WO2007098119A3 - Plasmon tomography - Google Patents

Plasmon tomography Download PDF

Info

Publication number
WO2007098119A3
WO2007098119A3 PCT/US2007/004290 US2007004290W WO2007098119A3 WO 2007098119 A3 WO2007098119 A3 WO 2007098119A3 US 2007004290 W US2007004290 W US 2007004290W WO 2007098119 A3 WO2007098119 A3 WO 2007098119A3
Authority
WO
WIPO (PCT)
Prior art keywords
plasmon
plasmon energy
determined
measurement position
paths
Prior art date
Application number
PCT/US2007/004290
Other languages
French (fr)
Other versions
WO2007098119A9 (en
WO2007098119A2 (en
Inventor
Roderick A Hyde
Original Assignee
Searete Llc
Roderick A Hyde
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/355,918 external-priority patent/US7466420B2/en
Application filed by Searete Llc, Roderick A Hyde filed Critical Searete Llc
Priority to JP2008555410A priority Critical patent/JP5308166B2/en
Priority to EP07751076A priority patent/EP1984862A4/en
Priority to KR1020087022578A priority patent/KR101371122B1/en
Publication of WO2007098119A2 publication Critical patent/WO2007098119A2/en
Publication of WO2007098119A9 publication Critical patent/WO2007098119A9/en
Publication of WO2007098119A3 publication Critical patent/WO2007098119A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
    • G03F9/703—Gap setting, e.g. in proximity printer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7038—Alignment for proximity or contact printer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Multimedia (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)

Abstract

Plasmon energy is produced by exciting a plasmon resonance at at least one excitation position on a first surface of a first material, and the plasmon energy is detected at at least one measurement position on the first surface after the plasmon energy has propagated from the at least one excitation position to the at least one measurement position. An attenuation of plasmon energy is determined along a plurality of paths between the at least one excitation position and the at least one measurement position, and relative distances between the first surface and a second surface of a second material are determined at a plurality of points on at least one of the surfaces based on the determined attenuation of plasmon energy along the plurality of paths.
PCT/US2007/004290 2006-02-16 2007-02-16 Plasmon tomography WO2007098119A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008555410A JP5308166B2 (en) 2006-02-16 2007-02-16 Plasmon Tomography
EP07751076A EP1984862A4 (en) 2006-02-16 2007-02-16 Plasmon tomography
KR1020087022578A KR101371122B1 (en) 2006-02-16 2007-02-16 Plasmon tomography

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/355,918 2006-02-16
US11/355,918 US7466420B2 (en) 2006-02-16 2006-02-16 Plasmon tomography
US11/402,305 US7463359B2 (en) 2006-02-16 2006-04-11 Plasmon tomography
US11/402,305 2006-04-11

Publications (3)

Publication Number Publication Date
WO2007098119A2 WO2007098119A2 (en) 2007-08-30
WO2007098119A9 WO2007098119A9 (en) 2007-11-01
WO2007098119A3 true WO2007098119A3 (en) 2008-12-31

Family

ID=38437931

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/004290 WO2007098119A2 (en) 2006-02-16 2007-02-16 Plasmon tomography

Country Status (1)

Country Link
WO (1) WO2007098119A2 (en)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5025147A (en) * 1987-09-25 1991-06-18 Ernst Leitz Wetzlar, Gmbh Sensor for converting a distance to optical and further to electrical energy, and surface scanning apparatus using same
US20020044285A1 (en) * 2000-07-21 2002-04-18 Pedersen Henrik Chresten Coupling elements for surface plasmon resonance sensors
US20040218185A1 (en) * 2003-05-01 2004-11-04 Canon Kabushiki Kaisha Position sensor, method for detecting horizontal and vertical position, alignment apparatus including position sensor, and method for horizontal and vertical alignment
US20040228577A1 (en) * 2000-10-30 2004-11-18 Bardia Pezeshki Laser and fiber coupling control
US20050191427A1 (en) * 2003-02-21 2005-09-01 California Institute Of Technology Selective functionalization of carbon nanotube tips allowing fabrication of new classes of nanoscale sensing and manipulation tools
US20050213868A1 (en) * 2004-03-29 2005-09-29 Cunningham Brian T Photonic crystal defect cavity biosensor
US20050226579A1 (en) * 2004-04-08 2005-10-13 Yoel Fink Photonic crystal waveguides and systems using such waveguides
US20050257709A1 (en) * 2003-08-28 2005-11-24 Tony Mule Systems and methods for three-dimensional lithography and nano-indentation
US20050281996A1 (en) * 1998-06-08 2005-12-22 Stuart Harbron Novel catalysts
US6980716B1 (en) * 2001-03-30 2005-12-27 Arizona Board Of Regents Coherent evanescent wave imaging

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5025147A (en) * 1987-09-25 1991-06-18 Ernst Leitz Wetzlar, Gmbh Sensor for converting a distance to optical and further to electrical energy, and surface scanning apparatus using same
US20050281996A1 (en) * 1998-06-08 2005-12-22 Stuart Harbron Novel catalysts
US20020044285A1 (en) * 2000-07-21 2002-04-18 Pedersen Henrik Chresten Coupling elements for surface plasmon resonance sensors
US20040228577A1 (en) * 2000-10-30 2004-11-18 Bardia Pezeshki Laser and fiber coupling control
US6980716B1 (en) * 2001-03-30 2005-12-27 Arizona Board Of Regents Coherent evanescent wave imaging
US20050191427A1 (en) * 2003-02-21 2005-09-01 California Institute Of Technology Selective functionalization of carbon nanotube tips allowing fabrication of new classes of nanoscale sensing and manipulation tools
US20040218185A1 (en) * 2003-05-01 2004-11-04 Canon Kabushiki Kaisha Position sensor, method for detecting horizontal and vertical position, alignment apparatus including position sensor, and method for horizontal and vertical alignment
US20050257709A1 (en) * 2003-08-28 2005-11-24 Tony Mule Systems and methods for three-dimensional lithography and nano-indentation
US20050213868A1 (en) * 2004-03-29 2005-09-29 Cunningham Brian T Photonic crystal defect cavity biosensor
US20050226579A1 (en) * 2004-04-08 2005-10-13 Yoel Fink Photonic crystal waveguides and systems using such waveguides

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1984862A4 *

Also Published As

Publication number Publication date
WO2007098119A9 (en) 2007-11-01
WO2007098119A2 (en) 2007-08-30

Similar Documents

Publication Publication Date Title
WO2008054457A3 (en) Plasmon tomography
DE602006016264D1 (en)
JP2010517017A5 (en)
WO2011044060A3 (en) Combining seismic data from sensors to attenuate noise
WO2009045938A3 (en) Determining correction factors representing effects of different portions of a lining structure
DE602007001262D1 (en) Ultrasonic probe with deflection sensor
MX2009005963A (en) Human antibodies to human delta like ligand 4.
DE602006019275D1 (en) NITRITE DETECTION TECHNOLOGY
FR2911968B1 (en) ULTRASONIC PROBE.
FR2893406B1 (en) MEASURING PROBE, IN PARTICULAR FOR A DEVICE FOR MEASURING THE THICK LAYER THICKNESS.
WO2007124361A3 (en) Soluble b7-h1
WO2007101144A3 (en) Immersed fuel level sensor
DE602005018377D1 (en) Examination apparatus with ultrasound probe, ultrasound examination apparatus with an ultrasound probe
WO2010077649A3 (en) Apparatus and methods for estimating downhole field compositions
WO2008001043A8 (en) Measurement of aerofoil blades
WO2007140185A3 (en) Methods for non-invasive analyte measurement
DE502007004324D1 (en) QUICK COUPLING WITH TOOL DETECTION.
WO2008107768A3 (en) Methods and apparatus for performing moving seismic checkshots
FR2898671B1 (en) SYSTEM FOR MEASURING RATINGS WITHIN A HOLLOW SHAFT, IN PARTICULAR AERONAUTICAL TURBOMACHINE
BRPI0909757A2 (en) annular micro-space detection using lamb waves
WO2009068975A3 (en) Method and apparatus for determining formation parameters using a seismic tool array
EP2098876A4 (en) The method for determining the minimum measurement distance of antenna
DE502005010530D1 (en) SENSOR WITH CAPACITIVE MEASUREMENT PRINCIPLE
WO2008157619A3 (en) Total internal reflection displacement scale
ATE400859T1 (en) MEASUREMENT TRANSDUCER WITH AT LEAST ONE SAW ELEMENT

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 2007751076

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2008555410

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 1020087022578

Country of ref document: KR