WO2007074567A8 - 光・電気複合配線板及びその製造方法 - Google Patents

光・電気複合配線板及びその製造方法

Info

Publication number
WO2007074567A8
WO2007074567A8 PCT/JP2006/319781 JP2006319781W WO2007074567A8 WO 2007074567 A8 WO2007074567 A8 WO 2007074567A8 JP 2006319781 W JP2006319781 W JP 2006319781W WO 2007074567 A8 WO2007074567 A8 WO 2007074567A8
Authority
WO
WIPO (PCT)
Prior art keywords
insulating layer
core
optical
wiring board
lower insulating
Prior art date
Application number
PCT/JP2006/319781
Other languages
English (en)
French (fr)
Other versions
WO2007074567A1 (ja
Inventor
Hiroaki Kodama
Kazuhito Yamada
Original Assignee
Ibiden Co Ltd
Hiroaki Kodama
Kazuhito Yamada
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd, Hiroaki Kodama, Kazuhito Yamada filed Critical Ibiden Co Ltd
Priority to JP2007551859A priority Critical patent/JPWO2007074567A1/ja
Priority to EP06821810.6A priority patent/EP1967876A4/en
Publication of WO2007074567A1 publication Critical patent/WO2007074567A1/ja
Publication of WO2007074567A8 publication Critical patent/WO2007074567A8/ja
Priority to US12/118,344 priority patent/US7724989B2/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/12002—Three-dimensional structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0108—Male die used for patterning, punching or transferring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated

Abstract

　光・電気複合配線板１０は、下部クラッド２２を兼ねる下部絶縁層３２と、上部クラッド２４を兼ねる上部絶縁層３４と、下部絶縁層３２と上部絶縁層３４の間に設けられ所定の光配線パターンを持つコア２６と、下部絶縁層３２と上部絶縁層３４の間にてコア２６と並設され所定の電気配線パターンを持つ導体層４０とを備えている。ここで、コア２６及び導体層４０は、下部絶縁層３２に光配線用凹部３２ａ及び電気配線用凹部３２ｂをプレス加工により形成し、各凹部３２ａ，３２ｂにそれぞれコア材料及び導体材料を充填し、その後、コア材料及び導体材料を下部絶縁層３２の上面と面一になるまで研磨する、という短い製造工程で形成される。
PCT/JP2006/319781 2005-12-27 2006-10-03 光・電気複合配線板及びその製造方法 WO2007074567A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007551859A JPWO2007074567A1 (ja) 2005-12-27 2006-10-03 光・電気複合配線板及びその製造方法
EP06821810.6A EP1967876A4 (en) 2005-12-27 2006-10-03 OPTICAL AND ELECTRICAL COMPOSITE WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
US12/118,344 US7724989B2 (en) 2005-12-27 2008-05-09 Optical/electrical composite wiring board and a manufacturing method thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005375878 2005-12-27
JP2005-375878 2005-12-27

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/118,344 Continuation US7724989B2 (en) 2005-12-27 2008-05-09 Optical/electrical composite wiring board and a manufacturing method thereof

Publications (2)

Publication Number Publication Date
WO2007074567A1 WO2007074567A1 (ja) 2007-07-05
WO2007074567A8 true WO2007074567A8 (ja) 2008-02-07

Family

ID=38217793

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/319781 WO2007074567A1 (ja) 2005-12-27 2006-10-03 光・電気複合配線板及びその製造方法

Country Status (4)

Country Link
US (1) US7724989B2 (ja)
EP (1) EP1967876A4 (ja)
JP (1) JPWO2007074567A1 (ja)
WO (1) WO2007074567A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7375294B2 (ja) 2017-07-28 2023-11-08 Tdk株式会社 導電性基板、電子装置及び表示装置の製造方法

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US7271461B2 (en) * 2004-02-27 2007-09-18 Banpil Photonics Stackable optoelectronics chip-to-chip interconnects and method of manufacturing
JP4646618B2 (ja) 2004-12-20 2011-03-09 イビデン株式会社 光路変換部材、多層プリント配線板および光通信用デバイス
US20080186045A1 (en) * 2007-02-01 2008-08-07 Matsushita Electric Industrial Co., Ltd. Test mark structure, substrate sheet laminate, multilayered circuit substrate, method for inspecting lamination matching precision of multilayered circuit substrate, and method for designing substrate sheet laminate
JP4881337B2 (ja) * 2008-03-12 2012-02-22 ルネサスエレクトロニクス株式会社 半導体装置
US8263878B2 (en) 2008-03-25 2012-09-11 Ibiden Co., Ltd. Printed wiring board
JP4971248B2 (ja) * 2008-05-27 2012-07-11 日東電工株式会社 光電気混載モジュールの製造方法
US8171625B1 (en) * 2008-06-02 2012-05-08 Wavefront Research, Inc. Method of providing low footprint optical interconnect
JP5277874B2 (ja) * 2008-11-05 2013-08-28 住友ベークライト株式会社 光電気混載基板および電子機器
JP2010190994A (ja) * 2009-02-16 2010-09-02 Nitto Denko Corp 光電気混載モジュールおよびその製造方法
KR100997738B1 (ko) * 2009-03-23 2010-12-01 이광석 태양전지 모듈의 제조방법 및 그에 따라 제조된 태양전지 모듈
JP5461897B2 (ja) 2009-06-19 2014-04-02 新光電気工業株式会社 光導波路積層配線基板及びその製造方法と実装構造
JP5439080B2 (ja) * 2009-07-28 2014-03-12 株式会社日立製作所 光ｉ／ｏアレイモジュール
KR101079867B1 (ko) * 2009-11-13 2011-11-04 삼성전기주식회사 광기판 및 그 제조방법
JP5586323B2 (ja) * 2010-05-27 2014-09-10 京セラ株式会社 光伝送基板および光モジュール
JP2012098332A (ja) * 2010-10-29 2012-05-24 Panasonic Corp 光電気複合配線板の製造方法、及び光電気複合配線板
US8901945B2 (en) 2011-02-23 2014-12-02 Broadcom Corporation Test board for use with devices having wirelessly enabled functional blocks and method of using same
JP2013051397A (ja) * 2011-08-03 2013-03-14 Ngk Spark Plug Co Ltd 配線基板の製造方法
US8928139B2 (en) 2011-09-30 2015-01-06 Broadcom Corporation Device having wirelessly enabled functional blocks
US9310552B2 (en) * 2012-06-15 2016-04-12 Micron Technology, Inc. Methods and apparatus providing thermal isolation of photonic devices
US9319148B2 (en) 2012-10-01 2016-04-19 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Optical interconnection to an integrated circuit
JP6202662B2 (ja) * 2012-11-27 2017-09-27 日東電工株式会社 光電気混載基板およびその製法
JP2014220330A (ja) * 2013-05-07 2014-11-20 日立金属株式会社 光配線基板、光配線基板の製造方法、及び光モジュール
JP6085526B2 (ja) * 2013-06-12 2017-02-22 新光電気工業株式会社 光電気混載基板、及び光モジュール
JP2016156865A (ja) * 2015-02-23 2016-09-01 京セラ株式会社 光回路基板の製造方法
CN108174539A (zh) * 2016-12-08 2018-06-15 张跃 一种用于医用设备外壳的面板结构
KR20190093189A (ko) * 2016-12-30 2019-08-08 인텔 코포레이션 반도체 패키지들 내의 기판 유전체 도파관들
US10168495B1 (en) * 2017-06-28 2019-01-01 Kyocera Corporation Optical waveguide and optical circuit board
CN111406444A (zh) * 2017-11-28 2020-07-10 住友电工印刷电路株式会社 制造柔性印刷电路板的方法以及柔性印刷电路板
US11371297B1 (en) 2019-02-09 2022-06-28 Terry Cree Wireline depth monitoring system with valve lockout

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US7014336B1 (en) * 1999-11-18 2006-03-21 Color Kinetics Incorporated Systems and methods for generating and modulating illumination conditions
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KR20050076742A (ko) * 2004-01-22 2005-07-27 마츠시타 덴끼 산교 가부시키가이샤 광전송로 기판의 제조방법, 광전송로 기판, 광전송로내장기판, 광전송로 내장기판의 제조방법 및 데이터처리장치
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7375294B2 (ja) 2017-07-28 2023-11-08 Tdk株式会社 導電性基板、電子装置及び表示装置の製造方法

Also Published As

Publication number Publication date
JPWO2007074567A1 (ja) 2009-06-04
US20080317402A1 (en) 2008-12-25
EP1967876A4 (en) 2013-04-17
US7724989B2 (en) 2010-05-25
EP1967876A1 (en) 2008-09-10
WO2007074567A1 (ja) 2007-07-05

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