circuitry
WO2005004544A1 (en) 2003-07-07 2005-01-13 Ifire Technology Corp. Seal and sealing process for electroluminescent displays
TWI251712B (en) 2003-08-15 2006-03-21 Prime View Int Corp Ltd Interference display plate
TWI305599B (en) 2003-08-15 2009-01-21 Qualcomm Mems Technologies Inc Interference display panel and method thereof
TW593127B (en) 2003-08-18 2004-06-21 Prime View Int Co Ltd Interference display plate and manufacturing method thereof
JP3979982B2 (en) 2003-08-29 2007-09-19 シャープ株式会社 Interferometric modulator and display device
TWI232333B (en) 2003-09-03 2005-05-11 Prime View Int Co Ltd Display unit using interferometric modulation and manufacturing method thereof
US20050093134A1 (en) 2003-10-30 2005-05-05 Terry Tarn Device packages with low stress assembly process
US7012726B1 (en) 2003-11-03 2006-03-14 Idc, Llc MEMS devices with unreleased thin film components
US7142346B2 (en) 2003-12-09 2006-11-28 Idc, Llc System and method for addressing a MEMS display
US7119945B2 (en) 2004-03-03 2006-10-10 Idc, Llc Altering temporal response of microelectromechanical elements
US7060895B2 (en) 2004-05-04 2006-06-13 Idc, Llc Modifying the electro-mechanical behavior of devices
US7164520B2 (en) 2004-05-12 2007-01-16 Idc, Llc Packaging for an interferometric modulator
US20050253283A1 (en) 2004-05-13 2005-11-17 Dcamp Jon B Getter deposition for vacuum packaging
US7126741B2 (en) 2004-08-12 2006-10-24 Hewlett-Packard Development Company, L.P. Light modulator assembly
US7692839B2 (en) 2004-09-27 2010-04-06 Qualcomm Mems Technologies, Inc. System and method of providing MEMS device with anti-stiction coating
US7136213B2 (en) 2004-09-27 2006-11-14 Idc, Llc Interferometric modulators having charge persistence
US8124434B2 (en) 2004-09-27 2012-02-28 Qualcomm Mems Technologies, Inc. Method and system for packaging a display
US7327510B2 (en) 2004-09-27 2008-02-05 Idc, Llc Process for modifying offset voltage characteristics of an interferometric modulator
US20060077126A1 (en) 2004-09-27 2006-04-13 Manish Kothari Apparatus and method for arranging devices into an interconnected array
US7259449B2 (en) 2004-09-27 2007-08-21 Idc, Llc Method and system for sealing a substrate
US20060076634A1 (en) 2004-09-27 2006-04-13 Lauren Palmateer Method and system for packaging MEMS devices with incorporated getter
US7184202B2 (en) 2004-09-27 2007-02-27 Idc, Llc Method and system for packaging a MEMS device
US7130104B2 (en) 2004-09-27 2006-10-31 Idc, Llc Methods and devices for inhibiting tilting of a mirror in an interferometric modulator
US7321456B2 (en) 2004-09-27 2008-01-22 Idc, Llc Method and device for corner interferometric modulation
US7701631B2 (en) 2004-09-27 2010-04-20 Qualcomm Mems Technologies, Inc. Device having patterned spacers for backplates and method of making the same
US7358106B2 (en) 2005-03-03 2008-04-15 Stellar Micro Devices Hermetic MEMS package and method of manufacture
US7733553B2 (en) 2005-09-21 2010-06-08 Hewlett-Packard Development Company, L.P. Light modulator with tunable optical state
US7561334B2 (en) 2005-12-20 2009-07-14 Qualcomm Mems Technologies, Inc. Method and apparatus for reducing back-glass deflection in an interferometric modulator display device
EP1979268A2 (en) 2006-04-13 2008-10-15 Qualcomm Mems Technologies, Inc. Packaging a mems device using a frame

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020000649A1 (en) * 1998-04-17 2002-01-03 Tilmans Hendrikus A.C. Method of fabrication of a microstructure having an internal cavity
EP1640326A2 (en) * 2004-09-27 2006-03-29 Idc, Llc Method and system for providing mems device package with secondary seal

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
HARRIE A C TILMANS ET AL: "The Indent Reflow Sealing (IRS) Technique-A Method for the Fabrication of Sealed Cavitiesfor MEMS Devices", JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, IEEE SERVICE CENTER, PISCATAWAY, NJ, US, vol. 9, no. 2, June 2000 (2000-06-01), XP011034567, ISSN: 1057-7157 *

Also Published As

Publication number Publication date
US20070297037A1 (en) 2007-12-27
WO2007149475A2 (en) 2007-12-27
US7826127B2 (en) 2010-11-02
EP2029473A2 (en) 2009-03-04

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