WO2007129838A1 - Substrate pedestal and substrate transfer equipment and substrate processing system and method using the same - Google Patents

Substrate pedestal and substrate transfer equipment and substrate processing system and method using the same Download PDF

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Publication number
WO2007129838A1
WO2007129838A1 PCT/KR2007/002203 KR2007002203W WO2007129838A1 WO 2007129838 A1 WO2007129838 A1 WO 2007129838A1 KR 2007002203 W KR2007002203 W KR 2007002203W WO 2007129838 A1 WO2007129838 A1 WO 2007129838A1
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WO
WIPO (PCT)
Prior art keywords
substrate
substrates
process chamber
supporting table
substrate transferring
Prior art date
Application number
PCT/KR2007/002203
Other languages
French (fr)
Inventor
Soon-Im Wi
Original Assignee
New Power Plasma Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by New Power Plasma Co., Ltd. filed Critical New Power Plasma Co., Ltd.
Publication of WO2007129838A1 publication Critical patent/WO2007129838A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces

Definitions

  • the present invention relates to a substrate supporting table, a substrate transferring apparatus, and a substrate processing system using the same, and more particularly, to a substrate supporting table and a substrate transferring apparatus for continuously loading/unloading a plurality of substrates in and from a process chamber to reduce time spent on transferring the substrates and to improve productivity, and a substrate processing system using the same.
  • Background Art
  • the cluster system refers to a multi-chamber type substrate processing system including a transfer robot (or a handler) and a plurality of substrate processing modules provided around the transfer robot.
  • the cluster system includes a transfer chamber and the transfer robot provided in the transfer chamber to be freely rotatable. Process chambers for performing processes of processing substrates are mounted to the sides of the transfer chamber. Such a cluster system simultaneously processes a plurality of substrates or continuously performs various processes to increase an amount of processing substrates. In order to increase the amount of processing substrates, a plurality of substrates are simultaneously processed in a single process chamber to increase the amount of processing substrates per unit time.
  • a conventional cluster system includes a hexagonal transfer chamber (basically, including four process chambers and two load lock chambers)
  • the width of the entire cluster system that is important for the area of the cluster system and the arrangement of the cluster system in a manufacturing line increases more than a desired width and the scale of a vacuum system required for maintaining the transfer chamber in a vacuum state increases, so that costs for the apparatus and installation increases.
  • the area of the transfer chamber more increases as the number of provided process chambers increases.
  • the present invention is directed to provide a substrate supporting table and a substrate transferring apparatus having a structure in which substrates are effectively processed and a substrate processing system using the same.
  • the present invention also provides a substrate supporting table and a substrate transferring apparatus in which time spent on transferring substrates is reduced to improve productivity and a substrate processing system using the same.
  • the present invention also provides a substrate supporting table and a substrate transferring apparatus having a small system area and a substrate processing system using the same.
  • the present invention also provides a substrate supporting table and a substrate transferring apparatus having a structure in which time spent on processes is reduced and a substrate processing system using the same.
  • the present invention also provides a substrate supporting table and a substrate transferring apparatus having a structure in which the availability of a process chamber is improved and a substrate processing system using the same. [13] The present invention also provides a substrate supporting table and a substrate transferring apparatus configured to remarkably reduce the system area and the system width and a substrate processing system using the same. [14] The present invention also provides a substrate supporting table and a substrate transferring apparatus in which an unnecessary vacuum area is reduced to minimize apparatus cost and installation cost and a substrate processing system using the same.
  • a substrate transferring apparatus for a process chamber including at least one substrate supporting table.
  • the substrate transferring apparatus comprises a first substrate transferring device including at least one end effector to transfer substrates and transferring the substrates in the process chamber.
  • the first substrate transferring device may comprise at least one swivel plate arm having the end effector; a driving unit supplying a driving force to swivel, elevate and lower the swivel plate arm; and at least one spindle, connected to the driving unit, to which the at least one swivel plate arm is mounted.
  • the end effector of the first substrate transferring device may comprise: a horseshoe-shaped rim; a support formed in the rim to support the substrate; and an entering path formed to prevent an end effector of an object to perform the exchange of the substrates with the exterior through a substrate entrance formed in the process chamber from being interfered.
  • the first substrate transferring device may transfer the substrate transferred from the exterior of the process chamber to the substrate supporting table, and may put the substrates on the substrate supporting table when the end effector is inserted into the substrate supporting table.
  • the first substrate transferring device may let the end effector remain to be inserted into the substrate supporting table while the substrates are processed in the process chamber, and may lift the substrates from the substrate supporting table to transfer when the process of the substrates is finished and the end effector exits from the substrate supporting table.
  • the first substrate transferring device may comprise at least two different spindles to be independently rotated; and at least two different swivel plate arms respectively mounted to the different spindles.
  • the first substrate transferring device may comprise at least one driving unit to supply a driving force to the two different spindles.
  • the substrate transferring apparatus may further comprise a second substrate transferring device to exchange the substrates with the first substrate transferring device in the exterior of the process chamber through a substrate entrance formed in the process chamber.
  • the second substrate transferring device may comprise at least one linear plate arm having at least one end effector and linearly reciprocating; and at least one linear driving unit to linearly reciprocate the at least one linear plate arm.
  • the second substrate transferring device may comprise a driving unit to supply a rotational force; at least one spindle connected to the driving unit; and at least one swivel plate arm including at least one swivel plate arm which is mounted to the spindle to swivel, has at least one end effector, exchanges the substrates with the first substrate transferring device.
  • a substrate processing system comprises a process chamber including at least one substrate supporting table; and a first substrate transferring device to transfer substrates between a first substrate entrance formed in the process chamber and the substrate supporting table within the process chamber.
  • the substrate processing system may further comprise a transfer chamber connected to the first substrate entrance and having a second substrate entrance; and a second substrate transferring device installed in the transfer chamber to transfer the substrates between the second substrate entrance and the first substrate entrance.
  • the substrate processing system may further comprise a load rock chamber connected to the second substrate entrance, and including an atmospheric pressure transfer robot to transfer the substrates between an index and the transfer chamber.
  • the substrate processing system may further comprise a cooling chamber to cool the processed substrates discharged through the second substrate entrance, and the atmospheric pressure transfer robot transfers the processed substrates discharged through the second substrate entrance to the index via the cooling chamber.
  • a substrate supporting table installed in a process chamber to support substrates.
  • the substrate supporting table comprises a body; and at least one groove formed in the outer circumference of the body to prevent a substrate support of an end effector from being locked to the substrate supporting table when the end effector of a substrate transferring apparatus is inserted into the substrate supporting table.
  • the substrate processing system rapidly exchanges a plurality of substrates before and after being processed continuously or simultaneously, so that processing rate of the system can be increased and entire productivity of the substrates can be increased.
  • the substrate transferring apparatus capable of simultaneously performing the loading and unloading of the substrates is provided so that the process chamber for processing a plurality of substrates can be very easily implemented.
  • the transfer time of the substrates is reduced to improve productivity.
  • the system area and the system width of the substrate processing system are remarkably reduced so that apparatus cost and installation cost can be minimized.
  • FIG. 1 is a view illustrating the whole structure of a substrate processing system according to an embodiment of the present invention
  • FIG. 2 is a plan sectional view illustrating the substrate processing system in FIG. l;
  • FIG. 3 is a perspective view illustrating a first substrate transferring apparatus installed in a process chamber;
  • FIG. 4 is a view illustrating the structure of a swivel plate arm of the first substrate transferring apparatus and the transfer of substrates;
  • FIG. 5 is a view illustrating the swivel plate arm is inserted into a substrate supporting table;
  • FIG. 6 is a view illustrating grooves of the substrate supporting table and an end effector inserted into the grooves;
  • FIG. 7 is a view illustrating the first substrate transferring apparatus having an upper driving unit and a lower driving unit;
  • FIG. 8 is a view illustrating the first substrate transferring apparatus having a driving unit divided into side units; [40] FIG.
  • FIG. 9 is a view illustrating the transfer of substrates to the process chamber through a transfer chamber;
  • FIG. 10 is a perspective view illustrating a second substrate transferring apparatus installed in the transfer chamber;
  • FIG. 11 is a plan sectional view illustrating a second substrate transferring apparatus according to another embodiment of the present invention, installed in the transfer chamber;
  • FIG. 12 is a view illustrating a mechanism of transferring substrates between an atmospheric pressure transfer robot and the second substrate transferring apparatus in
  • the present invention provides more effective substrate exchange to a substrate processing system capable of processing a plurality of substrates to improve productivity. Moreover, based on the effective exchange of the substrates, the present invention provides a substrate processing system capable of simultaneously processing more quantity of the substrates.
  • FIG. 1 is a view illustrating the whole structure of a substrate processing system according to an embodiment of the present invention
  • FIG. 2 is a plan sectional view illustrating the substrate processing system in FIG. 1.
  • the substrate processing system according to an embodiment of the present invention includes a process chamber 500 in which a plasma source 700 is installed in the rear side, and a transfer chamber 400 installed in front of the process chamber 500.
  • An index 100 in which a carrier 110 is mounted is installed in front of the substrate processing system and a load rock chamber 200 is disposed between the index 100 and the transfer chamber 400.
  • the index 100 is referred to as an equipment front end module (hereinafter, referred to as EFEM') and is referred to as including the load lock chamber on occasion.
  • the transfer chamber 400 may include a cooling chamber 300 for cooling the processed substrates. Otherwise, if the transfer chamber 400 functions the cooling of the processed substrates, the cooling chamber 300 may be omitted. In a case of requiring a preheat of the substrates to be transferred to the process chamber, a preheat chamber may be provided. The pre-heat chamber may be omitted when the cooling chamber 300 or the transfer chamber 400 functions the preheat function.
  • a first substrate entrance 510 is formed between the transfer chamber 400 and the first process chamber 500, and a second substrate entrance 410 is formed between the transfer chamber 400 and the load rock chamber 200.
  • the first and second substrate entrances 510 and 410 are opened and closed by slit valves (not shown).
  • the load lock chamber 200 includes an atmospheric pressure transfer robot 210 operated under the atmospheric pressure.
  • the atmospheric pressure transfer robot 210 transfers the substrates between the transfer chamber 400 and the index 100, and the transfer chamber 400 and the cooling chamber, and rotates, ascends and descends.
  • the atmospheric pressure transfer robot 210 can transfer four substrates W from the carriers 110 to the transfer chamber 400 at once.
  • the atmospheric pressure transfer robot 210 may be implemented by a single-armed robot with at least four end effectors 212.
  • the atmospheric pressure transfer robot 210 may be implemented by a double-armed robot 210a with respectively total eight end effectors 212a and 212b such that four substrates before being processed and four substrates after being processed can be exchanged simultaneously.
  • Various robots used for normal semiconductor manufacturing processes as well as processes involved with the single-armed robot or the double-armed robot according to the embodiments of the present invention may be used as the atmospheric pressure transfer robot 210 or 210a.
  • the process chamber 500 includes a plasma source 700 as vacuum chambers to perform a predetermined plasma processing process.
  • the process chamber 500 may be configured to perform various substrate processing operations.
  • the process chamber 500 may be an ashing chamber to remove photoresist using plasma, a chemical vapor deposition (CVD) chamber to depose insulating layers, an etch chamber to etch apertures or openings in the insulating layers in order to form interconnection structures, a physical vapor deposition (PVD) chamber to depose barrier layers, or a PVD chamber to deposit metal layers.
  • CVD chemical vapor deposition
  • PVD physical vapor deposition
  • the substrates W processed by the substrate processing system according to the embodiment of the present invention are typically wafer substrates for manufacturing semiconductor circuits or glass substrates for manufacturing a liquid crystal display (LCD).
  • a plurality of processing systems may be required in order to perform all of the processes required for completely manufacturing an integrated circuit or a chip other than the substrate processing system according to the embodiment of the present invention.
  • a common structure or structures that can be understood by those skilled in the art are omitted.
  • FIG. 3 is a perspective view illustrating the first substrate transferring apparatus 800 installed in a transfer chamber.
  • the substrate transferring apparatus 800 includes at least one swivel plate arm 810 (in this embodiment, four swivel plate arms 810) having an end effector 812.
  • the number of the swivel plate arms 810 is equal to the number of the substrate supporting tables 520 provided in the process chamber 500, at least one swivel plate arm 810 may be provided.
  • the swivel plate arm 810 is mounted to a single spindle 830 to swivel, ascend, and descend.
  • the spindle 830 is connected to a driving unit 820.
  • the driving unit 820 supplies a driving force for the swivel, the ascending, and the descending of the swivel plate arm 810.
  • the driving unit 820 includes an electric motor to generate the driving force and a gear assembly to transmit the generated driving force to the spindle 830 such that the plurality of swivel plate arms 810 perform desired operations.
  • FIG. 4 is a view illustrating the structure of the end effector of the swivel plate arm.
  • the swivel plate arm 810 includes a plate arm 811 connected to the spindle 830 and the end effector 812 provided at the end thereof.
  • the end effector 812 has a horseshoe- shape and includes supports 813 to support the substrate. The arrangement and number of the supports 813 are provided to securely support the substrates.
  • FIG. 5 is a view illustrating the swivel plate arm inserted into a substrate supporting table
  • FIG. 6 is a view illustrating a groove of the substrate supporting table and an end effector inserted into the groove.
  • the four swivel plate arms 810 of the first substrate transferring apparatus transfers the substrates from the exterior of the process chamber 500 to the substrate supporting tables 520, and puts the substrates on the substrate supporting tables 520 while the end effectors 812 are inserted into the substrate supporting tables 520.
  • each of the substrate supporting tables 520 has at least one groove 515 formed in the outer circumference of a body of the substrate supporting table 520.
  • the number of the grooves 515 may be provided appropriately.
  • the first substrate transferring apparatus 800 lets the end effectors 812 remain to be inserted into the substrate supporting tables 520 while the substrates are processed in the process chamber 500.
  • the first substrate transferring apparatus 800 is positioned lower than the substrates W placed on the upper sides of the substrate supporting tables 520 to prevent the substrates from being improperly influenced during the process of the substrates.
  • the end effectors 812 exit from the substrate supporting tables 520 and the substrates W are lifted up from the substrate supporting tables 520 to be transferred.
  • FIG. 7 is a view illustrating the first substrate transferring apparatus having an upper driving unit and a lower driving unit
  • FIG. 8 is a view illustrating the first substrate transferring apparatus having a driving unit divided into side units.
  • the first substrate transferring apparatus 800 may include two spindles 830a and 830b, which are respectively disposed in the upper and lower sides or in the right and left sides.
  • the two spindles 83a and 830b may respectively include two swivel plate arms 810.
  • two driving units 820a and 820b may be provided. Otherwise, a proper gear assembly and a transmission may be used to constitute a single driving unit. Additionally, the number and arrangements of the spindles and the driving unit may be variously modified.
  • FIG. 9 is a view illustrating the transfer of substrates to the process chamber through the transfer chamber and
  • FIG. 10 is a perspective view illustrating a second substrate transferring apparatus installed in the transfer chamber.
  • the transfer chamber 400 further includes a second substrate transferring apparatus 600 to exchange the substrates with the first substrate transferring apparatus 800 in the exterior of the process chamber 500 through the first substrate entrance 510.
  • the second substrate transferring apparatus 600 includes at least one linear plate arm 610 having at least one end effector 611 to reciprocate.
  • the linear plate arm 610 includes a loading arm 610a provided in the upper side and an unloading arm 610b provided in the lower side.
  • the linear plate arm 610 is connected to a linear driving unit 620 to linearly reciprocate.
  • the linear driving unit 620 may include a loading driving unit 620a and an unloading driving unit 620b.
  • the linear driving unit 620 is installed to the outer side of the transfer chamber 400 and is connected to the linear plate arm 610 through a groove 420 formed in the side wall of the transfer chamber 400.
  • the exchange of the substrates before and after being processed between the transfer chamber 400 and the process chamber 500 is performed by the first and second substrate transferring apparatuses 800 and 600.
  • the transfer chamber 400 is switched to the same vacuum state as the process chamber 500 in a state where the second substrate entrance 410 is closed, and continuously the substrate are exchanged when the first substrate entrance 510 is opened.
  • the first substrate transferring apparatus 800 takes the substrates from the substrate supporting tables 520 and is arranged in the first substrate entrance 510.
  • the unloading arm 610b of the second substrate transferring apparatus 600 receives the processed substrates and exits from the first substrate transferring apparatus 800 as linearly reciprocating.
  • the spindle 830 of the first substrate transferring apparatus 800 ascends and stands at the loading position.
  • the loading arm 610a of the second substrate transferring apparatus 600 linearly reciprocates and transfers the substrates before being processed.
  • the first substrate entrance 510 is closed and the first substrate transferring apparatus 800, as described above, transfers the substrates to the substrate supporting tables 520.
  • the exchange of the substrates between the transfer chamber 400 and the process chamber 500 is finished, the exchange of the substrates between the transfer chamber 400 and the load rock chamber 200 is carried out.
  • the transfer chamber 400 is switched from the vacuum state to the atmospheric pressure state, and the atmospheric pressure transfer robot 210 in the load rock chamber 200 performs the exchange of the substrates before and after being processed when the second substrate entrance 410 is opened.
  • the single-armed atmospheric pressure transfer robot 210 is employed in this embodiment of the present invention, as illustrated in FIG. 13, when the double-armed atmospheric pressure transfer robot 210 is employed, the exchange of the substrates can more rapidly performed.
  • FIG. 11 is a plan sectional view illustrating a second substrate transferring apparatus according to another embodiment of the present invention, installed in the transfer chamber
  • FIG. 12 is a view illustrating a mechanism of transferring substrates between the atmospheric pressure transfer robot and the second substrate transferring apparatus in FIG. 11.
  • the second substrate transferring apparatus 900 according to another embodiment of the present invention, installed in the transfer chamber 400, includes first and second substrate transferring units 900a and 900b symmetrically installed by interposing the second substrate entrance 510.
  • Each of the first and second substrate transferring units 900a and 900b includes a driving unit 920 to supply a rotational force, a spindle 930 connected to the driving unit 920, and a swivel plate arm 910 connected to the spindle 930.
  • the swivel plate arms respectively include at least one end effector 912 (four end effectors in this embodiment).
  • the four end effectors 912 are mounted to end of a plate arm 911 and the other end of the plate arm 911 is connected to the spindle 930.
  • the four end effectors 912 include stepped entering paths 914 such that the end effectors 212 of the atmospheric pressure transfer robot 210 can enter without interference.
  • the loading/unloading of the substrates are performed by the first and second substrate transferring units 900a and 900b in this embodiment, it is possible that only any one of the first and second substrate transferring units 900a and 900b sequentially performs the loading/unloading of the substrates. Otherwise, a modification that eight end effectors are mounted to a single plate arm is possible.
  • FIG. 14 is a view illustrating an example in which a plurality of substrate supporting tables are arranged in the process chamber in a radial configuration and the first substrate transferring apparatus includes a plurality of swivel plate arms. As illustrated in FIG. 14, the number of the substrate supporting tables 520 provided in the process chamber 500 is increased to 9 and the number of the swivel plate arms 810 of the first substrate transferring apparatus 800 increases to 9 to correspond to the number of the substrate supporting tables 520. [70] The invention has been described using preferred exemplary embodiments.
  • the substrate processing system rapidly exchanges a plurality of substrates before and after being processed continuously or simultaneously, so that processing rate of the system can be increased and entire productivity of the substrates can be increased.
  • the substrate transferring apparatus capable of simultaneously performing the loading and unloading of the substrates is provided so that the process chamber for processing a plurality of substrates can be very easily implemented.
  • the transfer time of the substrates is reduced to improve productivity.
  • the system area and the system width of the substrate processing system are remarkably reduced so that apparatus cost and installation cost can be minimized.

Abstract

There are provided a substrate supporting table, a substrate transferring apparatus, and a substrate processing system using the same. The system includes a process chamber including at least one substrate supporting table, and a first substrate transferring device to transfer substrates between a first substrate entrance formed in the process chamber and the substrate supporting table within the process chamber. According to the substrate processing system, since a plurality of substrates before and after being processed are rapidly exchanged simultaneously and continuously, processing rate of the system can be increased and overall productivity of substrates can be also increased.

Description

Description
SUBSTRATE PEDESTAL AND SUBSTRATE TRANSFER EQUIPMENT AND SUBSTRATE PROCESSING SYSTEM AND
METHOD USING THE SAME
Technical Field
[1] The present invention relates to a substrate supporting table, a substrate transferring apparatus, and a substrate processing system using the same, and more particularly, to a substrate supporting table and a substrate transferring apparatus for continuously loading/unloading a plurality of substrates in and from a process chamber to reduce time spent on transferring the substrates and to improve productivity, and a substrate processing system using the same. Background Art
[2] Recently, a cluster system capable of simultaneously process a plurality of substrates is commonly employed in substrate processing systems for manufacturing liquid crystal displays, plasma panel displays, and semiconductor devices.
[3] In general, the cluster system refers to a multi-chamber type substrate processing system including a transfer robot (or a handler) and a plurality of substrate processing modules provided around the transfer robot.
[4] The cluster system includes a transfer chamber and the transfer robot provided in the transfer chamber to be freely rotatable. Process chambers for performing processes of processing substrates are mounted to the sides of the transfer chamber. Such a cluster system simultaneously processes a plurality of substrates or continuously performs various processes to increase an amount of processing substrates. In order to increase the amount of processing substrates, a plurality of substrates are simultaneously processed in a single process chamber to increase the amount of processing substrates per unit time.
[5] However, although the plurality of substrates is simultaneously (or continuously) processed in the process chamber, when substrates before and after being processed are not effectively exchanged in the process chamber, loss of time is generated.
[6] Moreover, when a conventional cluster system includes a hexagonal transfer chamber (basically, including four process chambers and two load lock chambers), due to the area occupied by the transfer chamber, the width of the entire cluster system that is important for the area of the cluster system and the arrangement of the cluster system in a manufacturing line increases more than a desired width and the scale of a vacuum system required for maintaining the transfer chamber in a vacuum state increases, so that costs for the apparatus and installation increases. In addition, the area of the transfer chamber more increases as the number of provided process chambers increases. [7] Thus, a substrate processing system capable of simultaneously (or continuously) processing the plurality of substrates and of effectively exchanging the substrates before and after being processed in the process chamber to process the plurality of substrates is required.
Disclosure of Invention
Technical Problem [8] Therefore, the present invention is directed to provide a substrate supporting table and a substrate transferring apparatus having a structure in which substrates are effectively processed and a substrate processing system using the same. [9] The present invention also provides a substrate supporting table and a substrate transferring apparatus in which time spent on transferring substrates is reduced to improve productivity and a substrate processing system using the same. [10] The present invention also provides a substrate supporting table and a substrate transferring apparatus having a small system area and a substrate processing system using the same. [11] The present invention also provides a substrate supporting table and a substrate transferring apparatus having a structure in which time spent on processes is reduced and a substrate processing system using the same. [12] The present invention also provides a substrate supporting table and a substrate transferring apparatus having a structure in which the availability of a process chamber is improved and a substrate processing system using the same. [13] The present invention also provides a substrate supporting table and a substrate transferring apparatus configured to remarkably reduce the system area and the system width and a substrate processing system using the same. [14] The present invention also provides a substrate supporting table and a substrate transferring apparatus in which an unnecessary vacuum area is reduced to minimize apparatus cost and installation cost and a substrate processing system using the same.
Technical Solution [15] According to one aspect of the present invention, there is provided a substrate transferring apparatus for a process chamber including at least one substrate supporting table. The substrate transferring apparatus comprises a first substrate transferring device including at least one end effector to transfer substrates and transferring the substrates in the process chamber. [16] In an exemplary embodiment of the present invention, the first substrate transferring device may comprise at least one swivel plate arm having the end effector; a driving unit supplying a driving force to swivel, elevate and lower the swivel plate arm; and at least one spindle, connected to the driving unit, to which the at least one swivel plate arm is mounted.
[17] In an exemplary embodiment of the present invention, the end effector of the first substrate transferring device may comprise: a horseshoe-shaped rim; a support formed in the rim to support the substrate; and an entering path formed to prevent an end effector of an object to perform the exchange of the substrates with the exterior through a substrate entrance formed in the process chamber from being interfered.
[18] In an exemplary embodiment of the present invention, the first substrate transferring device may transfer the substrate transferred from the exterior of the process chamber to the substrate supporting table, and may put the substrates on the substrate supporting table when the end effector is inserted into the substrate supporting table.
[19] In an exemplary embodiment of the present invention, the first substrate transferring device may let the end effector remain to be inserted into the substrate supporting table while the substrates are processed in the process chamber, and may lift the substrates from the substrate supporting table to transfer when the process of the substrates is finished and the end effector exits from the substrate supporting table.
[20] In an exemplary embodiment of the present invention, the first substrate transferring device may comprise at least two different spindles to be independently rotated; and at least two different swivel plate arms respectively mounted to the different spindles.
[21] In an exemplary embodiment of the present invention, the first substrate transferring device may comprise at least one driving unit to supply a driving force to the two different spindles.
[22] In an exemplary embodiment of the present invention, the substrate transferring apparatus may further comprise a second substrate transferring device to exchange the substrates with the first substrate transferring device in the exterior of the process chamber through a substrate entrance formed in the process chamber.
[23] In an exemplary embodiment of the present invention, the second substrate transferring device may comprise at least one linear plate arm having at least one end effector and linearly reciprocating; and at least one linear driving unit to linearly reciprocate the at least one linear plate arm.
[24] In an exemplary embodiment of the present invention, the second substrate transferring device may comprise a driving unit to supply a rotational force; at least one spindle connected to the driving unit; and at least one swivel plate arm including at least one swivel plate arm which is mounted to the spindle to swivel, has at least one end effector, exchanges the substrates with the first substrate transferring device. [25] According to another aspect of the present invention, there is provided a substrate processing system. The substrate processing system comprises a process chamber including at least one substrate supporting table; and a first substrate transferring device to transfer substrates between a first substrate entrance formed in the process chamber and the substrate supporting table within the process chamber.
[26] In an exemplary embodiment of the present invention, the substrate processing system may further comprise a transfer chamber connected to the first substrate entrance and having a second substrate entrance; and a second substrate transferring device installed in the transfer chamber to transfer the substrates between the second substrate entrance and the first substrate entrance.
[27] In an exemplary embodiment of the present invention, the substrate processing system may further comprise a load rock chamber connected to the second substrate entrance, and including an atmospheric pressure transfer robot to transfer the substrates between an index and the transfer chamber.
[28] In an exemplary embodiment of the present invention, the substrate processing system may further comprise a cooling chamber to cool the processed substrates discharged through the second substrate entrance, and the atmospheric pressure transfer robot transfers the processed substrates discharged through the second substrate entrance to the index via the cooling chamber.
[29] According to another aspect of the present invention, there is provided a substrate supporting table installed in a process chamber to support substrates. The substrate supporting table comprises a body; and at least one groove formed in the outer circumference of the body to prevent a substrate support of an end effector from being locked to the substrate supporting table when the end effector of a substrate transferring apparatus is inserted into the substrate supporting table.
Advantageous Effects
[30] According to the present invention, the substrate processing system rapidly exchanges a plurality of substrates before and after being processed continuously or simultaneously, so that processing rate of the system can be increased and entire productivity of the substrates can be increased. The substrate transferring apparatus capable of simultaneously performing the loading and unloading of the substrates is provided so that the process chamber for processing a plurality of substrates can be very easily implemented. According to the present invention, the transfer time of the substrates is reduced to improve productivity. Moreover, according to the present invention, the system area and the system width of the substrate processing system are remarkably reduced so that apparatus cost and installation cost can be minimized. Brief Description of the Drawings [31] The above and other features and advantages of the present invention will become more apparent to those of ordinary skill in the art by describing in detail preferred embodiments thereof with reference to the attached drawings in which:
[32] FIG. 1 is a view illustrating the whole structure of a substrate processing system according to an embodiment of the present invention;
[33] FIG. 2 is a plan sectional view illustrating the substrate processing system in FIG. l;
[34] FIG. 3 is a perspective view illustrating a first substrate transferring apparatus installed in a process chamber; [35] FIG. 4 is a view illustrating the structure of a swivel plate arm of the first substrate transferring apparatus and the transfer of substrates; [36] FIG. 5 is a view illustrating the swivel plate arm is inserted into a substrate supporting table; [37] FIG. 6 is a view illustrating grooves of the substrate supporting table and an end effector inserted into the grooves; [38] FIG. 7 is a view illustrating the first substrate transferring apparatus having an upper driving unit and a lower driving unit; [39] FIG. 8 is a view illustrating the first substrate transferring apparatus having a driving unit divided into side units; [40] FIG. 9 is a view illustrating the transfer of substrates to the process chamber through a transfer chamber; [41] FIG. 10 is a perspective view illustrating a second substrate transferring apparatus installed in the transfer chamber; [42] FIG. 11 is a plan sectional view illustrating a second substrate transferring apparatus according to another embodiment of the present invention, installed in the transfer chamber;
[43] FIG. 12 is a view illustrating a mechanism of transferring substrates between an atmospheric pressure transfer robot and the second substrate transferring apparatus in
FIG. 11; [44] FIG. 13 is a view illustrating a double-armed atmospheric pressure transfer robot; and [45] FIG. 14 is a view illustrating an example in which a plurality of substrate supporting tables are disposed in the process chamber in a radial configuration and the first substrate transferring apparatus includes a plurality of swivel plate arms.
Best Mode for Carrying Out the Invention [46] This invention may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided as teaching examples of the invention. In the drawings, the thickness of layers and regions are exaggerated for clarity. Like numbers refer to like elements. Detailed description of well-known functions and structures that can undesirably make the subject matter of the present invention confuse will be omitted.
[47] Hereinafter, a substrate supporting table, a substrate transferring apparatus, and a substrate processing system using the same according to preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. Moreover, same reference numerals are assigned to same components to perform same functions.
[48] Basically, the present invention provides more effective substrate exchange to a substrate processing system capable of processing a plurality of substrates to improve productivity. Moreover, based on the effective exchange of the substrates, the present invention provides a substrate processing system capable of simultaneously processing more quantity of the substrates.
[49] FIG. 1 is a view illustrating the whole structure of a substrate processing system according to an embodiment of the present invention, and FIG. 2 is a plan sectional view illustrating the substrate processing system in FIG. 1. Referring to FIG. 1, the substrate processing system according to an embodiment of the present invention includes a process chamber 500 in which a plasma source 700 is installed in the rear side, and a transfer chamber 400 installed in front of the process chamber 500. An index 100 in which a carrier 110 is mounted is installed in front of the substrate processing system and a load rock chamber 200 is disposed between the index 100 and the transfer chamber 400.
[50] The index 100 is referred to as an equipment front end module (hereinafter, referred to as EFEM') and is referred to as including the load lock chamber on occasion. If necessary, the transfer chamber 400 may include a cooling chamber 300 for cooling the processed substrates. Otherwise, if the transfer chamber 400 functions the cooling of the processed substrates, the cooling chamber 300 may be omitted. In a case of requiring a preheat of the substrates to be transferred to the process chamber, a preheat chamber may be provided. The pre-heat chamber may be omitted when the cooling chamber 300 or the transfer chamber 400 functions the preheat function.
[51] A first substrate entrance 510 is formed between the transfer chamber 400 and the first process chamber 500, and a second substrate entrance 410 is formed between the transfer chamber 400 and the load rock chamber 200. The first and second substrate entrances 510 and 410 are opened and closed by slit valves (not shown).
[52] The load lock chamber 200 includes an atmospheric pressure transfer robot 210 operated under the atmospheric pressure. The atmospheric pressure transfer robot 210 transfers the substrates between the transfer chamber 400 and the index 100, and the transfer chamber 400 and the cooling chamber, and rotates, ascends and descends. The atmospheric pressure transfer robot 210 can transfer four substrates W from the carriers 110 to the transfer chamber 400 at once.
[53] The atmospheric pressure transfer robot 210 may be implemented by a single-armed robot with at least four end effectors 212. Alternatively, as shown in FIG. 13, the atmospheric pressure transfer robot 210 may be implemented by a double-armed robot 210a with respectively total eight end effectors 212a and 212b such that four substrates before being processed and four substrates after being processed can be exchanged simultaneously. Various robots used for normal semiconductor manufacturing processes as well as processes involved with the single-armed robot or the double-armed robot according to the embodiments of the present invention may be used as the atmospheric pressure transfer robot 210 or 210a.
[54] Four substrate supporting tables 520 are arranged in the process chamber 500 in the rectangular form where a first substrate transferring apparatus 800 is disposed at the center thereof. The first substrate transferring apparatus 800 includes four swivel plate arms, and the four substrate supporting tables 520 are disposed on the paths where the swivel plate arms swivel. The process chamber 500 includes a plasma source 700 as vacuum chambers to perform a predetermined plasma processing process. The process chamber 500 may be configured to perform various substrate processing operations. For example, the process chamber 500 may be an ashing chamber to remove photoresist using plasma, a chemical vapor deposition (CVD) chamber to depose insulating layers, an etch chamber to etch apertures or openings in the insulating layers in order to form interconnection structures, a physical vapor deposition (PVD) chamber to depose barrier layers, or a PVD chamber to deposit metal layers.
[55] The substrates W processed by the substrate processing system according to the embodiment of the present invention are typically wafer substrates for manufacturing semiconductor circuits or glass substrates for manufacturing a liquid crystal display (LCD). A plurality of processing systems may be required in order to perform all of the processes required for completely manufacturing an integrated circuit or a chip other than the substrate processing system according to the embodiment of the present invention. However, in order to clarify the present invention, a common structure or structures that can be understood by those skilled in the art are omitted.
[56] FIG. 3 is a perspective view illustrating the first substrate transferring apparatus 800 installed in a transfer chamber. Referring to FIG. 3, the substrate transferring apparatus 800 includes at least one swivel plate arm 810 (in this embodiment, four swivel plate arms 810) having an end effector 812. However, since the number of the swivel plate arms 810 is equal to the number of the substrate supporting tables 520 provided in the process chamber 500, at least one swivel plate arm 810 may be provided. The swivel plate arm 810 is mounted to a single spindle 830 to swivel, ascend, and descend. The spindle 830 is connected to a driving unit 820. The driving unit 820 supplies a driving force for the swivel, the ascending, and the descending of the swivel plate arm 810. Although not shown in the drawing, the driving unit 820 includes an electric motor to generate the driving force and a gear assembly to transmit the generated driving force to the spindle 830 such that the plurality of swivel plate arms 810 perform desired operations.
[57] FIG. 4 is a view illustrating the structure of the end effector of the swivel plate arm.
The swivel plate arm 810 includes a plate arm 811 connected to the spindle 830 and the end effector 812 provided at the end thereof. The end effector 812 has a horseshoe- shape and includes supports 813 to support the substrate. The arrangement and number of the supports 813 are provided to securely support the substrates.
[58] FIG. 5 is a view illustrating the swivel plate arm inserted into a substrate supporting table and FIG. 6 is a view illustrating a groove of the substrate supporting table and an end effector inserted into the groove. Referring to the drawings, the four swivel plate arms 810 of the first substrate transferring apparatus transfers the substrates from the exterior of the process chamber 500 to the substrate supporting tables 520, and puts the substrates on the substrate supporting tables 520 while the end effectors 812 are inserted into the substrate supporting tables 520. In order to prevent the protruded supports 813 of the end effectors 812 from being locked by the substrate supporting tables 520, each of the substrate supporting tables 520 has at least one groove 515 formed in the outer circumference of a body of the substrate supporting table 520. The number of the grooves 515 may be provided appropriately.
[59] The first substrate transferring apparatus 800 lets the end effectors 812 remain to be inserted into the substrate supporting tables 520 while the substrates are processed in the process chamber 500. In this case, the first substrate transferring apparatus 800 is positioned lower than the substrates W placed on the upper sides of the substrate supporting tables 520 to prevent the substrates from being improperly influenced during the process of the substrates. When the process of the substrates is finished, the end effectors 812 exit from the substrate supporting tables 520 and the substrates W are lifted up from the substrate supporting tables 520 to be transferred.
[60] FIG. 7 is a view illustrating the first substrate transferring apparatus having an upper driving unit and a lower driving unit and FIG. 8 is a view illustrating the first substrate transferring apparatus having a driving unit divided into side units. As illustrated in FIGS. 7 and 8, the first substrate transferring apparatus 800 may include two spindles 830a and 830b, which are respectively disposed in the upper and lower sides or in the right and left sides. The two spindles 83a and 830b may respectively include two swivel plate arms 810. In order to drive the spindles 830a and 830b, two driving units 820a and 820b may be provided. Otherwise, a proper gear assembly and a transmission may be used to constitute a single driving unit. Additionally, the number and arrangements of the spindles and the driving unit may be variously modified.
[61] FIG. 9 is a view illustrating the transfer of substrates to the process chamber through the transfer chamber and FIG. 10 is a perspective view illustrating a second substrate transferring apparatus installed in the transfer chamber. Referring to the drawings, the transfer chamber 400 further includes a second substrate transferring apparatus 600 to exchange the substrates with the first substrate transferring apparatus 800 in the exterior of the process chamber 500 through the first substrate entrance 510.
[62] The second substrate transferring apparatus 600 includes at least one linear plate arm 610 having at least one end effector 611 to reciprocate. In this embodiment, the linear plate arm 610 includes a loading arm 610a provided in the upper side and an unloading arm 610b provided in the lower side. The linear plate arm 610 is connected to a linear driving unit 620 to linearly reciprocate. The linear driving unit 620 may include a loading driving unit 620a and an unloading driving unit 620b. The linear driving unit 620 is installed to the outer side of the transfer chamber 400 and is connected to the linear plate arm 610 through a groove 420 formed in the side wall of the transfer chamber 400.
[63] The exchange of the substrates before and after being processed between the transfer chamber 400 and the process chamber 500 is performed by the first and second substrate transferring apparatuses 800 and 600. In this case, the transfer chamber 400 is switched to the same vacuum state as the process chamber 500 in a state where the second substrate entrance 410 is closed, and continuously the substrate are exchanged when the first substrate entrance 510 is opened. Prior to the exchange of the substrates, as illustrated in FIG. 9, the first substrate transferring apparatus 800 takes the substrates from the substrate supporting tables 520 and is arranged in the first substrate entrance 510.
[64] The unloading arm 610b of the second substrate transferring apparatus 600 receives the processed substrates and exits from the first substrate transferring apparatus 800 as linearly reciprocating. Next, the spindle 830 of the first substrate transferring apparatus 800 ascends and stands at the loading position. The loading arm 610a of the second substrate transferring apparatus 600 linearly reciprocates and transfers the substrates before being processed. When the exchange of the substrates is finished, the first substrate entrance 510 is closed and the first substrate transferring apparatus 800, as described above, transfers the substrates to the substrate supporting tables 520.
[65] After the exchange of the substrates between the transfer chamber 400 and the process chamber 500 is finished, the exchange of the substrates between the transfer chamber 400 and the load rock chamber 200 is carried out. The transfer chamber 400 is switched from the vacuum state to the atmospheric pressure state, and the atmospheric pressure transfer robot 210 in the load rock chamber 200 performs the exchange of the substrates before and after being processed when the second substrate entrance 410 is opened. Although the single-armed atmospheric pressure transfer robot 210 is employed in this embodiment of the present invention, as illustrated in FIG. 13, when the double-armed atmospheric pressure transfer robot 210 is employed, the exchange of the substrates can more rapidly performed.
[66] FIG. 11 is a plan sectional view illustrating a second substrate transferring apparatus according to another embodiment of the present invention, installed in the transfer chamber, and FIG. 12 is a view illustrating a mechanism of transferring substrates between the atmospheric pressure transfer robot and the second substrate transferring apparatus in FIG. 11. Referring to the drawings, the second substrate transferring apparatus 900 according to another embodiment of the present invention, installed in the transfer chamber 400, includes first and second substrate transferring units 900a and 900b symmetrically installed by interposing the second substrate entrance 510.
[67] Each of the first and second substrate transferring units 900a and 900b includes a driving unit 920 to supply a rotational force, a spindle 930 connected to the driving unit 920, and a swivel plate arm 910 connected to the spindle 930. The swivel plate arms respectively include at least one end effector 912 (four end effectors in this embodiment). The four end effectors 912 are mounted to end of a plate arm 911 and the other end of the plate arm 911 is connected to the spindle 930. The four end effectors 912 include stepped entering paths 914 such that the end effectors 212 of the atmospheric pressure transfer robot 210 can enter without interference.
[68] For the smoother reception and transfer of the substrates, four swivel end effectors
912 may be provided at the ends of the plate arm 911. Although the loading/unloading of the substrates are performed by the first and second substrate transferring units 900a and 900b in this embodiment, it is possible that only any one of the first and second substrate transferring units 900a and 900b sequentially performs the loading/unloading of the substrates. Otherwise, a modification that eight end effectors are mounted to a single plate arm is possible.
[69] FIG. 14 is a view illustrating an example in which a plurality of substrate supporting tables are arranged in the process chamber in a radial configuration and the first substrate transferring apparatus includes a plurality of swivel plate arms. As illustrated in FIG. 14, the number of the substrate supporting tables 520 provided in the process chamber 500 is increased to 9 and the number of the swivel plate arms 810 of the first substrate transferring apparatus 800 increases to 9 to correspond to the number of the substrate supporting tables 520. [70] The invention has been described using preferred exemplary embodiments.
However, it is to be understood that the scope of the invention is not limited to the disclosed embodiments. On the contrary, the scope of the invention is intended to include various modifications and alternative arrangements of the substrate transferring apparatus and the substrate processing system of the present invention within the capabilities of persons skilled in the art using presently known or future technologies and equivalents. The scope of the claims, therefore, should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements. Industrial Applicability
[71] As described above, according to the present invention, the substrate processing system rapidly exchanges a plurality of substrates before and after being processed continuously or simultaneously, so that processing rate of the system can be increased and entire productivity of the substrates can be increased. The substrate transferring apparatus capable of simultaneously performing the loading and unloading of the substrates is provided so that the process chamber for processing a plurality of substrates can be very easily implemented. According to the present invention, the transfer time of the substrates is reduced to improve productivity. Moreover, according to the present invention, the system area and the system width of the substrate processing system are remarkably reduced so that apparatus cost and installation cost can be minimized.

Claims

Claims
[1] A substrate transferring apparatus of a process chamber comprising at least one substrate supporting table, the apparatus comprising: a first substrate transferring device including at least one end effector to transfer substrates and transferring the substrates in the process chamber.
[2] The substrate transferring apparatus of claim 1, wherein the first substrate transferring device comprises: at least one swivel plate arm having the end effector; a driving unit supplying a driving force to swivel, elevate and lower the swivel plate arm; and at least one spindle, connected to the driving unit, to which the at least one swivel plate arm is mounted.
[3] The substrate transferring apparatus of claim 1, wherein the end effector of the first substrate transferring device comprises: a horseshoe-shaped rim; a support formed in the rim to support the substrate; and an entering path formed to be prevented from interfering with an end effector of an object to perform the exchange of the substrates in the exterior when the exchange of the substrates is performed between the process chamber and the exterior through a substrate entrance formed in the process chamber.
[4] The substrate transferring apparatus of claim 3, wherein the first substrate transferring device transfers the substrate transferred from the exterior of the process chamber to the substrate supporting table, and puts the substrates on the substrate supporting table when the end effector is inserted into the substrate supporting table.
[5] The substrate transferring apparatus of claim 4, wherein the first substrate transferring device lets the end effector remain to be inserted into the substrate supporting table while the substrates are processed in the process chamber, and lifts the substrates from the substrate supporting table to transfer when the process of the substrates is finished and the end effector exits from the substrate supporting table.
[6] The substrate transferring apparatus of claim 2, wherein the first substrate transferring device comprises: at least two different spindles to be independently rotated; and at least two different swivel plate arms respectively mounted to the different spindles.
[7] The substrate transferring apparatus of claim 6, wherein the first substrate transferring device comprises at least one driving unit to supply a driving force to the two different spindles.
[8] The substrate transferring apparatus of claim 1, further comprising a second substrate transferring device to exchange the substrates with the first substrate transferring device in the exterior of the process chamber through a substrate entrance formed in the process chamber.
[9] The substrate transferring apparatus of claim 8, wherein the second substrate transferring device comprises: at least one linear plate arm having at least one end effector and linearly reciprocating; and at least one linear driving unit to linearly reciprocate the at least one linear plate arm.
[10] The substrate transferring apparatus of claim 8, wherein the second substrate transferring device comprises: a driving unit to supply a rotational force; at least one spindle connected to the driving unit; and at least one swivel plate arm including at least one swivel plate arm which is mounted to the spindle to swivel, has at least one end effector, exchanges the substrates with the first substrate transferring device.
[11] A substrate processing system comprising: a process chamber including at least one substrate supporting table; and a first substrate transferring device to transfer substrates between a first substrate entrance formed in the process chamber and the substrate supporting table within the process chamber.
[12] The substrate processing system of claim 11, further comprising: a transfer chamber connected to the first substrate entrance and having a second substrate entrance; and a second substrate transferring device installed in the transfer chamber to transfer the substrates between the second substrate entrance and the first substrate entrance.
[13] The substrate processing system of claim 12, further comprising a load rock chamber connected to the second substrate entrance, and including an atmospheric pressure transfer robot to transfer the substrates between an index and the transfer chamber.
[14] The substrate processing system of claim 12, further comprising a cooling chamber to cool the processed substrates discharged through the second substrate entrance, wherein the atmospheric pressure transfer robot transfers the processed substrates discharged through the second substrate entrance to the index via the cooling chamber.
[15] A substrate supporting table installed in a process chamber to support substrates, comprising; a body; and at least one groove formed in the outer circumference of the body to prevent a substrate support of an end effector from being locked by the substrate supporting table when the end effector of a substrate transferring apparatus is inserted into the substrate supporting table.
PCT/KR2007/002203 2006-05-04 2007-05-04 Substrate pedestal and substrate transfer equipment and substrate processing system and method using the same WO2007129838A1 (en)

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