WO2007085015A3 - Acoustic energy system, method and apparatus for processing flat articles - Google Patents

Acoustic energy system, method and apparatus for processing flat articles Download PDF

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Publication number
WO2007085015A3
WO2007085015A3 PCT/US2007/060850 US2007060850W WO2007085015A3 WO 2007085015 A3 WO2007085015 A3 WO 2007085015A3 US 2007060850 W US2007060850 W US 2007060850W WO 2007085015 A3 WO2007085015 A3 WO 2007085015A3
Authority
WO
WIPO (PCT)
Prior art keywords
transducer
flat article
liquid
rotatable support
acoustic energy
Prior art date
Application number
PCT/US2007/060850
Other languages
French (fr)
Other versions
WO2007085015A2 (en
Inventor
Fani Pejman
John Korbler
Mark Rouillard
James Brown
Chad Hosack
Original Assignee
Akrion Technologies Inc
Fani Pejman
John Korbler
Mark Rouillard
James Brown
Chad Hosack
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Akrion Technologies Inc, Fani Pejman, John Korbler, Mark Rouillard, James Brown, Chad Hosack filed Critical Akrion Technologies Inc
Priority to JP2008551568A priority Critical patent/JP4959721B2/en
Priority to KR1020087020402A priority patent/KR101369197B1/en
Publication of WO2007085015A2 publication Critical patent/WO2007085015A2/en
Publication of WO2007085015A3 publication Critical patent/WO2007085015A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Abstract

A system, apparatus and method for processing this flat articles, such as semiconductor wafers, with acoustical energy. In a cleaning process, the inventive system, apparatus and method can remove particles from both sides of a wafer more efficiently and effectively in one aspect, the invention is a system for processing flat articles comprising: a rotatable support for supporting a flat article; a first dispenser for applying liquid to a first surface of a flat article on the rotatable support; a second dispenser for applying liquid to a second surface of a flat article on the rotatable support; a first transducer assembly comprising a first transducer for generating acoustic energy and a first transmitter acoustically coupled to the first transducer, the first transducer assembly positioned so that when the first dispenser applies liquid to the first surface of a flat article on the rotatable support, a first meniscus of liquid is formed between a portion of the first transmitter and the first surface of the flat article; and a second transducer assembly comprising a second transducer for generating acoustic energy and a second transmitter acoustically coupled to the second transducer, the second transducer assembly positioned so that when the second dispenser applies liquid to the second surface of the flat article on the rotatable support, a second meniscus of liquid is formed between a portion of the second transmitter and the second surface of the flat article.
PCT/US2007/060850 2006-01-20 2007-01-22 Acoustic energy system, method and apparatus for processing flat articles WO2007085015A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008551568A JP4959721B2 (en) 2006-01-20 2007-01-22 Acoustic energy system, method and apparatus for processing flat objects
KR1020087020402A KR101369197B1 (en) 2006-01-20 2007-01-22 Acoustic energy system, method and apparatus for processing flat articles

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
US76082006P 2006-01-20 2006-01-20
US60/760,820 2006-01-20
US83796506P 2006-08-16 2006-08-16
US60/837,965 2006-08-16
US85093006P 2006-10-11 2006-10-11
US60/850,930 2006-10-11
US88597807P 2007-01-22 2007-01-22
US11/625,556 US7784478B2 (en) 2006-01-20 2007-01-22 Acoustic energy system, method and apparatus for processing flat articles
US60/885,978 2007-01-22
US11/625,556 2007-01-22

Publications (2)

Publication Number Publication Date
WO2007085015A2 WO2007085015A2 (en) 2007-07-26
WO2007085015A3 true WO2007085015A3 (en) 2008-01-24

Family

ID=38284344

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/060850 WO2007085015A2 (en) 2006-01-20 2007-01-22 Acoustic energy system, method and apparatus for processing flat articles

Country Status (4)

Country Link
US (3) US7784478B2 (en)
JP (1) JP4959721B2 (en)
KR (1) KR101369197B1 (en)
WO (1) WO2007085015A2 (en)

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EP2270838B1 (en) * 2009-07-02 2019-06-12 IMEC vzw Method and apparatus for controlling optimal operation of acoustic cleaning
US9796000B2 (en) * 2011-07-04 2017-10-24 Product Systems Incorporated Uniform fluid manifold for acoustic transducer
US8691022B1 (en) * 2012-12-18 2014-04-08 Lam Research Ag Method and apparatus for processing wafer-shaped articles
KR102130372B1 (en) * 2013-02-02 2020-07-06 나우라 아크리온 인코포레이티드 System for processing substrates using acoustic energy
WO2015042263A1 (en) * 2013-09-18 2015-03-26 Akrion Systems Llc System, apparatus, and method for processing substrates using acoustic energy
CN103776477A (en) * 2014-01-24 2014-05-07 深圳市华星光电技术有限公司 Swing type sensor module
US10688536B2 (en) 2014-02-24 2020-06-23 The Boeing Company System and method for surface cleaning
US10488108B2 (en) 2014-07-01 2019-11-26 Heat Technologies, Inc. Indirect acoustic drying system and method
WO2016014960A1 (en) 2014-07-24 2016-01-28 Heat Technologies, Inc. Acoustic-assisted heat and mass transfer device
CN105983552B (en) * 2015-02-15 2019-12-24 盛美半导体设备（上海）有限公司 Anti-falling semiconductor cleaning device
US10910244B2 (en) * 2015-05-20 2021-02-02 Acm Research, Inc. Methods and system for cleaning semiconductor wafers
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Also Published As

Publication number Publication date
US8316869B2 (en) 2012-11-27
US7784478B2 (en) 2010-08-31
US9305768B2 (en) 2016-04-05
US20130333723A1 (en) 2013-12-19
KR20080107381A (en) 2008-12-10
WO2007085015A2 (en) 2007-07-26
JP2009524258A (en) 2009-06-25
KR101369197B1 (en) 2014-03-27
US20070169800A1 (en) 2007-07-26
JP4959721B2 (en) 2012-06-27
US20100326464A1 (en) 2010-12-30

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