WO2007050712A3 - Technique for forming a thermally conductive interface with patterned metal foil - Google Patents

Technique for forming a thermally conductive interface with patterned metal foil Download PDF

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Publication number
WO2007050712A3
WO2007050712A3 PCT/US2006/041694 US2006041694W WO2007050712A3 WO 2007050712 A3 WO2007050712 A3 WO 2007050712A3 US 2006041694 W US2006041694 W US 2006041694W WO 2007050712 A3 WO2007050712 A3 WO 2007050712A3
Authority
WO
WIPO (PCT)
Prior art keywords
metal foil
technique
thermally conductive
forming
conductive interface
Prior art date
Application number
PCT/US2006/041694
Other languages
French (fr)
Other versions
WO2007050712A2 (en
Inventor
Robert N Jarrett
Craig K Merritt
Original Assignee
Indium Corp America
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Indium Corp America filed Critical Indium Corp America
Publication of WO2007050712A2 publication Critical patent/WO2007050712A2/en
Publication of WO2007050712A3 publication Critical patent/WO2007050712A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A technique for forming a thermally conductive interface with patterned metal foil is disclosed. In one particular exemplary embodiment, the technique may be realized as a thermally conductive metal foil having at least one patterned surface for facilitating heat dissipation from at least one integrated circuit device to at least one heat sink. The metal foil preferably has a characteristic formability and softness that may be exemplified by alloys of lead, indium, tin, and other malleable metals, and/or composites comprising layers of at least one malleable metal alloy.
PCT/US2006/041694 2005-10-26 2006-10-26 Technique for forming a thermally conductive interface with patterned metal foil WO2007050712A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US73002605P 2005-10-26 2005-10-26
US60/730,026 2005-10-26
US11/552,908 US7593228B2 (en) 2005-10-26 2006-10-25 Technique for forming a thermally conductive interface with patterned metal foil
US11/552,908 2006-10-25

Publications (2)

Publication Number Publication Date
WO2007050712A2 WO2007050712A2 (en) 2007-05-03
WO2007050712A3 true WO2007050712A3 (en) 2007-07-05

Family

ID=37968535

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/041694 WO2007050712A2 (en) 2005-10-26 2006-10-26 Technique for forming a thermally conductive interface with patterned metal foil

Country Status (2)

Country Link
US (1) US7593228B2 (en)
WO (1) WO2007050712A2 (en)

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US7694719B2 (en) * 2007-01-04 2010-04-13 International Business Machines Corporation Patterned metal thermal interface
US7995344B2 (en) * 2007-01-09 2011-08-09 Lockheed Martin Corporation High performance large tolerance heat sink
US20090109628A1 (en) * 2007-10-30 2009-04-30 International Business Machines Corporation Chip Cooling System with Convex Portion
US7907410B2 (en) * 2007-11-08 2011-03-15 International Business Machines Corporation Universal patterned metal thermal interface
US20090151893A1 (en) * 2007-12-13 2009-06-18 International Business Machines Corporation High performance compliant thermal interface cooling structures
US20100200197A1 (en) 2009-02-09 2010-08-12 International Business Machines Corporation Liquid cooled compliant heat sink and related method
US20110162828A1 (en) * 2010-01-06 2011-07-07 Graham Charles Kirk Thermal plug for use with a heat sink and method of assembling same
US8314473B2 (en) 2010-05-04 2012-11-20 Fairchild Semiconductor Corporation Die backside standoff structures for semiconductor devices
US20120211214A1 (en) * 2010-12-09 2012-08-23 Panasonic Avionics Corporation Heatsink Device and Method
US9010616B2 (en) 2011-05-31 2015-04-21 Indium Corporation Low void solder joint for multiple reflow applications
DE102011078460A1 (en) 2011-06-30 2013-01-03 Robert Bosch Gmbh Electronic circuit for dissipation of heat loss components
US20130250522A1 (en) * 2012-03-22 2013-09-26 Varian Medical Systems, Inc. Heat sink profile for interface to thermally conductive material
US9271427B2 (en) 2012-11-28 2016-02-23 Hamilton Sundstrand Corporation Flexible thermal transfer strips
US9230878B2 (en) 2013-04-12 2016-01-05 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Integrated circuit package for heat dissipation
GB2522642B (en) * 2014-01-30 2018-08-15 Xyratex Tech Limited A solid state memory unit cooling apparatus and solid state storage device
EP2955749A1 (en) 2014-06-10 2015-12-16 ABB Technology Oy A method of heat transfer in power electronics applications
US10631438B2 (en) 2017-12-23 2020-04-21 International Business Machines Corporation Mechanically flexible cold plates for low power components
US11037860B2 (en) 2019-06-27 2021-06-15 International Business Machines Corporation Multi layer thermal interface material
US11774190B2 (en) 2020-04-14 2023-10-03 International Business Machines Corporation Pierced thermal interface constructions
CN113889442A (en) * 2020-07-03 2022-01-04 华为技术有限公司 Heat conducting member, single board, computing equipment and manufacturing method
US20220344239A1 (en) * 2021-04-26 2022-10-27 Hewlett Packard Enterprise Development Lp Cooling assembly and an electronic circuit module having the same
US20220375817A1 (en) 2021-05-19 2022-11-24 Indium Corporation Liquid metal thermal interface
US11764185B2 (en) * 2021-08-31 2023-09-19 Infineon Technologies Austria Ag Diffusion soldering preform with varying surface profile

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Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5291371A (en) * 1990-04-27 1994-03-01 International Business Machines Corporation Thermal joint
US5757073A (en) * 1996-12-13 1998-05-26 International Business Machines Corporation Heatsink and package structure for wirebond chip rework and replacement
US6000603A (en) * 1997-05-23 1999-12-14 3M Innovative Properties Company Patterned array of metal balls and methods of making
US6644395B1 (en) * 1999-11-17 2003-11-11 Parker-Hannifin Corporation Thermal interface material having a zone-coated release linear
US20030127727A1 (en) * 2002-01-09 2003-07-10 Nitto Denko Corporation Thermally conductive sheet and semiconductor device using same
US20030151898A1 (en) * 2002-01-22 2003-08-14 Shin-Etsu Chemical Co., Ltd. Heat-dissipating member, manufacturing method and installation method

Also Published As

Publication number Publication date
US7593228B2 (en) 2009-09-22
US20070091574A1 (en) 2007-04-26
WO2007050712A2 (en) 2007-05-03

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