WO2007098187A3 - Active electrode and method for manufacturing it using flex circuit technology - Google Patents

Active electrode and method for manufacturing it using flex circuit technology Download PDF

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Publication number
WO2007098187A3
WO2007098187A3 PCT/US2007/004472 US2007004472W WO2007098187A3 WO 2007098187 A3 WO2007098187 A3 WO 2007098187A3 US 2007004472 W US2007004472 W US 2007004472W WO 2007098187 A3 WO2007098187 A3 WO 2007098187A3
Authority
WO
WIPO (PCT)
Prior art keywords
flex circuit
active electrode
manufacturing
over
circuit technology
Prior art date
Application number
PCT/US2007/004472
Other languages
French (fr)
Other versions
WO2007098187A2 (en
Inventor
Kenneth M Curry
Original Assignee
Edwards Lifesciences Corp
Kenneth M Curry
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Edwards Lifesciences Corp, Kenneth M Curry filed Critical Edwards Lifesciences Corp
Priority to CN200780001459.1A priority Critical patent/CN101356865B/en
Priority to CA2630535A priority patent/CA2630535C/en
Priority to EP07751245A priority patent/EP1989930B1/en
Priority to DE602007006433T priority patent/DE602007006433D1/en
Priority to AT07751245T priority patent/ATE468006T1/en
Priority to AU2007217768A priority patent/AU2007217768A1/en
Priority to JP2008556402A priority patent/JP5207387B2/en
Publication of WO2007098187A2 publication Critical patent/WO2007098187A2/en
Publication of WO2007098187A3 publication Critical patent/WO2007098187A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/145—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue
    • A61B5/1486—Measuring characteristics of blood in vivo, e.g. gas concentration, pH value; Measuring characteristics of body fluids or tissues, e.g. interstitial fluid, cerebral tissue using enzyme electrodes, e.g. with immobilised oxidase
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
    • A61B2562/125—Manufacturing methods specially adapted for producing sensors for in-vivo measurements characterised by the manufacture of electrodes
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/02—Details
    • A61N1/04—Electrodes
    • A61N1/05—Electrodes for implantation or insertion into the body, e.g. heart electrode
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/28—Electrolytic cell components
    • G01N27/30—Electrodes, e.g. test electrodes; Half-cells
    • G01N27/327—Biochemical electrodes, e.g. electrical or mechanical details for in vitro measurements
    • G01N27/3271—Amperometric enzyme electrodes for analytes in body fluids, e.g. glucose in blood
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0574—Stacked resist layers used for different processes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base
    • Y10T29/4916—Simultaneous circuit manufacturing

Abstract

A method of creating an active electrode (10) that includes providing a flex circuit (100) having an electrode (120) made of a first material and providin a first mask (200) over the flex circuit, the first mask having an offset region (305) and an opening (220) that exposes the electrode. The method also includes depositing a second material (300) over the offset region and the opening, the second material being different from the first material an providing a second mask (400) over the second material, the second mask havin a opening (405) over a portion of the second material that is over the offset region.
PCT/US2007/004472 2006-02-27 2007-02-22 Active electrode and method for manufacturing it using flex circuit technology WO2007098187A2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
CN200780001459.1A CN101356865B (en) 2006-02-27 2007-02-22 Active electrode, and method for using flex circuit technology to create the active electrode
CA2630535A CA2630535C (en) 2006-02-27 2007-02-22 Method and apparatus for using flex circuit technology to create an electrode
EP07751245A EP1989930B1 (en) 2006-02-27 2007-02-22 Method for manufacturing an active electrode using flex circuit technology and flex circuit having such an electrode
DE602007006433T DE602007006433D1 (en) 2006-02-27 2007-02-22 METHOD FOR PRODUCING AN ACTIVE ELECTRODE USING FLEXIBLE CIRCUIT TECHNOLOGY AND FLEXIBLE CIRCUIT COMPRISING SUCH ELECTRODE
AT07751245T ATE468006T1 (en) 2006-02-27 2007-02-22 METHOD FOR PRODUCING AN ACTIVE ELECTRODE USING FLEXIBLE CIRCUIT TECHNOLOGY AND FLEXIBLE CIRCUIT COMPRISING SUCH AN ELECTRODE
AU2007217768A AU2007217768A1 (en) 2006-02-27 2007-02-22 Active electrode and method for manufacturing it using flex circuit technology
JP2008556402A JP5207387B2 (en) 2006-02-27 2007-02-22 Method for producing electrode and electrode

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US77713506P 2006-02-27 2006-02-27
US60/777,135 2006-02-27

Publications (2)

Publication Number Publication Date
WO2007098187A2 WO2007098187A2 (en) 2007-08-30
WO2007098187A3 true WO2007098187A3 (en) 2008-04-10

Family

ID=38437965

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/004472 WO2007098187A2 (en) 2006-02-27 2007-02-22 Active electrode and method for manufacturing it using flex circuit technology

Country Status (9)

Country Link
US (2) US8065796B2 (en)
EP (2) EP1989930B1 (en)
JP (1) JP5207387B2 (en)
CN (1) CN101356865B (en)
AT (1) ATE468006T1 (en)
AU (1) AU2007217768A1 (en)
CA (1) CA2630535C (en)
DE (1) DE602007006433D1 (en)
WO (1) WO2007098187A2 (en)

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9155496B2 (en) 1997-03-04 2015-10-13 Dexcom, Inc. Low oxygen in vivo analyte sensor
US7899511B2 (en) 2004-07-13 2011-03-01 Dexcom, Inc. Low oxygen in vivo analyte sensor
US8465425B2 (en) 1998-04-30 2013-06-18 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US8480580B2 (en) 1998-04-30 2013-07-09 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US9066695B2 (en) 1998-04-30 2015-06-30 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US8974386B2 (en) 1998-04-30 2015-03-10 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US6175752B1 (en) 1998-04-30 2001-01-16 Therasense, Inc. Analyte monitoring device and methods of use
US8688188B2 (en) 1998-04-30 2014-04-01 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US8346337B2 (en) 1998-04-30 2013-01-01 Abbott Diabetes Care Inc. Analyte monitoring device and methods of use
US6949816B2 (en) 2003-04-21 2005-09-27 Motorola, Inc. Semiconductor component having first surface area for electrically coupling to a semiconductor chip and second surface area for electrically coupling to a substrate, and method of manufacturing same
US6560471B1 (en) 2001-01-02 2003-05-06 Therasense, Inc. Analyte monitoring device and methods of use
US20030032874A1 (en) 2001-07-27 2003-02-13 Dexcom, Inc. Sensor head for use with implantable devices
US8858434B2 (en) 2004-07-13 2014-10-14 Dexcom, Inc. Transcutaneous analyte sensor
WO2007120442A2 (en) 2003-07-25 2007-10-25 Dexcom, Inc. Dual electrode system for a continuous analyte sensor
US8275437B2 (en) 2003-08-01 2012-09-25 Dexcom, Inc. Transcutaneous analyte sensor
US20190357827A1 (en) 2003-08-01 2019-11-28 Dexcom, Inc. Analyte sensor
US6931327B2 (en) * 2003-08-01 2005-08-16 Dexcom, Inc. System and methods for processing analyte sensor data
US20100168657A1 (en) 2003-08-01 2010-07-01 Dexcom, Inc. System and methods for processing analyte sensor data
US7591801B2 (en) 2004-02-26 2009-09-22 Dexcom, Inc. Integrated delivery device for continuous glucose sensor
US7920906B2 (en) 2005-03-10 2011-04-05 Dexcom, Inc. System and methods for processing analyte sensor data for sensor calibration
US9247900B2 (en) 2004-07-13 2016-02-02 Dexcom, Inc. Analyte sensor
US8532730B2 (en) 2006-10-04 2013-09-10 Dexcom, Inc. Analyte sensor
US8423114B2 (en) 2006-10-04 2013-04-16 Dexcom, Inc. Dual electrode system for a continuous analyte sensor
US11633133B2 (en) 2003-12-05 2023-04-25 Dexcom, Inc. Dual electrode system for a continuous analyte sensor
EP1711790B1 (en) 2003-12-05 2010-09-08 DexCom, Inc. Calibration techniques for a continuous analyte sensor
US8287453B2 (en) 2003-12-05 2012-10-16 Dexcom, Inc. Analyte sensor
US8364231B2 (en) 2006-10-04 2013-01-29 Dexcom, Inc. Analyte sensor
US8808228B2 (en) 2004-02-26 2014-08-19 Dexcom, Inc. Integrated medicament delivery device for use with continuous analyte sensor
US8452368B2 (en) 2004-07-13 2013-05-28 Dexcom, Inc. Transcutaneous analyte sensor
US7857760B2 (en) 2004-07-13 2010-12-28 Dexcom, Inc. Analyte sensor
US7905833B2 (en) 2004-07-13 2011-03-15 Dexcom, Inc. Transcutaneous analyte sensor
US20060270922A1 (en) 2004-07-13 2006-11-30 Brauker James H Analyte sensor
US8565848B2 (en) 2004-07-13 2013-10-22 Dexcom, Inc. Transcutaneous analyte sensor
US7783333B2 (en) 2004-07-13 2010-08-24 Dexcom, Inc. Transcutaneous medical device with variable stiffness
US8133178B2 (en) 2006-02-22 2012-03-13 Dexcom, Inc. Analyte sensor
US20090076360A1 (en) 2007-09-13 2009-03-19 Dexcom, Inc. Transcutaneous analyte sensor
US9757061B2 (en) 2006-01-17 2017-09-12 Dexcom, Inc. Low oxygen in vivo analyte sensor
US20100305420A1 (en) * 2006-02-27 2010-12-02 Edwards Lifesciences Corporation Flexible circuit and method for forming the same
US8065796B2 (en) 2006-02-27 2011-11-29 Edwards Lifesciences Corporation Method and apparatus for using flex circuit technology to create an electrode
US7831287B2 (en) 2006-10-04 2010-11-09 Dexcom, Inc. Dual electrode system for a continuous analyte sensor
US20080306434A1 (en) 2007-06-08 2008-12-11 Dexcom, Inc. Integrated medicament delivery device for use with continuous analyte sensor
EP4159114B1 (en) 2007-10-09 2024-04-10 DexCom, Inc. Integrated insulin delivery system with continuous glucose sensor
US8000918B2 (en) 2007-10-23 2011-08-16 Edwards Lifesciences Corporation Monitoring and compensating for temperature-related error in an electrochemical sensor
US8417312B2 (en) 2007-10-25 2013-04-09 Dexcom, Inc. Systems and methods for processing sensor data
US20090188811A1 (en) 2007-11-28 2009-07-30 Edwards Lifesciences Corporation Preparation and maintenance of sensors
CA2715628A1 (en) 2008-02-21 2009-08-27 Dexcom, Inc. Systems and methods for processing, transmitting and displaying sensor data
US8396528B2 (en) 2008-03-25 2013-03-12 Dexcom, Inc. Analyte sensor
US8900431B2 (en) 2008-08-27 2014-12-02 Edwards Lifesciences Corporation Analyte sensor
US9408575B2 (en) 2009-04-29 2016-08-09 Bio-Signal Group Corp. EEG kit
CN102712946A (en) 2009-10-30 2012-10-03 爱德华兹生命科学公司 Sensor layers and methods related thereto
EP2588624A2 (en) 2010-06-30 2013-05-08 Edwards Lifesciences Corporation Analyte sensor
US20130199944A1 (en) 2010-06-30 2013-08-08 Edwards Lifesciences Corporation Analyte sensor
WO2012142502A2 (en) 2011-04-15 2012-10-18 Dexcom Inc. Advanced analyte sensor calibration and error detection
WO2013126798A2 (en) 2012-02-23 2013-08-29 Bio-Signal Group Corp. Shielded multi-channel eeg headset systems and methods
US11331022B2 (en) 2017-10-24 2022-05-17 Dexcom, Inc. Pre-connected analyte sensors
CN212438615U (en) 2017-10-24 2021-02-02 德克斯康公司 Wearable device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0351851A2 (en) * 1988-07-21 1990-01-24 Microelectronics and Computer Technology Corporation Method and apparatus for making a flexible interconnect
US5914179A (en) * 1995-10-03 1999-06-22 Nippon Mektron Ltd. Flexible circuit board and production method therefor
WO2002102224A2 (en) * 2001-06-18 2002-12-27 Given Imaging Ltd. In vivo sensing device with a circuit board having rigid sections and flexible sections
US20040183213A1 (en) * 2001-12-28 2004-09-23 Chi-Hsing Hsu Semiconductor packaging substrate and method of producing the same

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4937444A (en) 1982-09-29 1990-06-26 Vpl Research, Inc. Optical flex sensor
US4542291A (en) 1982-09-29 1985-09-17 Vpl Research Inc. Optical flex sensor
US5423883A (en) 1993-07-14 1995-06-13 Pacesetter, Inc. Implantable myocardial stimulation lead with sensors thereon
JP2622531B2 (en) * 1994-06-03 1997-06-18 株式会社イースタン Colored solder material and method for forming colored film on soldered part
KR0140657B1 (en) * 1994-12-31 1998-06-01 김주용 Manufacturing method of semiconductor device
US5875102A (en) * 1995-12-20 1999-02-23 Intel Corporation Eclipse via in pad structure
AU2067597A (en) 1996-03-07 1997-09-22 Axon Engineering, Inc. Polymer-metal foil structure for neural stimulating electrodes
US5660321A (en) * 1996-03-29 1997-08-26 Intel Corporation Method for controlling solder bump height and volume for substrates containing both pad-on and pad-off via contacts
JP2910670B2 (en) 1996-04-12 1999-06-23 日本電気株式会社 Semiconductor mounting structure
GB9801286D0 (en) 1998-01-21 1998-03-18 Univ Cambridge Tech Sensor
JP2002011174A (en) 2000-06-28 2002-01-15 Toyomaru Industry Co Ltd Game machine
JP2002111174A (en) * 2000-09-27 2002-04-12 Nitto Denko Corp Method for manufacturing wiring circuit board
JP2004532526A (en) 2001-05-03 2004-10-21 マシモ・コーポレイション Flex circuit shield optical sensor and method of manufacturing the flex circuit shield optical sensor
US6885107B2 (en) 2002-08-29 2005-04-26 Micron Technology, Inc. Flip-chip image sensor packages and methods of fabrication
JP3781118B2 (en) * 2003-03-03 2006-05-31 セイコーエプソン株式会社 Wiring board manufacturing method
CN1301048C (en) 2003-03-03 2007-02-14 精工爱普生株式会社 Method for producing distributing base board
JP2004349331A (en) * 2003-05-20 2004-12-09 Renesas Technology Corp Power mosfet, application device thereof and method for manufacturing the same
US20060180245A1 (en) * 2005-02-15 2006-08-17 Tippy Wicker Lead-free solder paste
US8065796B2 (en) 2006-02-27 2011-11-29 Edwards Lifesciences Corporation Method and apparatus for using flex circuit technology to create an electrode

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0351851A2 (en) * 1988-07-21 1990-01-24 Microelectronics and Computer Technology Corporation Method and apparatus for making a flexible interconnect
US5914179A (en) * 1995-10-03 1999-06-22 Nippon Mektron Ltd. Flexible circuit board and production method therefor
WO2002102224A2 (en) * 2001-06-18 2002-12-27 Given Imaging Ltd. In vivo sensing device with a circuit board having rigid sections and flexible sections
US20040183213A1 (en) * 2001-12-28 2004-09-23 Chi-Hsing Hsu Semiconductor packaging substrate and method of producing the same

Also Published As

Publication number Publication date
EP2131635A1 (en) 2009-12-09
CN101356865A (en) 2009-01-28
CN101356865B (en) 2012-06-06
US8065796B2 (en) 2011-11-29
AU2007217768A1 (en) 2007-08-30
WO2007098187A2 (en) 2007-08-30
EP1989930B1 (en) 2010-05-12
US20120037406A1 (en) 2012-02-16
US20070200254A1 (en) 2007-08-30
ATE468006T1 (en) 2010-05-15
CA2630535A1 (en) 2007-08-30
DE602007006433D1 (en) 2010-06-24
JP5207387B2 (en) 2013-06-12
JP2009528677A (en) 2009-08-06
US8546701B2 (en) 2013-10-01
EP1989930A2 (en) 2008-11-12
CA2630535C (en) 2014-12-23

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