WO2007115105A3 - Method for making an improved thin film solar cell interconnect using etch and deposition processes - Google Patents

Method for making an improved thin film solar cell interconnect using etch and deposition processes Download PDF

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Publication number
WO2007115105A3
WO2007115105A3 PCT/US2007/065521 US2007065521W WO2007115105A3 WO 2007115105 A3 WO2007115105 A3 WO 2007115105A3 US 2007065521 W US2007065521 W US 2007065521W WO 2007115105 A3 WO2007115105 A3 WO 2007115105A3
Authority
WO
WIPO (PCT)
Prior art keywords
etch
making
thin film
solar cell
film solar
Prior art date
Application number
PCT/US2007/065521
Other languages
French (fr)
Other versions
WO2007115105B1 (en
WO2007115105A2 (en
Inventor
Peter G Borden
Original Assignee
Applied Materials Inc
Peter G Borden
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc, Peter G Borden filed Critical Applied Materials Inc
Priority to JP2009503280A priority Critical patent/JP2009532884A/en
Priority to EP07759713A priority patent/EP2008157A2/en
Publication of WO2007115105A2 publication Critical patent/WO2007115105A2/en
Publication of WO2007115105A3 publication Critical patent/WO2007115105A3/en
Publication of WO2007115105B1 publication Critical patent/WO2007115105B1/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/0445PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
    • H01L31/046PV modules composed of a plurality of thin film solar cells deposited on the same substrate
    • H01L31/0463PV modules composed of a plurality of thin film solar cells deposited on the same substrate characterised by special patterning methods to connect the PV cells in a module, e.g. laser cutting of the conductive or active layers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Abstract

The present invention provides a method of forming interconnects in a photovoltaic module. According to one aspect, a method according to the invention includes processing steps that are similar to those performed in conventional integrated circuit fabrication. For example, the method can include masks and etches to form isolation grooves between cells, and additional etches to form a conductive step adjacent to the grooves that can be used to form interconnects between cells. According to another aspect the method for forming the conductive step can be self-aligned, such as by positioning a mirror above the module and exposing photoresist from underneath the substrate at an angle one or more times, and etching to expose the conductive step. According to another aspect, the process can include steps to form grid lines in the module to improve current transport in the structure.
PCT/US2007/065521 2006-03-31 2007-03-29 Method for making an improved thin film solar cell interconnect using etch and deposition processes WO2007115105A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009503280A JP2009532884A (en) 2006-03-31 2007-03-29 Method for manufacturing improved thin film solar cell interconnects using etching and deposition processes
EP07759713A EP2008157A2 (en) 2006-03-31 2007-03-29 Method for making an improved thin film solar cell interconnect using etch and deposition processes

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/394,723 2006-03-31
US11/394,723 US7718347B2 (en) 2006-03-31 2006-03-31 Method for making an improved thin film solar cell interconnect using etch and deposition process

Publications (3)

Publication Number Publication Date
WO2007115105A2 WO2007115105A2 (en) 2007-10-11
WO2007115105A3 true WO2007115105A3 (en) 2008-09-25
WO2007115105B1 WO2007115105B1 (en) 2008-11-13

Family

ID=38564217

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/065521 WO2007115105A2 (en) 2006-03-31 2007-03-29 Method for making an improved thin film solar cell interconnect using etch and deposition processes

Country Status (7)

Country Link
US (1) US7718347B2 (en)
EP (1) EP2008157A2 (en)
JP (1) JP2009532884A (en)
KR (1) KR20090025193A (en)
CN (1) CN101438207A (en)
TW (1) TW200802913A (en)
WO (1) WO2007115105A2 (en)

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Also Published As

Publication number Publication date
CN101438207A (en) 2009-05-20
TW200802913A (en) 2008-01-01
JP2009532884A (en) 2009-09-10
KR20090025193A (en) 2009-03-10
WO2007115105B1 (en) 2008-11-13
EP2008157A2 (en) 2008-12-31
WO2007115105A2 (en) 2007-10-11
US7718347B2 (en) 2010-05-18
US20070238285A1 (en) 2007-10-11

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