WO2007047996A3 - Apertured conditioning brush for chemical mechanical planarization systems - Google Patents

Apertured conditioning brush for chemical mechanical planarization systems Download PDF

Info

Publication number
WO2007047996A3
WO2007047996A3 PCT/US2006/041166 US2006041166W WO2007047996A3 WO 2007047996 A3 WO2007047996 A3 WO 2007047996A3 US 2006041166 W US2006041166 W US 2006041166W WO 2007047996 A3 WO2007047996 A3 WO 2007047996A3
Authority
WO
WIPO (PCT)
Prior art keywords
conditioning
apertures
polishing
chemical mechanical
bnstles
Prior art date
Application number
PCT/US2006/041166
Other languages
French (fr)
Other versions
WO2007047996A2 (en
Inventor
Stephen J Benner
Original Assignee
Tbw Ind Inc
Stephen J Benner
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tbw Ind Inc, Stephen J Benner filed Critical Tbw Ind Inc
Priority to JP2008536848A priority Critical patent/JP2009512569A/en
Priority to CA002626564A priority patent/CA2626564A1/en
Priority to EP06817260A priority patent/EP1940587A4/en
Publication of WO2007047996A2 publication Critical patent/WO2007047996A2/en
Publication of WO2007047996A3 publication Critical patent/WO2007047996A3/en
Priority to IL190944A priority patent/IL190944A0/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B24D13/14—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face
    • B24D13/145—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor acting by the front face having a brush-like working surface

Abstract

An apparatus for conditioning the polishing pad of a chemical mechanical planaπzation (CMP) system including an apertured conditioning disk formed to support a plurality of brush bristles in any desired configuration The bnstles are utilized to lift out debris an contaminants that have been lodged within the deep pores of polishing pads, particularly 'sofi' polishing pads (or polishing felts) The apertures in the conditioning disk are used to allow for the efficient evacuation of the effluent created duπng the conditioning process The apertures may also be used to introduce conditioning fluids as the bnstles are brushing the surface to assist in the conditioning process The utilization of the apertures to evacuate the effluent (via an attached vacuum source) overcomes problems associated wit the pπor art by immediately removing the dislodged mateπal from the pad surface before it has an opportunity to be re-incorporated int the polishing pad.
PCT/US2006/041166 2005-10-19 2006-10-19 Apertured conditioning brush for chemical mechanical planarization systems WO2007047996A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2008536848A JP2009512569A (en) 2005-10-19 2006-10-19 Aperture adjustment brush for chemical mechanical polishing systems
CA002626564A CA2626564A1 (en) 2005-10-19 2006-10-19 Apertured conditioning brush for chemical mechanical planarization systems
EP06817260A EP1940587A4 (en) 2005-10-19 2006-10-19 Apertured conditioning brush for chemical mechanical planarization systems
IL190944A IL190944A0 (en) 2005-10-19 2008-04-17 Apertured conditioning brush for chemical mechanical planarization systems

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US72812605P 2005-10-19 2005-10-19
US60/728,126 2005-10-19
US11/582,711 2006-10-18
US11/582,711 US20070087672A1 (en) 2005-10-19 2006-10-18 Apertured conditioning brush for chemical mechanical planarization systems

Publications (2)

Publication Number Publication Date
WO2007047996A2 WO2007047996A2 (en) 2007-04-26
WO2007047996A3 true WO2007047996A3 (en) 2007-10-04

Family

ID=37948719

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/041166 WO2007047996A2 (en) 2005-10-19 2006-10-19 Apertured conditioning brush for chemical mechanical planarization systems

Country Status (7)

Country Link
US (1) US20070087672A1 (en)
EP (1) EP1940587A4 (en)
JP (1) JP2009512569A (en)
KR (1) KR20080075840A (en)
CA (1) CA2626564A1 (en)
IL (1) IL190944A0 (en)
WO (1) WO2007047996A2 (en)

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US20070135024A1 (en) * 2005-12-08 2007-06-14 Itsuki Kobata Polishing pad and polishing apparatus
JP4846417B2 (en) * 2006-03-30 2011-12-28 株式会社山田製作所 Deburring brush
JP5080769B2 (en) * 2006-09-15 2012-11-21 株式会社東京精密 Polishing method and polishing apparatus
US7597608B2 (en) * 2006-10-30 2009-10-06 Applied Materials, Inc. Pad conditioning device with flexible media mount
JP5002353B2 (en) * 2007-07-05 2012-08-15 シャープ株式会社 Chemical mechanical polishing equipment
US8758091B2 (en) * 2010-04-06 2014-06-24 Massachusetts Institute Of Technology Chemical-mechanical polishing pad conditioning system
CN102398212A (en) * 2010-09-17 2012-04-04 中芯国际集成电路制造(上海)有限公司 Chemical mechanical polishing equipment
KR102203498B1 (en) 2013-01-31 2021-01-15 어플라이드 머티어리얼스, 인코포레이티드 Methods and apparatus for post-chemical mechanical planarization substrate cleaning
WO2014149676A1 (en) * 2013-03-15 2014-09-25 Applied Materials, Inc. Polishing pad cleaning with vacuum apparatus
TWI662610B (en) * 2013-10-25 2019-06-11 美商應用材料股份有限公司 Systems, methods and apparatus for post-chemical mechanical planarization substrate buff pre-cleaning
US9452506B2 (en) * 2014-07-15 2016-09-27 Applied Materials, Inc. Vacuum cleaning systems for polishing pads, and related methods
KR101841549B1 (en) * 2015-10-29 2018-03-23 에스케이실트론 주식회사 An apparatus for dressing a polishing pad and wafer polisher including the same
JP6842859B2 (en) 2016-08-12 2021-03-17 株式会社荏原製作所 Dressing equipment, polishing equipment, holders, housings and dressing methods
US10410936B2 (en) 2017-05-19 2019-09-10 Illinois Tool Works Inc. Methods and apparatuses for effluent monitoring for brush conditioning
US20200043746A1 (en) * 2018-07-31 2020-02-06 Taiwan Semiconductor Manufacturing Co., Ltd. Chemical mechanical polishing apparatus
KR20200084485A (en) 2019-01-02 2020-07-13 삼성전자주식회사 Apparatus for conditioning polishing pad
CN112885753B (en) * 2021-03-04 2022-08-12 长江存储科技有限责任公司 Polishing pad dresser, chemical mechanical polishing apparatus and method of polishing wafer using the same
US20220281069A1 (en) * 2021-03-04 2022-09-08 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for removing debris during chemical mechanical planarization
CN115870875B (en) * 2022-12-08 2024-04-12 西安奕斯伟材料科技股份有限公司 Grinding disc and grinding equipment for grinding silicon wafers

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5587021A (en) * 1992-10-10 1996-12-24 Guido Hoersch Method and apparatus for the cleaning and/or care of floors and/or floor coverings of all types
US6193587B1 (en) * 1999-10-01 2001-02-27 Taiwan Semicondutor Manufacturing Co., Ltd Apparatus and method for cleansing a polishing pad
US6244944B1 (en) * 1999-08-31 2001-06-12 Micron Technology, Inc. Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates
US6273800B1 (en) * 1999-08-31 2001-08-14 Micron Technology, Inc. Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates
US6508697B1 (en) * 2001-07-16 2003-01-21 Robert Lyle Benner Polishing pad conditioning system
US6783445B2 (en) * 2000-09-27 2004-08-31 Ebara Corporation Polishing apparatus
US20050036004A1 (en) * 2003-08-13 2005-02-17 Barbara Horn Methods and systems for conditioning slotted substrates
US20050066996A1 (en) * 2002-09-11 2005-03-31 The Procter & Gamble Company Stain-removal brush including cleaning composition dispenser

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US6244946B1 (en) * 1997-04-08 2001-06-12 Lam Research Corporation Polishing head with removable subcarrier
US5975994A (en) * 1997-06-11 1999-11-02 Micron Technology, Inc. Method and apparatus for selectively conditioning a polished pad used in planarizng substrates
US6135868A (en) * 1998-02-11 2000-10-24 Applied Materials, Inc. Groove cleaning device for chemical-mechanical polishing
JP3770752B2 (en) * 1998-08-11 2006-04-26 株式会社日立製作所 Semiconductor device manufacturing method and processing apparatus
US6142859A (en) * 1998-10-21 2000-11-07 Always Sunshine Limited Polishing apparatus
US6302771B1 (en) * 1999-04-01 2001-10-16 Philips Semiconductor, Inc. CMP pad conditioner arrangement and method therefor
JP2001277095A (en) * 2000-03-31 2001-10-09 Mitsubishi Materials Corp Pad conditioning device and pad conditioning method
US6224470B1 (en) * 1999-09-29 2001-05-01 Applied Materials, Inc. Pad cleaning brush for chemical mechanical polishing apparatus and method of making the same
US6386963B1 (en) * 1999-10-29 2002-05-14 Applied Materials, Inc. Conditioning disk for conditioning a polishing pad
US6331136B1 (en) * 2000-01-25 2001-12-18 Koninklijke Philips Electronics N.V. (Kpenv) CMP pad conditioner arrangement and method therefor
US6969305B2 (en) * 2000-02-07 2005-11-29 Ebara Corporation Polishing apparatus
US6626743B1 (en) * 2000-03-31 2003-09-30 Lam Research Corporation Method and apparatus for conditioning a polishing pad
US7374477B2 (en) * 2002-02-06 2008-05-20 Applied Materials, Inc. Polishing pads useful for endpoint detection in chemical mechanical polishing
JP2002273656A (en) * 2001-03-21 2002-09-25 Nippei Toyama Corp Grinding wheel dresser
JP2002307308A (en) * 2001-04-12 2002-10-23 Fujimori Gijutsu Kenkyusho:Kk Polishing dresser for polishing machine for chemical machine polisher
JP2003181756A (en) * 2001-12-19 2003-07-02 Tokyo Seimitsu Co Ltd Conditioner for wafer processing apparatus
JP2003211355A (en) * 2002-01-15 2003-07-29 Ebara Corp Polishing device and dressing method
WO2003084715A1 (en) * 2002-04-02 2003-10-16 Rodel Holdings, Inc. Composite conditioning tool
AU2003219400A1 (en) * 2002-05-07 2003-11-11 Koninklijke Philips Electronics N.V. Cleaning head
JP2003347256A (en) * 2002-05-29 2003-12-05 Tokyo Seimitsu Co Ltd Abrasive cloth cleaning plate and abrasive cloth cleaning method
JP2004306234A (en) * 2003-04-10 2004-11-04 Applied Materials Inc Brush for washing of polishing pad of chemical mechanical polishing equipment
JP2005271101A (en) * 2004-03-23 2005-10-06 Tokyo Seimitsu Co Ltd Dressing device of polishing pad and polishing apparatus having the dressing device of polishing pad
US7033253B2 (en) * 2004-08-12 2006-04-25 Micron Technology, Inc. Polishing pad conditioners having abrasives and brush elements, and associated systems and methods
US7210988B2 (en) * 2004-08-24 2007-05-01 Applied Materials, Inc. Method and apparatus for reduced wear polishing pad conditioning

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5587021A (en) * 1992-10-10 1996-12-24 Guido Hoersch Method and apparatus for the cleaning and/or care of floors and/or floor coverings of all types
US6244944B1 (en) * 1999-08-31 2001-06-12 Micron Technology, Inc. Method and apparatus for supporting and cleaning a polishing pad for chemical-mechanical planarization of microelectronic substrates
US6273800B1 (en) * 1999-08-31 2001-08-14 Micron Technology, Inc. Method and apparatus for supporting a polishing pad during chemical-mechanical planarization of microelectronic substrates
US6193587B1 (en) * 1999-10-01 2001-02-27 Taiwan Semicondutor Manufacturing Co., Ltd Apparatus and method for cleansing a polishing pad
US6783445B2 (en) * 2000-09-27 2004-08-31 Ebara Corporation Polishing apparatus
US6508697B1 (en) * 2001-07-16 2003-01-21 Robert Lyle Benner Polishing pad conditioning system
US20050066996A1 (en) * 2002-09-11 2005-03-31 The Procter & Gamble Company Stain-removal brush including cleaning composition dispenser
US20050036004A1 (en) * 2003-08-13 2005-02-17 Barbara Horn Methods and systems for conditioning slotted substrates

Also Published As

Publication number Publication date
EP1940587A2 (en) 2008-07-09
IL190944A0 (en) 2009-09-22
KR20080075840A (en) 2008-08-19
WO2007047996A2 (en) 2007-04-26
US20070087672A1 (en) 2007-04-19
CA2626564A1 (en) 2007-04-26
EP1940587A4 (en) 2010-01-20
JP2009512569A (en) 2009-03-26

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