WO2007149113A3 - Friction reducing aid for cmp - Google Patents

Friction reducing aid for cmp Download PDF

Info

Publication number
WO2007149113A3
WO2007149113A3 PCT/US2006/041420 US2006041420W WO2007149113A3 WO 2007149113 A3 WO2007149113 A3 WO 2007149113A3 US 2006041420 W US2006041420 W US 2006041420W WO 2007149113 A3 WO2007149113 A3 WO 2007149113A3
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
cmp
friction reducing
provides
reducing aid
Prior art date
Application number
PCT/US2006/041420
Other languages
French (fr)
Other versions
WO2007149113A2 (en
WO2007149113A9 (en
Inventor
Kevin J Moeggenborg
Phillip W Carter
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Priority to JP2008542318A priority Critical patent/JP2009516928A/en
Publication of WO2007149113A2 publication Critical patent/WO2007149113A2/en
Publication of WO2007149113A9 publication Critical patent/WO2007149113A9/en
Publication of WO2007149113A3 publication Critical patent/WO2007149113A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/0056—Control means for lapping machines or devices taking regard of the pH-value of lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Abstract

The invention provides a chemical-mechanical polishing System for polishing a substrate comprising a polishing component, a water-soluble silicate compound, an oxidizing agent, and water, wherein the pH of the polishing System is 8 to 12. The invention further provides a method of chemically-mechanically polishing a substrate with the aforementioned polishing System. The polishing System provides for reduced friction during polishing of substrates.
PCT/US2006/041420 2005-11-22 2006-10-24 Friction reducing aid for cmp WO2007149113A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008542318A JP2009516928A (en) 2005-11-22 2006-10-24 Friction reduction aid for CMP

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/287,039 2005-11-22
US11/287,039 US20070117497A1 (en) 2005-11-22 2005-11-22 Friction reducing aid for CMP

Publications (3)

Publication Number Publication Date
WO2007149113A2 WO2007149113A2 (en) 2007-12-27
WO2007149113A9 WO2007149113A9 (en) 2008-02-28
WO2007149113A3 true WO2007149113A3 (en) 2008-04-10

Family

ID=38054171

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/041420 WO2007149113A2 (en) 2005-11-22 2006-10-24 Friction reducing aid for cmp

Country Status (6)

Country Link
US (1) US20070117497A1 (en)
JP (1) JP2009516928A (en)
KR (1) KR20080070675A (en)
CN (1) CN101313388A (en)
TW (1) TWI311091B (en)
WO (1) WO2007149113A2 (en)

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EP2634158B1 (en) * 2011-05-24 2016-08-10 Rohm and Haas Company Improved quality multi-spectral zinc sulfide
CN104145324B (en) * 2011-12-28 2017-12-22 恩特格里斯公司 Composition and method for selective etch titanium nitride
CN102775916B (en) * 2012-07-16 2015-01-07 芜湖海森材料科技有限公司 Polishing composition for improving surface quality of sapphire
US9259818B2 (en) * 2012-11-06 2016-02-16 Sinmat, Inc. Smooth diamond surfaces and CMP method for forming
JP6007094B2 (en) * 2012-12-18 2016-10-12 花王株式会社 Polishing liquid composition for sapphire plate
KR20150103169A (en) * 2013-01-04 2015-09-09 가부시키가이샤 후지미인코퍼레이티드 Method for polishing alloy material and method for manufacturing alloy material
SG11201506102TA (en) * 2013-02-28 2015-09-29 Fujimi Inc Polishing slurry for cobalt removal
US9633831B2 (en) * 2013-08-26 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition for polishing a sapphire surface and methods of using same
CN103589344B (en) * 2013-11-14 2015-06-10 上海新安纳电子科技有限公司 Method for preparing alumina polishing solution
WO2016043089A1 (en) * 2014-09-16 2016-03-24 山口精研工業株式会社 Polishing agent composition for sapphire substrate
KR102447178B1 (en) 2015-09-01 2022-09-26 삼성전자주식회사 Methods of manufacturing semiconductor devices
TWI650392B (en) * 2016-02-16 2019-02-11 美商卡博特微電子公司 Method for polishing III to V materials
US10253216B2 (en) * 2016-07-01 2019-04-09 Versum Materials Us, Llc Additives for barrier chemical mechanical planarization
DE102017110198A1 (en) * 2017-05-11 2018-11-15 Walter Maschinenbau Gmbh Grinding and / or EDM machine and method for measuring and / or referencing the machine
KR102431416B1 (en) 2017-11-15 2022-08-12 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 Compositions for performing material removal operations and methods for forming same
CN110358454A (en) * 2019-07-20 2019-10-22 大连理工大学 A kind of general chemistry machine polishing liquor
EP3916061B1 (en) 2019-10-03 2023-07-05 Nissan Chemical Corporation Cation-containing polishing composition for eliminating protrusions at periphery of laser mark
US11879094B2 (en) 2022-06-03 2024-01-23 Halliburton Energy Services, Inc. Enhancing friction reduction and protection of wellbore equipment during hydraulic fracturing

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JPH11140427A (en) * 1997-11-13 1999-05-25 Kobe Steel Ltd Polishing liquid and polishing
US6276996B1 (en) * 1998-11-10 2001-08-21 Micron Technology, Inc. Copper chemical-mechanical polishing process using a fixed abrasive polishing pad and a copper layer chemical-mechanical polishing solution specifically adapted for chemical-mechanical polishing with a fixed abrasive pad
US6602117B1 (en) * 2000-08-30 2003-08-05 Micron Technology, Inc. Slurry for use with fixed-abrasive polishing pads in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods

Also Published As

Publication number Publication date
US20070117497A1 (en) 2007-05-24
TW200734117A (en) 2007-09-16
TWI311091B (en) 2009-06-21
CN101313388A (en) 2008-11-26
WO2007149113A2 (en) 2007-12-27
KR20080070675A (en) 2008-07-30
WO2007149113A9 (en) 2008-02-28
JP2009516928A (en) 2009-04-23

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