WO2007112200A1

WO2007112200A1 - Polyamides

Info

Publication number: WO2007112200A1
Application number: PCT/US2007/063838
Authority: WO
Inventors: Tina Nataniel; Dwight Heinrich
Original assignee: Henkel Corporation
Priority date: 2006-03-24
Filing date: 2007-03-13
Publication date: 2007-10-04
Also published as: DK1999184T3; US8119251B2; EP1999184B1; TR201901806T4; EP1999184A4; ES2701612T3; EP1999184A1; US20090042047A1

Abstract

The reaction of dimer acids, C10-C20 dicarboxylic acids, and alkylene diamines having from 2 to 8 carbon atoms provides polyamides having good oil and solvent resistance, high heat resistance, flexibility, and relatively low melt viscosities.

Description

POLYAMIDES

FIELD OF THE INVENTION

The invention relates to polyamides based on dimer acids, C_1O-C₂₀ dicarboxylic acids, and alkylene diamines having from 2 to 8 carbon atoms.

BACKGROUND OF THE INVENTION

Polyamides are commonly used as components of adhesive, sealing or coating compositions to be used in applications that will be exposed to solvents, oils and the like. Such compositions therefore must be able to withstand repeated or prolonged exposure to such substances without significant deterioration of their properties. At the same time, however, it will generally be desirable for such polyamides to not soften or melt at elevated temperatures and to have good flexibility (e.g., resistance to cracking or breaking). Additionally, the melt viscosity of the polyamide must be sufficiently low that the polyamide can be easily manufactured and also applied to substrate surfaces (as a hot melt adhesive, for example) using conventional application equipment. Although polyamides in general have been known for many years, it has proven difficult to obtain polyamides having all the aforementioned properties in combination.

BRIEF SUMMARY OF THE INVENTION

The present invention provides polyamides having an exceptionally desirable combination of properties, including good flexibility, high heat resistance, and good resistance to solvents such as gasoline. The polyamides are formed by reacting a) an acid component comprising at least one dimerized C₁₂ to C₂₄ unsaturated fatty acid (dimer acid) and at least one C ₁₀-C₂₀ dicarboxylic acid and b) an amine component comprising at least one alkylene diamine having from 2 to 8 carbon atoms (in particular, hexamethylenediamine). The polyamides of the invention are particularly useful for hot melt adhesive formulations which will come into contact with organic solvents or oils, such as in fuel filter applications.

DETAILED DESCRIPTION OF CERTAIN EMBODIMENTS OF THE INVENTION In preferred embodiments of the present invention, the polyamide possesses all of

the following characteristics: a viscosity at 225 °C of at least 30 poise but not greater

than 90 poise (e.g., 55 to 90 poise) or alternatively not greater than 140 poise (e.g., 100 to

140 poise); a softening point of at least 182 °C (e.g., 182 to 196 ⁰C); and excellent

resistance to both European gasoline formulations and gasohol. Preferably, the polyamide additionally is hard (for example, having a Shore A hardness greater than 90), yet non-brittle and flexible (e.g., where a micro dogbone sample of the polyamide having a thickness of 50 mil exhibits an elongation value of at least 50%, more preferably at least 100%).

The acid component used to prepare the polyamides of the present invention contains one or more dimerized Cj₂ to C₂₄ unsaturated fatty acids. Suitable dimer acids may be produced by combining or condensing two moles of unsaturated monocarboxylic acid (the monocarboxylic acid molecules which react may be the same or different). Processes for the production of dimer acids are well known to the art and by way of illustration, reference may be had to U.S. Pat. Nos. 2,793,219 and 2,955,121. Thirty-six carbon (C₃₆) dimer acids obtained by the dimerization of an unsaturated C]₈ acid such as oleic acid, linoleic acid, linolenic acid and mixtures thereof (e.g., tall oil fatty acids) are especially useful and advantageously employed for the preparation of the polyamides. Such dimer acids have as their principal component a C₃₆ dicarboxylic acid and typically have an acid value in the range 180-215, saponification value in the range 190-205 and neutral equivalent from 265-310. Dimer acids containing less than 30% by weight by-product acids including monobasic acids, trimer acids or higher polymer acids are especially useful for this invention. The dimer acids may also be hydrogenated prior to use and/or molecularly distilled or otherwise purified to increase the dimer content to 90% or more. In certain embodiments of the invention, for example, the dimerized acid product utilized as a dimer acid source contains no more than 6% monobasic acids (as measured by AOCS Tf 5-91), no more than 5% polybasic acids (i.e., compounds containing three or more carboxylic acid groups per molecule; as measured by AOCS Tf 5-91), and at least 90% dibasic acids (as measured by AOCS Tf 5-91). Highly or completely saturated dimer acids may be utilized. The dimerized acid product in certain embodiments may, for example, have an iodine value (Wijs) of not more than 20 or not more than 10 (as measured by AOCS Tg la-64). In one embodiment, one or more C_32-40 dimer acids (i.e., dicarboxylic acids containing 32 to 40 carbon atoms per molecules obtained by dimerization of unsaturated fatty acids, such as Ci₆-C₂₀ unsaturated fatty acids) are utilized.

The preferred starting acids for the preparation of the dimerized fatty acids used in this invention are oleic and linoleic acids, due to their ready availability and relative ease of polymerization. Mixtures of oleic and linoleic acids are found in tall oil fatty acids, which are a convenient commercial source of these acids. Fatty acids can be dimerized using various well-known catalytic and non-catalytic polymerization methods.

The acid component additionally contains one or more aliphatic dicarboxylic acids containing from 10 to 20 carbon atoms, wherein the two carboxylic acid functional groups are terminal (i.e., on each end of the carbon chain). In one embodiment, the aliphatic dicarboxylic acids contain from 14 to 20 carbon atoms. The incorporation of such long chain aliphatic dicarboxylic acids into a polyamide has been found to significantly improve the chemical and solvent resistance of the polyamide, as compared to a polyamide prepared using only dimer acids. Although branched or substituted aliphatic dicarboxylic acids can be utilized as the C₁₀-C₂₀ aliphatic dicarboxylic acid, linear (straight chain) dicarboxylic acids are generally preferred. Suitable aliphatic dicarboxylic acids for use in the present invention include, but are not limited to, compounds corresponding to the general formula HOOC-Ri -COOH where R₁ is a divalent, aliphatic, hydrocarbon radical having from 8 to 18 carbon atoms such as decanedioic acid (sebacic acid), undecanedioic acid, tridecanedioic acid (brassylic acid), dodecanedioic acid (1,10-decanedi carboxylic acid), tetradecanedioic acid (1,12- dodecanedicarboxylic acid), pentad ecanedioic acid (1,13-tridecanedicarboxylic acid), hexadecanedioic acid (1,14-tetradecanedi carboxylic acid, thapsic acid), octadecanedioic acid (1,16-hexadecanedi carboxylic acid) and mixtures thereof. Ri preferably is polymethylene, i.e., -(CH₂)_n-, wherein n is 8 to 18. In one embodiment of the invention, tetradecanedioic acid is one of the do to C₂₀ aliphatic dicarboxylic acids or the only such dicarboxylic acid used in the acid component. In one embodiment, tetradecanedioic acid may comprise at least 50 mole % (in another embodiment, at least 80 equivalent %; in yet another embodiment, at least 90 equivalent %) of the C₁Q to C₂₀ aliphatic dicarboxylic acids used. In certain embodiments of the invention, octadecanedioic acid is one of the Cio to C₂₀ aliphatic dicarboxylic acids or the only such dicarboxylic acid used in the acid component. In one embodiment, octadecanedioic acid may comprise at least 50 equivalent % (in another embodiment, at least 80 mole %; in yet another embodiment, at least 90 equivalent %) of the Cio to C₂₀ aliphatic dicarboxylic acids used. In other embodiments of the invention, decanedioic acid is one of the Cio to C₂o aliphatic dicarboxylic acids or the only such dicarboxylic acid used in the acid component. In another embodiment, decanedioic acid may comprise at least 50 equivalent % (in another embodiment, at least 80 mole %; in yet another embodiment, at least 90 equivalent %) of the Cio to C₂o aliphatic dicarboxylic acids used. In other embodiments of the invention, dodecanedioic acid is one of the Cio to C₂o aliphatic dicarboxylic acids or the only such dicarboxylic acid used in the acid component. In one embodiment, dodecanedioic acid may comprise at least 50 equivalent % (in another embodiment, at least 80 mole %; in yet another embodiment, at least 90 equivalent %) of the Cio to C₂₀ aliphatic dicarboxylic acids used.

The equivalent ratio of dimerized unsaturated fatty acids to Cio to C₂₀ aliphatic dicarboxylic acids in one embodiment is from about 0.15:1 to about 0.65:1, in another embodiment from about 0.2:1 to about 0.6:1. In certain embodiments of the invention, the dimerized unsaturated acid(s) and Cio to C₂₀ aliphatic dicarboxylic acids together comprise at least 50 equivalent % (in another embodiment, at least 80 equivalent %; in yet another embodiment, at least 90 equivalent %) of the acid component. In one embodiment, the acid component consists essentially of or consists of dimerized unsaturated fatty acid(s), Cio to C₂₀ aliphatic dicarboxylic acid(s), and monocarboxylic fatty acid(s). In other embodiments, the acid component contains less than 10 equivalent %, or less than 5 equivalent %, of any dicarboxylic acid other than the dimerized unsaturated fatty acid(s) and the Cj₀-C_2O dicarboxylic acid(s). In still another embodiment, the acid component contains no, or essentially no, dicarboxylic acid other than the dimerized unsaturated fatty acid(s) and the C₁₀-C₂₀ dicarboxylic acid(s). Preferably, the acid component contains less than 5 equivalent % or essentially no polybasic acids (compounds containing three or more carboxylic acid groups per molecule).

To control the melt viscosity of the polyamide that is produced, it will often be desirable to also include one or more monocarboxylic acids in the mixture of components being reacted. For example, the acid component may contain an amount of

monocarboxylic acid effective to provide a polyamide having a viscosity at 225 °C of not

greater than 150 poise or not greater than 120 poise or not greater than 90 poise. Generally speaking, it is preferred to utilize monocarboxylic acids having relatively low volatilities, such as monobasic fatty acids (i.e., monocarboxylic acids containing 6 or more carbon atoms, preferably 8 or more carbon atoms, most preferably 10 or more carbon atoms per molecule). The monocarboxylic acid may, for example, be a straight or branched chain, saturated or unsaturated fatty acid such as lauric acid, palmitic acid, oleic acid, stearic acid, or the like. The dimerized acid product employed as a source of the dimer acid used in the acid component may also function as a source of monocarboxylic acid, as such dimerized acid products commonly contain low levels (e.g., 1 to 15%) of one or more monocarboxylic acids. However, such monocarboxylic acids present as impurities in the dimerized acid product may be supplemented through the addition of further quantities of monocarboxylic acid(s) in order for the total concentration of monocarboxylic acid in the acid component to be within the desired limits (i.e., the amount required to control the polyamide melt viscosity within the desired range). The total amount of monocarboxylic acid present during the condensation polymerization which is carried out to form the polyamide may be varied or controlled as desired to adjust the polyamide melt viscosity, but typically is from about 0.1 to about 6 equivalent % or from about 1 to about 4 equivalent %.

The amine component is comprised of at least one alkylene diamine having from 2 to 8 carbon atoms. Other types of amines may optionally also be present in the amine component. However, the C₂-C₈ alkylene diamine or mixture of C₂-Cg alkylene diamines in one embodiment together comprises at least 50 equivalent % (in another embodiment, at least 80 equivalent %; in yet another embodiment, at least 95 equivalent %) of the amine component. In still another embodiment, the amine component consists of or consists essentially of one or more alkylene diamines having from 2 to 8 carbon atoms. In certain embodiments, the amine component is free or essentially free of dimer amines and/or polyoxyalkylene diamines (for example, the amine component may contain less than 5 equivalent % or less than 1 equivalent % of dimer amine or polyoxyalkylene diamine).

The alkylene diamine in one embodiment corresponds to the formula:

H₂N-(CHR)_n-NH₂ where "n" is 2 to 8 (in one embodiment, 2 to 4), and R is hydrogen or lower (e.g., Ci - C₄) alkyl. The R groups within a single molecule may be the same or different. Straight chain alkylene diamines (where all R groups are H) are used in one embodiment of the invention, although branched chain alkylene diamines (where at least one R is an alkyl group) could also be used (either alone or in combination with one or more straight chain alkylene diamines). Thus, illustrative non-limiting examples of useful alkylene diamines include ethylenediamine, 1,2-propylenediamine, 1,3-propylenediamine, tetramethylenediamine, pentamethylenediamine, hexamethylenediamine, octamethylenediamine, 2-methyl-l,5-pentanediamine, and mixtures thereof. Preferably, "n" in the above-stated formula is at least 4 or at least 5. Where a mixture of different alkylene diamines is employed in the amine component, "n" is at least 4 or at least 5 on average. The use of alkylene diamines having a relatively high "n" value (e.g., at least 4) helps to improve the flexibility and reduce the brittleness of the polyamide obtained by condensation polymerization of the amine and acid components. Especially useful polyamides are obtained in accordance with this invention when the amine component comprises, consists essentially of, or consists of a mixture of ethylene diamine and hexamethylenediamine. In one embodiment, more hexamethylenediamine than ethylenediamine is present in the amine component. For example, the equivalent ratio of hexamethylenediamine:ethylenediamine may be from 99:1 to 60:40 , or from 95:5 to 65:35, or from 90:10 to 70:30. In other embodiments of the invention, however, the amine component consists of or consists essentially of hexamethylenediamine or is comprised of at least 95 equivalent % hexamethylenediamine.

In certain embodiments, the mixture of reactants used to prepare the polyamide contains less than 15 weight percent (or less than 10 weight percent or less than 5 weight percent) lactam (in particular, caprolactam, e.g., epsilon caprolactam). For example, the reaction mixture may be free or essentially free of lactam (in particular, caprolactam, e.g., epsilon caprolactam). In one embodiment of the present invention, a polyamide is prepared by reacting the following components:

C_32-4O Dimer Acid 16-26 or 19-23 equivalent %

Monobasic Fatty Acid 0.5-6 or 1-4 equivalent % Tetradecanedioic Acid 70-80 or 73-77 equivalent %

Ethylenediamine 15-25 or 18-22 equivalent %

Hexamethylenediamine 75-85 or 78-82 equivalent %

The total equivalent % of C₃₂-₄₀ dimer acid, monobasic fatty acid (e.g., stearic acid), and tetradecanedioic acid may, for example, be from 95 to 100 % (e.g., up to 5 equivalent % of acids other than these named acids may also form part of the acid component). The total equivalent % of ethylenediamine and hexamethylenediamine may, for example, be from 95 to 100 % (e.g., up to 5 equivalent % of amines other than these named amines may also form part of the amine component). Antioxidants and/or catalysts may additionally be present. In other embodiments of the present invention, a polyamide is prepared by reacting the following components:

C_32-4O Dimer Acid 16-26 or 19-23 equivalent %

Monobasic Fatty Acid 0.5-6 or 1-4 equivalent %

Octadecanedioic Acid 72-82 or 75-79 equivalent % Hexamethylenediamine 90-100 or 95-100 equivalent %

The total equivalent % of C_32-4O dimer acid, monobasic fatty acid (e.g. stearic acid), and octadecanedioic acid may, for example, be from 95 to 100 % (e.g., up to 5 equivalent % of acids other than these named acids may also form part of the acid component). Up to 10 equivalent % (alternatively, up to 5 equivalent %) of amines other than hexamethylenediamine may also form part of the amine component. Antioxidants and/or catalysts may additionally be present.

In another embodiment of the present invention, a polyamide is prepared by reacting the following components: C_32-40 Dimer Acid 28-38 or 31 -35 equivalent %

Monobasic Fatty Acid 0.5-6 or 1-4 equivalent %

Tetradecanedioic Acid 60-70 or 63-67 equivalent %

Hexamethylenediamine 90-100 or 95-100 equivalent %

The total equivalent % of C_32-40 dimer acid, monobasic fatty acid (e.g. stearic acid), and tetradecanedioic acid may, for example, be from 95 to 100 % (e.g., up to 5 equivalent % of acids other than these named acids may also form part of the acid component). Up to 10 equivalent % (alternatively, up to 5 equivalent %) of amines other than hexamethylenediamine may also form part of the amine component. Antioxidants and/or catalysts may additionally be present. In another embodiment of the present invention, a polyamide is prepared by reacting the following components:

C_32-4O Dimer Acid 18-28 or 21 -25 equivalent %

Monobasic Fatty Acid 0-6 or 0.5-4 equivalent %

Decanedioic Acid 72-82 or 75-79 equivalent % Ethylenediamine 13-23 or 16-20 equivalent %

Hexamethylenediamine 77-87 or 80-84 equivalent %

The total equivalent % of C_32-40 dimer acid, monobasic fatty acid (e.g., stearic acid), and decanedioic acid may, for example, be from 95 to 100 % (e.g., up to 5 equivalent % of acids other than these named acids may also form part of the acid component). The total equivalent % of ethylenediamine and hexamethylenediamine may, for example, be from 95 to 100 % (e.g., up to 5 equivalent % of amines other than these named amines may also form part of the amine component). Antioxidants and/or catalysts may additionally be present. In a further embodiment of the present invention, a polyamide is prepared by reacting the following components:

C_32-40 Dimer Acid 17-27 or 19-25 equivalent %

Monobasic Fatty Acid 0.5-6 or 1-4 equivalent %

Dodecanedioic Acid 72-82 or 75-79 equivalent % Ethylenediamine 15-25 or 18-22 equivalent %

Hexamethylenediamine 75-85 or 78-82 equivalent %

The total equivalent % of C_32-40 dimer acid, monobasic fatty acid (e.g., stearic acid), and dodecanedioic acid may, for example, be from 95 to 100 % (e.g., up to 5 equivalent % of acids other than these named acids may also form part of the acid component). The total equivalent % of ethylenediamine and hexamethylenediamine may, for example, be from 95 to 100 % (e.g., up to 5 equivalent % of amines other than these named amines may also form part of the amine component). Antioxidants and/or catalysts may additionally be present.

The number of free acid groups and/or free amine groups present in the polyamide are directly related to the relative amounts of the acid component and amine component involved in the polymerization reaction and the degree of completion of the reaction. The polyamide may be either acid-terminated, amine-terminated, or contain both acid and amine terminal groups. The terminal groups of the polyamide may also be nonfunctional, for example an alkyl group derived from a monocarboxylic acid added to the acid component to control the molecular weight and viscosity of the polyamide. Generally speaking, polyamides in accordance with the invention that are acid-terminated tend to have better stability at elevated temperatures than the corresponding amine- terminated polyamides. However, the amine-terminated polyamides tend to exhibit better adhesion to substrate surfaces. Approximately stoichiometric amounts (e.g., a ratio of total acid to total amine groups of from about 0.9:1 to about 1.1 :1, more typically from about 0.97:1 to about 1.03:1) based on the total number of available acid and amine groups may be used to prepare the polyamide resins of this invention and the reaction conditions can be selected to ensure completion or substantial completion of the amidation (condensation) reaction.

In one embodiment of the invention, the polyamide may be the result of as complete an amidation reaction as possible between the starting acid component and the amine component. Those skilled in the art will recognize that the degree of completion of the amidation process can be determined by evaluating the acid number and the amine number of the final polymer. The polyamide may have relatively low acid and amine numbers, typically less than about 40 in total, more typically less than about 20 in total, and even more typically less than about 15 in total.

The instant polyamides may be prepared using conventional procedures and reaction conditions known to the art. It should be noted that while reference is made to acid and amine components for purposes of determining the relative amounts of each acid and amine used to prepare the polyamide, there is no need to form a separate premix of acids and a separate premix of amines, nor is it required that all reactants be charged together at the beginning of the reaction. In general, the acid and amine components may be reacted until the final product has an acid value and an amine value less than 20 (in another embodiment, less than 15), with the reaction being generally conducted at

temperatures from about 100⁰C to about 300⁰C for from about 1 to about 8 hours. Most

often the reactions will be heated from 140° to 240°C until the theoretical amount of

water is evolved. Generally several hours are required to complete the reaction. The reaction is preferably conducted under an inert atmosphere, such as nitrogen, and during the final stages of the reaction a vacuum is applied to the system to facilitate removal of the final traces of water and any other volatile materials. Applying a high vacuum will tend to result in the production of a polyamide having a higher molecular weight and correspondingly higher viscosity, which generally reduces the brittleness of the polyamide (as reflected in higher elongation values). Catalysts, such as phosphoric acid, hypophosphoric acid, sodium benzene phosphonate, sodium benzene phosphinite and the like, and/or vacuum can be used, especially in the latter part of the reaction, to yield a more complete amidation reaction and/or to increase the rate of reaction. Antifoam agents may also be utilized in order to control or suppress foaming during reaction of the components.

The polyamides obtained by the aforedescribed procedures may be used without further modification. The polyamide compositions of this invention may, however, be combined or modified with conventional additives widely known and used in the resin arts. For example, thermal stabilizers, antioxidants, UV stabilizers, plasticizers, nucleating agents, impact modifiers, tackifiers, flame retardants, antistatic agents, reinforcing agents, processing aids including mold release agents, lubricants and the like, as well as pigments, dyes, inorganic or organic fillers such as carbon black, talc, clay, mica and the like may usefully be included. The polyamides of the present invention and compositions formulated therewith may be used in a wide variety of applications including, but not limited to, coatings, adhesives, sealants, encapsulates, films, laminates, moldings and composites. For example, the polyamide and compositions containing the polyamide may be applied to different types of substrates or may be used to join together different substrates, including webs, fibers, filaments, films, mats, foams, textiles, plastics, ceramics, and metals, as well as paper, wood and other cellulosic substrates.

The polyamides of the present invention are particularly useful as hotmelt adhesives or components of hot melt adhesives where good resistance to solvents, oil and/or fuel is needed. For example, the polyamides may be utilized in the assembly of fuel, oil or hydraulic fluid filters and the like.

The polyamide and formulations prepared therefrom can be applied to substrates using any of the methods known in the art of hot melt adhesives. For example, the polyamide or polyamide-containing composition may be heated to a temperature above its melting or liquidification point (e.g., a temperature sufficiently high to reduce the

viscosity to a desired level, typically about 200 to about 250 ⁰C) and applying the

polyamide or composition to the substrate surface. If the composition is being used as a hot melt adhesive, a second substrate can be brought into contact with the polyamide or polyamide-containing composition on the surface of the first substrate before the polyamide or polyamide-containing composition completely cools and solidifies. Pressure may be applied during such contacting to ensure that a strong adhesive bond is created. The polyamide or polyamide-containing composition is thereafter permitted to cool and solidify, thereby joining together the two substrates (i.e., the two substrates are adhered to each other by the polyamide or polyamide-containing composition). Alternatively, the polyamide or polyamide-containing composition may be applied to a substrate in molten form, solidified by cooling, and then re-melted by heating prior to or even after being brought into contact with the surface of a second substrate.

EXAMPLES

A series of polyamides was prepared using different mixtures of reactant components as set forth in Table 1 (the amount of each component being expressed in parts by weight). The blended materials are heated for 90 minutes under nitrogen at 227

°C and then for an additional 60 minutes under vacuum at the same temperature to obtain

the polyamide.

In each example, the acid component contained 21.3 equivalent % dimer acid, 1.7 equivalent % stearic acid, and 77.0 equivalent % of a straight chain aliphatic dicarboxylic acid while the amine component contained 20.0 equivalent % ethylenediamine and 80.0 equivalent % hexamethylenediamine. The co-acid component used was varied as follows: Example 1 - decanedioic acid; Example 2 - undecanedioic acid; Example 3 - dodecanedioic acid; Example 4 - tetradecanedioic acid; Example 5 - pentadecanedioic acid; Example 6 - octadecanedioic acid. Using this particular type of formulation, excellent solvent resistance could only be obtained when a dicarboxylic acid containing 14 or more carbon atoms was used together with dimer acid to form the polyamide. Satisfactory heat resistance and melt viscosities were also maintained, despite the use of the longer chain dicarboxylic acids. The polyamide of Example 4 was also found to have "Excellent" resistance to both gasoline and diesel fuel (4 days, room temperature),

"Excellent" resistance to motor oil (4 days, 149 ⁰C), "Excellent" resistance to SKYDROL

aviation hydraulic fluid (10 days, 88 °C; the resistance rating dropped to "Bad" after 30 days), and "Excellent" resistance to aqueous glycol (10 days, 66 °C; the resistance rating

dropped to "Good" after 30 days). Table 1.

Additional polyamides were prepared using the different combinations of reactants as set forth in Tables 2 and 3. For the dimer acid, stearic acid, co-acid, ethylenediamine and hexamethylene components, the first number listed in the tables is the amount of such component in equivalent % and the second number listed in the tables is the amount of each component in parts by weight. Table 2 shows that it is possible to formulate polyamides having good to excellent solvent resistance and high softening points using Ci_O-C]₂ dicarboxylic acids. If desired, the melt viscosities of the polyamides described in Table 2 could be lowered by incorporating higher proportions of a monocarboxylic acid such as stearic acid in the mixture of reactants used to prepare the polyamides.

Table 2.

Table 3.

EMPOL 1008 hydrogenated dimer acid, obtained from Cognis Corporation (2-6% monobasic acids, 90-98% dibasic acids, 1-5% polybasic acids, saponification value 196- 203)

²NAUGARD 445 amine antioxidant, obtained from Uniroyal Chemical

tested using mixture of 42.3% toluene, 4.2% ethanol, 15.0% methanol, 25.3% isooctane, 12.7% diisobutylene and 0.5% water; 4 days at room temperature

⁴80% gasoline, 20% ethanol; 4 days at room temperature

Solvent resistance was measured by submerging a test specimen of the polyamide having a thickness of 50 mil in the solvent at a specified temperature for a certain time. The solvent resistance was rated as follows:

Excellent = no cracking, specimen remains flexible

Good = minor cracking on edge, specimen remains flexible

Mediocre = some major cracking, specimen remains flexible

Poor = major flaking and cracking, specimen becomes brittle ^■

Bad = specimen completely broken into small pieces and partially dissolved The polyaraide melt viscosity may be measured in accordance with ASTM D3236-88 using a Model DVI+ Brookfϊeld Viscometer (obtained from Brookfield Engineering Laboratories, Inc., Stoughton, MA). Softening point may be measured as a ring and ball softening point in accordance with ASTM E 28-99.

Claims

What is claimed is:

1. A polyamide which is the reaction product of a) an acid component comprising at least one dimerized Cn to C₂₄ unsaturated fatty acid and at least one C_1O-C₂₀ aliphatic dicarboxylic acid and b) an amine component comprising at least one alkylene diamine having from 2 to 8 carbon atoms.

2. A polyamide according to claim 1 wherein the acid component comprises at least one dimerized Ci₆ to C₂₀ unsaturated fatty acid.

3. A polyamide according to claim 1 wherein the acid component comprises at least one aliphatic dicarboxylic acid selected from the group consisting of decanedioic acid, undecanedioic acid, dodecanedioic acid, tetradecanedioic acid and octadecanedioic acid.

4. A polyamide according to claim 1 wherein said at least one dimerized Ci₂ to C₂₄ unsaturated fatty acid has an iodine value less than 20.

5. A polyamide according to claim 1 wherein the at least one dimerized Cj₂ to C₂₄ unsaturated fatty acid is prepared using one or more fatty acids selected from the group consisting of oleic acid, linoleic acid, linolenic acid, and mixtures thereof.

6. A polyamide according to claim 1 wherein the acid component comprises at least one dimerized C₁₈ unsaturated fatty acid.

7. A polyamide according to claim 1 wherein the acid component is additionally comprised of at least one Ci₂ to C₂₄ monocarboxylic acid.

8. A polyamide according to claim 1 wherein the acid component is additionally comprised of at least one Ci₆ to C₂₀ monocarboxylic acid.

9. A polyamide according to claim 1 wherein the acid component is additionally comprised of at least one C]₆ to C₂₀ saturated monocarboxylic acid.

10. A polyamide according to claim 1 wherein the acid component is additionally comprised of stearic acid.

11. A polyamide according to claim 1 wherein the acid component consists essentially of said at least one dimerized Cn to C₂₄ unsaturated fatty acid, at least one C1₀-C2₀ aliphatic dicarboxylic acid, and at least one C]₀ to C₂₄ monocarboxylic acid.

12. A polyamide according to claim 1 wherein the amine component comprises ethylenediamine and hexamethylenediamine.

13. A polyamide according to claim 1 wherein the amine component consists essentially of ethylenediamine and hexamethylenediamine.

14. A polyamide according to claim 1 wherein the amine component comprises ethylene diamine and hexamethylenediamine and wherein the equivalent ratio of hexamethylene diamine: ethylene diamine is from 99:1 to 60:40.

15. A polyamide according to claim 1 wherein the amine component comprises ethylene diamine and hexamethylenediamine and wherein the equivalent ratio of hexamethylene diamine: ethylene diamine is from 95:5 to 65:35.

16. A polyamide according to claim 1 wherein the amine component consists essentially of one or more alkylene diamines having the formula H₂N-(CH₂)_H-NH₂ wherein n is at least 5 on average.

17. A polyamide according to claim 1 wherein said acid component does not contain more than 5 equivalent % total of dicarboxylic acids other than said one or more C₁₀-C2₀ dicarboxylic acid and said at least one dimerized C]₂ to C₂₄ unsaturated fatty acid.

18. A polyamide according to claim 1 wherein the acid component contains less than 10 equivalent % of any dicarboxylic acid other than said at least one dimerized Cj₂ to C₂₄ unsaturated fatty acid and said at least one C₁₀-C_2O aliphatic dicarboxylic acid.

19. A polyamide according to claim 1 wherein said at least one dimerized Cj₂ to C₂₄ unsaturated acid and said at least one Ci₀ to C₂₀ aliphatic dicarboxylic acid together comprise at least 80 equivalent % of the acid component.

20. A polyamide according to claim 1 wherein said at least one C₂-C₈ alkylene diamine comprises at least 80 equivalent % of the amine component .

21. A polyamide according to claim 1 wherein said at least one C₂-C₈ alkylene diamine comprises at least 95 equivalent % of the amine component.

22. A polyamide according to claim 1 wherein the equivalent ratio of said at least one dimerized Cj₂ to C₂₄ unsaturated fatty acid to said at least one aliphatic Cio-C₂o dicarboxylic acid is from about 0.2:1 to about 0.6:1.

23. A polyamide according to claim 1 wherein the equivalent ratio of said at least one dimerized Ci₂ to C₂₄ unsaturated fatty acid to said at least one aliphatic C₁₀-C₂₀ dicarboxylic acid is from about 0.15:1 to about 0.65:1.

24. A polyamide which is the reaction product of a) 16 to 26 equivalent % C_32-4O dimer acid, b) 0.5 to 6 equivalent % monobasic fatty acid, c) 70 to 80 equivalent % tetradecanedioic acid, d) 15 to 25 equivalent % ethylenediamine, and e) 75 to 85 equivalent % hexamethylenediamine, wherein the total of a), b), and c) is from 90 to 100 equivalent % and the total of d) and e) is from 90 to 100 equivalent %.

25. A polyamide which is the reaction product of a) 16 to 26 equivalent % C₃₂-₄o dimer acid, b) 0.5 to 6 equivalent % monobasic fatty acid, c) 72 to 82 equivalent % octadecanedioic acid, and d) 90 to 100 equivalent % hexamethylenediamine, wherein the total of a), b), and c) is from 90 to 100 equivalent %.

26. A polyamide which is the reaction product of a) 28 to 38 equivalent % C_32-40 dimer acid, b) 0.5 to 6 equivalent % monobasic fatty acid, c) 60 to 70 equivalent % tetradecanedioic acid, and d) 90 to 100 equivalent % hexamethylenediamine, wherein the total of a), b), and c) is from 90 to 100 equivalent %.

27. A polyamide which is the reaction product of a) 18 to 28 equivalent % C_32-40 dimer acid, b) 0.5 to 6 equivalent % monobasic fatty acid, c) 72 to 82 equivalent % decanedioic acid, d) 13 to 23 equivalent % ethylenediamine, and e) 77 to 87 equivalent % hexamethylenediamine, wherein the total of a), b), and c) is from 90 to 100 equivalent % and the total of d) and e) is from 90 to 100 equivalent %.

28. A polyamide which is the reaction product of a) 17 to 27 equivalent % C_32-40 dimer acid, b) 0.5 to 6 equivalent % monobasic fatty acid, c) 72 to 82 equivalent % dodecanedioic acid, d) 15 to 25 equivalent % ethylenediamine, and e) 75 to 85 equivalent % hexamethylenediamine, wherein the total of a), b), and c) is from 90 to 100 equivalent % and the total of d) and e) is from 90 to 100 equivalent %.

29. An article comprising a first substrate joined to a second substrate by an adhesive, wherein said adhesive is comprised of the polyamide of claim 1.

30. The article of claim 29, wherein said article is a filter.

31. A method of adhering a first substrate to a second substrate, said method comprising applying an adhesive in molten form comprised of the polyamide of claim 1 to a surface of said first substrate to form an adhesive-coated surface, contacting said adhesive-coated surface with a surface of said second substrate while said adhesive is still in molten form, and cooling said adhesive until said adhesive solidifies.