WO2007098477A3 - Two-phase liquid cooling systems - Google Patents
Two-phase liquid cooling systems Download PDFInfo
- Publication number
- WO2007098477A3 WO2007098477A3 PCT/US2007/062517 US2007062517W WO2007098477A3 WO 2007098477 A3 WO2007098477 A3 WO 2007098477A3 US 2007062517 W US2007062517 W US 2007062517W WO 2007098477 A3 WO2007098477 A3 WO 2007098477A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cooling system
- venting
- coolant
- phase liquid
- liquid cooling
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B43/00—Arrangements for separating or purifying gases or liquids; Arrangements for vaporising the residuum of liquid refrigerant, e.g. by heat
- F25B43/04—Arrangements for separating or purifying gases or liquids; Arrangements for vaporising the residuum of liquid refrigerant, e.g. by heat for withdrawing non-condensible gases
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0258—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with means to remove contaminants, e.g. getters
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
A two-phase liquid cooling system includes an active venting system for regulating an amount of non-condensable gas within the cooling system. Various venting structures may be used to remove gases from the cooling system, some of which are designed to remove the non-condensable gases and avoid removing the vapor-phase coolant. A control system activates the venting system to achieve a desired pressure, which may be based on measured process conditions within the cooling system. A venting and refilling system may serve multiple cooling systems in a parallel arrangement. A return path of the cooling system can be tested for coolant leaks by increasing the pressure in the return path and placing a coolant detector near the path.
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US77549606P | 2006-02-21 | 2006-02-21 | |
US60/775,496 | 2006-02-21 | ||
US11/384,195 | 2006-03-17 | ||
US11/384,195 US20070193300A1 (en) | 2006-02-21 | 2006-03-17 | Two-phase liquid cooling system with active venting |
US11/466,076 | 2006-08-21 | ||
US11/466,076 US20070193721A1 (en) | 2006-02-21 | 2006-08-21 | Automated Venting and Refilling of Multiple Liquid Cooling Systems |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007098477A2 WO2007098477A2 (en) | 2007-08-30 |
WO2007098477A3 true WO2007098477A3 (en) | 2008-11-20 |
Family
ID=38438102
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2007/062517 WO2007098477A2 (en) | 2006-02-21 | 2007-02-21 | Two-phase liquid cooling systems |
Country Status (2)
Country | Link |
---|---|
US (1) | US20070193721A1 (en) |
WO (1) | WO2007098477A2 (en) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070193300A1 (en) * | 2006-02-21 | 2007-08-23 | Tilton Donald E | Two-phase liquid cooling system with active venting |
US7508665B1 (en) * | 2006-10-18 | 2009-03-24 | Isothermal Systems Research, Inc. | Server farm liquid thermal management system |
US9238398B2 (en) * | 2008-09-25 | 2016-01-19 | B/E Aerospace, Inc. | Refrigeration systems and methods for connection with a vehicle's liquid cooling system |
US9285129B2 (en) * | 2008-09-30 | 2016-03-15 | Vette Technology, Llc | Free-cooling including modular coolant distribution unit |
IT1397489B1 (en) | 2009-12-19 | 2013-01-16 | Nuovo Pignone Spa | METHOD AND SYSTEM FOR DIAGNOSTICATING COMPRESSORS. |
US8711563B2 (en) * | 2011-10-25 | 2014-04-29 | International Business Machines Corporation | Dry-cooling unit with gravity-assisted coolant flow |
US9167728B2 (en) | 2012-07-18 | 2015-10-20 | International Business Machines Corporation | Information technology equipment cooling method |
US8888898B1 (en) * | 2012-07-30 | 2014-11-18 | Google Inc. | Vacuum filling and degasification system |
CN103813688A (en) * | 2012-11-07 | 2014-05-21 | 辉达公司 | Liquid cooling system and method for preventing leakage of liquid cooling system |
US8820351B1 (en) * | 2013-06-25 | 2014-09-02 | Chilldyne, Inc. | No drip hot swap connector and method of use |
JP6394331B2 (en) * | 2013-12-27 | 2018-09-26 | 富士通株式会社 | Cooling parts and electronic equipment |
US9713286B2 (en) | 2015-03-03 | 2017-07-18 | International Business Machines Corporation | Active control for two-phase cooling |
TWI687639B (en) * | 2015-06-26 | 2020-03-11 | 美商三角設計公司 | Leak tolerant liquid cooling system employing improved air purging mechanism |
CN108029221B (en) * | 2015-09-14 | 2019-11-29 | 三菱电机株式会社 | Cooler, power inverter and cooling system |
US10638648B2 (en) * | 2016-04-28 | 2020-04-28 | Ge Energy Power Conversion Technology Ltd. | Cooling system with pressure regulation |
US10139168B2 (en) * | 2016-09-26 | 2018-11-27 | International Business Machines Corporation | Cold plate with radial expanding channels for two-phase cooling |
US10253595B2 (en) * | 2016-10-12 | 2019-04-09 | Baker Hughes, A Ge Company, Llc | Evaporative cooling using a refrigerant, a selectively permeable membrane, and a drawing fluid |
CN106659093B (en) * | 2017-01-20 | 2019-12-31 | 广东合一新材料研究院有限公司 | Data center rack and gravity spraying system thereof |
CN106659092B (en) * | 2017-01-20 | 2019-12-31 | 广东合一新材料研究院有限公司 | Data center cabinet and pressure spraying system thereof |
US10869412B2 (en) | 2018-12-05 | 2020-12-15 | Google Llc | Provisioning data center server cooling equipment |
CN112902548B (en) * | 2019-11-19 | 2022-11-04 | 英业达科技有限公司 | Cooling device |
US11317543B1 (en) * | 2020-12-01 | 2022-04-26 | Baidu Usa Llc | High power density based two phase system design |
EP4295098A1 (en) * | 2021-02-17 | 2023-12-27 | Microsoft Technology Licensing, LLC | Two phase coolant management |
CN115209675A (en) * | 2021-04-14 | 2022-10-18 | 台达电子工业股份有限公司 | Immersive cooling system |
TWI799854B (en) * | 2021-05-07 | 2023-04-21 | 緯穎科技服務股份有限公司 | Immersion cooling system, electronic apparatus having the same and pressure adjusting module |
CN114084927A (en) * | 2021-10-18 | 2022-02-25 | 江苏核电有限公司 | Equipment and method for deoxidizing cooling water of nuclear power plant equipment |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6832504B1 (en) * | 2003-11-19 | 2004-12-21 | Be Intellectual Property, Inc. | Liquid sensing system for an aircraft galley cooler using a two phase working fluid |
US6880350B2 (en) * | 2002-09-13 | 2005-04-19 | Isothermal Systems Research, Inc. | Dynamic spray system |
US6889509B1 (en) * | 2002-09-13 | 2005-05-10 | Isothermal Systems Research Inc. | Coolant recovery system |
US6952346B2 (en) * | 2004-02-24 | 2005-10-04 | Isothermal Systems Research, Inc | Etched open microchannel spray cooling |
US6958911B2 (en) * | 2004-01-30 | 2005-10-25 | Isothermal Systems Research, Inc. | Low momentum loss fluid manifold system |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5220804A (en) * | 1991-12-09 | 1993-06-22 | Isothermal Systems Research, Inc | High heat flux evaporative spray cooling |
US5314529A (en) * | 1993-09-13 | 1994-05-24 | Tilton Donald E | Entrained droplet separator |
US5719444A (en) * | 1996-04-26 | 1998-02-17 | Tilton; Charles L. | Packaging and cooling system for power semi-conductor |
US5860602A (en) * | 1996-12-06 | 1999-01-19 | Tilton; Charles L | Laminated array of pressure swirl atomizers |
US5713327A (en) * | 1997-01-03 | 1998-02-03 | Tilton; Charles L. | Liquid fuel injection device with pressure-swirl atomizers |
US5880931A (en) * | 1998-03-20 | 1999-03-09 | Tilton; Donald E. | Spray cooled circuit card cage |
US6447270B1 (en) * | 1998-09-17 | 2002-09-10 | Walbro Corporation | Brushless coolant pump and cooling system |
US5933700A (en) * | 1998-09-21 | 1999-08-03 | Tilton; Charles L | Method for manufacturing pressure swirl atomizers |
US6104610A (en) * | 1999-07-29 | 2000-08-15 | Tilton; Charles L. | EMI shielding fluid control apparatus |
US20020071293A1 (en) * | 2000-07-13 | 2002-06-13 | Eden Richard C. | Power semiconductor switching devices, power converters, integrated circuit assemblies, integrated circuitry, power current switching methods, methods of forming a power semiconductor switching device, power conversion methods, power semiconductor switching device packaging methods, and methods a of forming power transistor |
US6955062B2 (en) * | 2002-03-11 | 2005-10-18 | Isothermal Systems Research, Inc. | Spray cooling system for transverse thin-film evaporative spray cooling |
US6857283B2 (en) * | 2002-09-13 | 2005-02-22 | Isothermal Systems Research, Inc. | Semiconductor burn-in thermal management system |
US6889515B2 (en) * | 2002-11-12 | 2005-05-10 | Isothermal Systems Research, Inc. | Spray cooling system |
US6976528B1 (en) * | 2003-02-18 | 2005-12-20 | Isothermal Systems Research, Inc. | Spray cooling system for extreme environments |
-
2006
- 2006-08-21 US US11/466,076 patent/US20070193721A1/en not_active Abandoned
-
2007
- 2007-02-21 WO PCT/US2007/062517 patent/WO2007098477A2/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6880350B2 (en) * | 2002-09-13 | 2005-04-19 | Isothermal Systems Research, Inc. | Dynamic spray system |
US6889509B1 (en) * | 2002-09-13 | 2005-05-10 | Isothermal Systems Research Inc. | Coolant recovery system |
US6832504B1 (en) * | 2003-11-19 | 2004-12-21 | Be Intellectual Property, Inc. | Liquid sensing system for an aircraft galley cooler using a two phase working fluid |
US6958911B2 (en) * | 2004-01-30 | 2005-10-25 | Isothermal Systems Research, Inc. | Low momentum loss fluid manifold system |
US6952346B2 (en) * | 2004-02-24 | 2005-10-04 | Isothermal Systems Research, Inc | Etched open microchannel spray cooling |
Also Published As
Publication number | Publication date |
---|---|
US20070193721A1 (en) | 2007-08-23 |
WO2007098477A2 (en) | 2007-08-30 |
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