WO2007060212A3 - Module for insertion in a rack and method for cooling said module - Google Patents

Module for insertion in a rack and method for cooling said module Download PDF

Info

Publication number
WO2007060212A3
WO2007060212A3 PCT/EP2006/068858 EP2006068858W WO2007060212A3 WO 2007060212 A3 WO2007060212 A3 WO 2007060212A3 EP 2006068858 W EP2006068858 W EP 2006068858W WO 2007060212 A3 WO2007060212 A3 WO 2007060212A3
Authority
WO
WIPO (PCT)
Prior art keywords
module
rack
air
flow
main board
Prior art date
Application number
PCT/EP2006/068858
Other languages
German (de)
French (fr)
Other versions
WO2007060212A2 (en
Inventor
Ernst Engst
Thomas Schmidt-Behounek
Martin Boehm
Original Assignee
Oce Printing Systems Gmbh
Ernst Engst
Thomas Schmidt-Behounek
Martin Boehm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oce Printing Systems Gmbh, Ernst Engst, Thomas Schmidt-Behounek, Martin Boehm filed Critical Oce Printing Systems Gmbh
Publication of WO2007060212A2 publication Critical patent/WO2007060212A2/en
Publication of WO2007060212A3 publication Critical patent/WO2007060212A3/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management

Abstract

The invention relates to a module for insertion in a rack having at least one main board with a substantially rectangular surface area, components and/or modular units being disposed on at least the front of said main board. The module has at least one electrical connecting element which is disposed in an area of a first lateral edge of the main board. The module has additional means producing a first flow of air in a first zone parallel to the first lateral edge and producing a second flow of air, different from the first flow of air, in at least one second zone parallel to the first lateral edge. The invention also relates to a method for cooling the components arranged on a module and to a rack comprising a module.
PCT/EP2006/068858 2005-11-24 2006-11-23 Module for insertion in a rack and method for cooling said module WO2007060212A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200510056096 DE102005056096B4 (en) 2005-11-24 2005-11-24 Cooling arrangement for at least one plugged into a rack electrical assembly and method for cooling such an electrical assembly and rack with an assembly
DE102005056096.2 2005-11-24

Publications (2)

Publication Number Publication Date
WO2007060212A2 WO2007060212A2 (en) 2007-05-31
WO2007060212A3 true WO2007060212A3 (en) 2007-08-23

Family

ID=38015261

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/068858 WO2007060212A2 (en) 2005-11-24 2006-11-23 Module for insertion in a rack and method for cooling said module

Country Status (2)

Country Link
DE (1) DE102005056096B4 (en)
WO (1) WO2007060212A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE502008001254D1 (en) 2008-03-03 2010-10-14 Schroff Gmbh Housing for receiving electronic plug-in modules
DE102012103113B3 (en) * 2012-04-11 2013-08-14 Fujitsu Technology Solutions Intellectual Property Gmbh Rackservereinschub

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4851965A (en) * 1987-03-09 1989-07-25 Unisys Corporation Directed air management system for cooling multiple heat sinks
US20020159232A1 (en) * 2001-04-30 2002-10-31 Beitelmal Abdlmonem H. Air jet cooling arrangement for electronic systems
EP1343204A1 (en) * 2000-12-11 2003-09-10 Fujitsu Limited Electronic device unit

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4009445A1 (en) * 1989-04-20 1990-10-25 Siemens Ag Heat sink system for circuit boards - has profiled heat sink plate position on top of circuit board components
CH680693A5 (en) * 1990-08-07 1992-10-15 Sulzer Ag
US5828549A (en) * 1996-10-08 1998-10-27 Dell U.S.A., L.P. Combination heat sink and air duct for cooling processors with a series air flow
US5871396A (en) * 1997-08-12 1999-02-16 Shen; Tsan Jung Convection type heat dissipation device for computers that is adjustable with respect to a heat source
DE19832710A1 (en) * 1998-07-14 2000-01-27 Siemens Ag Electro-optical assembly for data transmission
US6130820A (en) * 1999-05-04 2000-10-10 Intel Corporation Memory card cooling device
DE29921448U1 (en) * 1999-12-08 2000-02-17 Pfannenberg Otto Gmbh Ventilation device for a housing
DE202005009081U1 (en) * 2005-06-09 2005-09-01 Adlink Technology Inc., Chungho Effective cooling for computer electronics is in form of carrier having fan and heat sink and sits on mother board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4851965A (en) * 1987-03-09 1989-07-25 Unisys Corporation Directed air management system for cooling multiple heat sinks
EP1343204A1 (en) * 2000-12-11 2003-09-10 Fujitsu Limited Electronic device unit
US20020159232A1 (en) * 2001-04-30 2002-10-31 Beitelmal Abdlmonem H. Air jet cooling arrangement for electronic systems

Also Published As

Publication number Publication date
DE102005056096A1 (en) 2007-05-31
DE102005056096B4 (en) 2009-05-14
WO2007060212A2 (en) 2007-05-31

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