WO2007053571A3 - Thermal interface material with multiple size distribution thermally conductive fillers - Google Patents

Thermal interface material with multiple size distribution thermally conductive fillers Download PDF

Info

Publication number
WO2007053571A3
WO2007053571A3 PCT/US2006/042362 US2006042362W WO2007053571A3 WO 2007053571 A3 WO2007053571 A3 WO 2007053571A3 US 2006042362 W US2006042362 W US 2006042362W WO 2007053571 A3 WO2007053571 A3 WO 2007053571A3
Authority
WO
WIPO (PCT)
Prior art keywords
thermally conductive
thermal interface
size distribution
interface material
conductive fillers
Prior art date
Application number
PCT/US2006/042362
Other languages
French (fr)
Other versions
WO2007053571A2 (en
Inventor
Philip L Canale
Garrett L Clark
Original Assignee
Techfilm Llc
Philip L Canale
Garrett L Clark
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Techfilm Llc, Philip L Canale, Garrett L Clark filed Critical Techfilm Llc
Priority to EP06817447A priority Critical patent/EP1839469A2/en
Publication of WO2007053571A2 publication Critical patent/WO2007053571A2/en
Publication of WO2007053571A3 publication Critical patent/WO2007053571A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29499—Shape or distribution of the fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Abstract

A thermal interface material including a matrix and a thermally conductive filler. The thermally conductive filler includes first and a second thermally conductive particulate materials having different particle size distribution. A maximum particle size of the thermally conductive filler may be established by excluding particles having a size greater than a predetermined particle size from the thermally conductive filler.
PCT/US2006/042362 2005-11-01 2006-11-01 Thermal interface material with multiple size distribution thermally conductive fillers WO2007053571A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06817447A EP1839469A2 (en) 2005-11-01 2006-11-01 Thermal interface material with multiple size distribution thermally conductive fillers

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US73206205P 2005-11-01 2005-11-01
US60/732,062 2005-11-01

Publications (2)

Publication Number Publication Date
WO2007053571A2 WO2007053571A2 (en) 2007-05-10
WO2007053571A3 true WO2007053571A3 (en) 2008-06-19

Family

ID=38006443

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/042362 WO2007053571A2 (en) 2005-11-01 2006-11-01 Thermal interface material with multiple size distribution thermally conductive fillers

Country Status (4)

Country Link
US (1) US20070097651A1 (en)
EP (1) EP1839469A2 (en)
CN (1) CN101288353A (en)
WO (1) WO2007053571A2 (en)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1978582A (en) * 2005-12-09 2007-06-13 富准精密工业(深圳)有限公司 Heat-conductive cream and electronic device using same
US20070178255A1 (en) * 2006-01-31 2007-08-02 Farrow Timothy S Apparatus, system, and method for thermal conduction interfacing
US7462294B2 (en) * 2007-04-25 2008-12-09 International Business Machines Corporation Enhanced thermal conducting formulations
ATE500596T1 (en) * 2007-10-08 2011-03-15 Abb Research Ltd ELECTRICAL POLYMER CONCRETE INSULATION SYSTEM
US8344438B2 (en) * 2008-01-31 2013-01-01 Qimonda Ag Electrode of an integrated circuit
US9353304B2 (en) 2009-03-02 2016-05-31 Honeywell International Inc. Thermal interface material and method of making and using the same
US9751264B2 (en) * 2009-10-09 2017-09-05 Alcatel-Lucent Usa Inc. Thermal interface device
US9260645B2 (en) * 2010-02-23 2016-02-16 Laird Technologies, Inc. Thermal interface materials including thermally reversible gels
US9771508B2 (en) 2010-02-23 2017-09-26 Laird Technologies, Inc. Thermal interface materials including thermally reversible gels
US10087351B2 (en) 2010-02-23 2018-10-02 Laird Technologies, Inc. Materials including thermally reversible gels
JP5936310B2 (en) * 2011-03-17 2016-06-22 三菱電機株式会社 Power semiconductor module and its mounting structure
CN104053759A (en) * 2011-10-07 2014-09-17 3M创新有限公司 Thermal grease having low thermal resistance
JP2015504602A (en) 2011-11-15 2015-02-12 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング Electronic devices assembled using thermal insulation layers
CN103999014B (en) 2011-11-15 2019-03-12 汉高知识产权控股有限责任公司 The electronic equipment assembled using thermal insulation layer
CN102911596B (en) * 2012-11-13 2015-09-30 中国航天科技集团公司第五研究院第五一0研究所 The preparation method of the bonding thermal control coating of variable emissivity
US9223363B2 (en) * 2013-03-16 2015-12-29 Henkel IP & Holding GmbH Electronic devices assembled with heat absorbing and/or thermally insulating composition
US20140354314A1 (en) * 2013-05-31 2014-12-04 Hitesh Arora Thermal interface techniques and configurations
US10174433B2 (en) 2013-12-05 2019-01-08 Honeywell International Inc. Stannous methanesulfonate solution with adjusted pH
TWI657132B (en) 2013-12-19 2019-04-21 德商漢高智慧財產控股公司 Compositions having a matrix and encapsulated phase change materials dispersed therein, and electronic devices assembled therewith
CN106536609B (en) 2014-07-07 2022-04-29 霍尼韦尔国际公司 Thermal interface material with ion scavenger
US9691746B2 (en) 2014-07-14 2017-06-27 Micron Technology, Inc. Methods of manufacturing stacked semiconductor die assemblies with high efficiency thermal paths
CN107250317A (en) * 2014-12-05 2017-10-13 霍尼韦尔国际公司 High-performance thermal interfacial material with low thermal resistance
US10312177B2 (en) 2015-11-17 2019-06-04 Honeywell International Inc. Thermal interface materials including a coloring agent
JP6501075B2 (en) 2016-02-24 2019-04-17 パナソニックＩｐマネジメント株式会社 Resin structure and electronic component and electronic device using the structure
BR112018067991A2 (en) 2016-03-08 2019-01-15 Honeywell Int Inc thermal interface material, and electronic component
US10501671B2 (en) 2016-07-26 2019-12-10 Honeywell International Inc. Gel-type thermal interface material
US11041103B2 (en) * 2017-09-08 2021-06-22 Honeywell International Inc. Silicone-free thermal gel
US10428256B2 (en) 2017-10-23 2019-10-01 Honeywell International Inc. Releasable thermal gel
US11072706B2 (en) 2018-02-15 2021-07-27 Honeywell International Inc. Gel-type thermal interface material
EP3527615A1 (en) * 2018-02-16 2019-08-21 Venator Germany GmbH Thermoconductive filler particles and polymer compositions containing them
JP7069967B2 (en) * 2018-03-29 2022-05-18 Tdk株式会社 Heat dissipation board
CN108441174B (en) * 2018-04-23 2020-12-01 辽宁卓仑科技有限公司 Phase-change heat storage material and preparation method thereof
US11373921B2 (en) 2019-04-23 2022-06-28 Honeywell International Inc. Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing
ES2960933T3 (en) * 2019-05-21 2024-03-07 Ddp Specialty Electronic Mat Us Llc Thermal interface materials
EP4127040A1 (en) * 2020-03-26 2023-02-08 DDP Specialty Electronic Materials US, LLC Thermal interface material comprising multimodally distributed spherical fillers
CN112409942B (en) * 2020-11-19 2022-05-31 杭州福斯特应用材料股份有限公司 Heat dissipation type packaging adhesive film and preparation method thereof
CN115725273A (en) * 2021-08-26 2023-03-03 华为技术有限公司 Diamond-based heat-conducting filler, preparation method thereof, composite heat-conducting material and electronic equipment
CN115214202A (en) * 2022-04-26 2022-10-21 北京科技大学 High-thermal-conductivity layered thermal interface material and preparation method thereof

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5781412A (en) * 1996-11-22 1998-07-14 Parker-Hannifin Corporation Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size
US6791839B2 (en) * 2002-06-25 2004-09-14 Dow Corning Corporation Thermal interface materials and methods for their preparation and use

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3928270A (en) * 1973-02-08 1975-12-23 Phillips Petroleum Co Thermosetting compositions
US4610808A (en) * 1982-07-19 1986-09-09 Mitech Corporation Conductive resinous composites
US4622352A (en) * 1985-12-30 1986-11-11 Shell Oil Company Low smoke modified polypropylene insulation compositions
US4917466A (en) * 1987-08-13 1990-04-17 Shin-Etsu Polymer Co., Ltd. Method for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby
JP2877309B2 (en) * 1988-01-06 1999-03-31 株式会社東芝 Method for producing rubber-modified phenolic resin
CA2005746C (en) * 1988-12-19 1994-05-31 Minoru Yoshinaka Soundproofing materials
US5718835A (en) * 1989-08-04 1998-02-17 Mitsubishi Cable Industries Heat storage composition
FR2668418B1 (en) * 1990-10-31 1993-02-19 Total France COMPOSITE MATERIAL BASED ON SILICONE TYPE RUBBER AND ETHYLENE-PROPYLENE COPOLYMER OR TERPOLIMER TYPE.
US5143893A (en) * 1990-11-27 1992-09-01 Ricoh Company, Ltd. Sublimation-type thermal image transfer recording medium
US6197859B1 (en) * 1993-06-14 2001-03-06 The Bergquist Company Thermally conductive interface pads for electronic devices
TW318861B (en) * 1994-08-16 1997-11-01 Mitsui Toatsu Chemicals
US5709740A (en) * 1996-02-23 1998-01-20 Hoechst Celanese Corp. Thermally expandable, viscosity modified wax compositions and method of use in actuators
JPH1039453A (en) * 1996-07-18 1998-02-13 Fuji Photo Film Co Ltd Easily openable photosensitive material packaging material and its manufacture
AU1085999A (en) * 1997-10-17 1999-05-10 Dow Chemical Company, The Compositions of interpolymers of alpha-olefin monomers with one or more vinyl orvinylidene aromatic monomers
JPH11302481A (en) * 1998-04-22 1999-11-02 Idemitsu Petrochem Co Ltd Styrenic resin composition and semiconductor conveyor jig
TWI233444B (en) * 1998-10-30 2005-06-01 Toray Industries Thermoplastic resin composition, production thereof, and molded article thereof
US6238596B1 (en) * 1999-03-09 2001-05-29 Johnson Matthey Electronics, Inc. Compliant and crosslinkable thermal interface materials
US5989459A (en) * 1999-03-09 1999-11-23 Johnson Matthey, Inc. Compliant and crosslinkable thermal interface materials
US6391442B1 (en) * 1999-07-08 2002-05-21 Saint-Gobain Performance Plastics Corporation Phase change thermal interface material
US6706219B2 (en) * 1999-09-17 2004-03-16 Honeywell International Inc. Interface materials and methods of production and use thereof
US6605238B2 (en) * 1999-09-17 2003-08-12 Honeywell International Inc. Compliant and crosslinkable thermal interface materials
US6503620B1 (en) * 1999-10-29 2003-01-07 Avery Dennison Corporation Multilayer composite PSA constructions
US6673434B2 (en) * 1999-12-01 2004-01-06 Honeywell International, Inc. Thermal interface materials
US6797382B2 (en) * 1999-12-01 2004-09-28 Honeywell International Inc. Thermal interface materials
US6451422B1 (en) * 1999-12-01 2002-09-17 Johnson Matthey, Inc. Thermal interface materials
US20050072334A1 (en) * 2003-10-07 2005-04-07 Saint-Gobain Performance Plastics, Inc. Thermal interface material
US20060228542A1 (en) * 2005-04-08 2006-10-12 Saint-Gobain Performance Plastics Corporation Thermal interface material having spheroidal particulate filler
US20070131912A1 (en) * 2005-07-08 2007-06-14 Simone Davide L Electrically conductive adhesives

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5781412A (en) * 1996-11-22 1998-07-14 Parker-Hannifin Corporation Conductive cooling of a heat-generating electronic component using a cured-in-place, thermally-conductive interlayer having a filler of controlled particle size
US6791839B2 (en) * 2002-06-25 2004-09-14 Dow Corning Corporation Thermal interface materials and methods for their preparation and use

Also Published As

Publication number Publication date
EP1839469A2 (en) 2007-10-03
WO2007053571A2 (en) 2007-05-10
CN101288353A (en) 2008-10-15
US20070097651A1 (en) 2007-05-03

Similar Documents

Publication Publication Date Title
WO2007053571A3 (en) Thermal interface material with multiple size distribution thermally conductive fillers
TW200641106A (en) Thermal interface material having spheroidal particulate filler
WO2009035907A3 (en) Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use
WO2008014171A3 (en) Thermal interconnect and interface materials, methods of production and uses thereof
WO2005124790A3 (en) High thermal conductivity materials aligned within resins
EP1816175A3 (en) Thermal interface material
ATE407173T1 (en) GLASS POWDER AND RESIN COMPOSITION CONTAINING THE SAME
WO2008060292A3 (en) Chemically bonded ceramic radiation shielding material and method of preparation
WO2005123867A3 (en) High thermal conductivity materials incorporated into resins
WO2008091939A3 (en) Coated abrasive products containing aggregates
WO2007019114A3 (en) Abrasive article and methods of making same
WO2010011579A3 (en) Coated abrasive products containing aggregates
ZA200807902B (en) Method for blending materials in an extruder, the manufactured article and material pre-mix
WO2007137099A3 (en) Double layer carbon nanotube-based structures and methods for removing heat from solid-state devices
WO2008008413A3 (en) Ultra fine nepheline syenite powder and products for using same
EP2078734A4 (en) Non-thermofusible granular phenol resin, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor
WO2005118469A3 (en) Sensing/actuating materials made from carbon nanotube polymer composites and methods for making same
WO2009000650A3 (en) Particulate polymers comprising biocidal active substance
WO2006091613A3 (en) Nanocomposite ceramics and process for making the same
JP2007537905A5 (en)
MX2011007665A (en) Transparent, colorless infrared radiation absorbing compositions comprising non-stoichiometric tungsten oxide nanoparticles.
WO2008097733A3 (en) Multi-layer screen composites
EP2093195A4 (en) Zirconium oxide particle dispersion liquid, zirconium oxide particle-containing photohardening composition, and hardened film
WO2012092619A3 (en) Coated abrasive aggregates and products containg same
ATE515070T1 (en) POSITIVE ELECTRODE ACTIVE MATERIAL POWDER

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 2006817447

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 200680000454.2

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: DE