WO2007039332A1 - Printed board - Google Patents

Printed board Download PDF

Info

Publication number
WO2007039332A1
WO2007039332A1 PCT/EP2006/063920 EP2006063920W WO2007039332A1 WO 2007039332 A1 WO2007039332 A1 WO 2007039332A1 EP 2006063920 W EP2006063920 W EP 2006063920W WO 2007039332 A1 WO2007039332 A1 WO 2007039332A1
Authority
WO
WIPO (PCT)
Prior art keywords
components
circuit board
printed board
reflow soldering
base material
Prior art date
Application number
PCT/EP2006/063920
Other languages
German (de)
French (fr)
Inventor
Georg Busch
Christoph Fels
Original Assignee
Siemens Home And Office Communication Devices Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Home And Office Communication Devices Gmbh & Co. Kg filed Critical Siemens Home And Office Communication Devices Gmbh & Co. Kg
Publication of WO2007039332A1 publication Critical patent/WO2007039332A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/081—Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Definitions

  • the invention relates to a printed circuit board according to the preamble of claim 1.
  • a temperature of about 245 to 255 0 C is required. This high temperature often leads to damage in particular a FRI printed circuit board material. The consequence is often a delamination of the FRI circuit board. Likewise, components are pre-damaged, so that for example in capacitors, the capacity decreases prematurely.
  • FRI printed circuit boards with BGA components can today only be soldered safely in vapor-phase soldering systems.
  • a medium with a boiling point of 235 ° C. is used. This ensures that at no point in the process, this temperature is exceeded.
  • the temperature can not be controlled as finely as in the case of vapor-phase soldering systems. Therefore, high-quality circuit boards with expensive FR4 base materials are used, which are less sensitive to temperature fluctuations.
  • the object of the present invention starting from printed circuit boards of the type mentioned in the introduction, is to technically improve the printed circuit boards in such a way that delamination is reliably prevented and a vapor-phase soldering system can be dispensed with.
  • the printed circuit board has through holes or through holes in areas that are at least places for BGA components. gangsfräsungen in such a way that the through holes are arranged below the BGA components.
  • the hot air prevailing during reflow soldering can pass through the through holes more easily or more quickly to the underside of the BGA components, for example, and heat up the components.
  • the advantage is hereby that the temperature of the soldering advertising lowered in up to 15 0 C the can. This ensures that there is no delamination of the printed circuit board during soldering.
  • the temperature reduction can be used at the same time to use a base material for the circuit boards, which in relation to other base materials, a low-cost and therefore a simple base material, that is qualitatively a less high-quality base material.
  • a base material would be, for example, a FRI base material. This can then also reduce the production costs.
  • the already known FRI base material is used, which costs only about 50% compared to a likewise already known FR4 base material.

Abstract

The invention relates to a printed board for BGA components which is safe from delamination during soldering. The inventive printed board comprises, in zones which are at least slots for BGA components, throughbores or milled passages in such a manner that the throughbores or milled passages are arranged below the BGA components. The throughbores or milled passages allow for example the solder medium that is predominantly used for reflow soldering to arrive more easily or faster to the bottom face of the components and to heat the components. In this manner, the temperature in the reflow soldering installation can be reduced by some degrees Celsius. Lower temperatures prevent delamination of the printed board also during reflow soldering. Less expensive base materials can therefore be used for printed boards when reflow soldering.

Description

Beschreibungdescription
Leiterplattecircuit board
Die Erfindung betrifft eine Leiterplatte gemäß dem Oberbegriff des Anspruchs 1.The invention relates to a printed circuit board according to the preamble of claim 1.
Für eine bleifreie Lötung von BGA-Bauteilen auf Leiterplatten wird eine Temperatur von circa 245 bis 2550C benötigt. Diese hohe Temperatur führt häufig zur Schädigung insbesondere eines FRl-Leiterplattenmaterials . Die Folge ist oft eine DeIa- mination der FRl-Leiterplatte . Ebenso werden Bauteile vorgeschädigt, so dass beispielsweise bei Kondensatoren die Kapazität vorzeitig abnimmt.For a lead-free soldering of BGA components on printed circuit boards, a temperature of about 245 to 255 0 C is required. This high temperature often leads to damage in particular a FRI printed circuit board material. The consequence is often a delamination of the FRI circuit board. Likewise, components are pre-damaged, so that for example in capacitors, the capacity decreases prematurely.
FRl-Leiterplatten mit BGA-Bauteilen können heute nur sicher in Dampfphasen-Lötanlagen gelötet werden. Damit dabei eine Delamination vermieden wird, verwendet man ein Medium mit 2350C Siedepunkt. Damit ist sichergestellt, dass an keiner Stelle im Prozess diese Temperatur überschritten wird. Mit Reflow-Lötanlagen kann die Temperatur nicht so fein wie bei Dampfphasen-Lötanlagen gesteuert werden. Es werden deshalb hier qualitativ hochwertige Leiterplatten mit teuren FR4- Basismaterialien verwendet, die unempfindlicher gegen Tempe- raturschwankungen sind.FRI printed circuit boards with BGA components can today only be soldered safely in vapor-phase soldering systems. In order to avoid delamination, a medium with a boiling point of 235 ° C. is used. This ensures that at no point in the process, this temperature is exceeded. With reflow soldering systems, the temperature can not be controlled as finely as in the case of vapor-phase soldering systems. Therefore, high-quality circuit boards with expensive FR4 base materials are used, which are less sensitive to temperature fluctuations.
Aufgabe der vorliegenden Erfindung ist es, ausgehend von Leiterplatten der eingangs genannten Art die Leiterplatten technisch so zu verbessern, dass eine Delamination sicher vermie- den wird und auch auf eine Dampfphasen-Lötanlage verzichtet werden kann.The object of the present invention, starting from printed circuit boards of the type mentioned in the introduction, is to technically improve the printed circuit boards in such a way that delamination is reliably prevented and a vapor-phase soldering system can be dispensed with.
Diese Aufgabe wird erfindungsgemäß durch eine solche Leiterplatte gelöst, die die Merkmale des kennzeichnenden Teils des Anspruchs 1 aufweist.This object is achieved by such a circuit board having the features of the characterizing part of claim 1.
Danach weist die Leiterplatte in Bereichen, die zumindest Plätze für BGA-Bauteile sind, Durchgangsbohrungen oder Durch- gangsfräsungen in der Weise auf, dass die Durchgangsbohrungen unterhalb der BGA-Bauteile angeordnet sind.After that, the printed circuit board has through holes or through holes in areas that are at least places for BGA components. gangsfräsungen in such a way that the through holes are arranged below the BGA components.
Mit den Durchgangsbohrungen unterhalb der zum Beispiel BGA- Bauteile kann die beim Reflow-Löten vorherrschende Heißluft durch die Durchgangsbohrungen leichter beziehungsweise schneller an die Unterseite der zum Beispiel BGA-Bauteile gelangen und die Bauteile aufheizen. Der Vorteil hierdurch ist, dass die Temperatur in der Lötanlage bis zu 150C gesenkt wer- den kann. Hierdurch ist sichergestellt, dass eine Delaminati- on der Leiterplatte beim Löten unterbleibt.With the through holes below the BGA components, for example, the hot air prevailing during reflow soldering can pass through the through holes more easily or more quickly to the underside of the BGA components, for example, and heat up the components. The advantage is hereby that the temperature of the soldering advertising lowered in up to 15 0 C the can. This ensures that there is no delamination of the printed circuit board during soldering.
Vorteilhafte Ausgestaltungen der Erfindung sind Gegenstand von UnteransprüchenAdvantageous embodiments of the invention are the subject of dependent claims
Die Temperaturreduzierung kann gleichzeitig dazu genutzt werden, für die Leiterplatten ein Basismaterial zu verwenden, das in Relation zu anderen Basismaterialien ein preisgünstiges und insofern ein einfaches Basismaterial, das heißt qua- litativ ein weniger hochwertiges Basismaterial ist. Ein solches Basismaterial wäre beispielsweise ein FRl-Basismaterial . Damit lassen sich dann auch noch die Herstellungskosten senken.The temperature reduction can be used at the same time to use a base material for the circuit boards, which in relation to other base materials, a low-cost and therefore a simple base material, that is qualitatively a less high-quality base material. Such a base material would be, for example, a FRI base material. This can then also reduce the production costs.
Als konkretes Beispiel für ein solches preisgünstiges, qualitativ weniger hochwertiges und damit einfaches Basismaterial sei das bereits bekannte FRl-Basismaterial verwendet, das im Vergleich zu einem ebenfalls bereits bekannten FR4- Basismaterial nur circa 50% kostet. As a concrete example of such a low-cost, low-quality and thus simple base material, the already known FRI base material is used, which costs only about 50% compared to a likewise already known FR4 base material.

Claims

Patentansprüche claims
1. Leiterplatte, vorbereitet zum Tragen von BGA-Bauteilen, dadurch gekennzeichnet , dass in Bereichen der Leiterplatte, die zumindest Plätze für BGA-Bauteile sind, Durchgangsbohrungen oder Durchgangsfräsungen in der Weise vorgesehen sind, dass die Durchgangsbohrungen oder Durch- gangsfräsungen unterhalb der BGA-Bauteile angeordnet sind.1. Circuit board, prepared for supporting BGA components, characterized in that in areas of the circuit board which are at least places for BGA components, through-holes or through-cuts are provided in such a way that the through-holes or through-cuts below the BGA Components are arranged.
2. Leiterplatte nach Anspruch 1, dadurch gekennzeichnet , dass die Leiterplatte aus einem Basismaterial besteht, das in Relation zu anderen Basismaterialien ein preisgünstiges und insofern ein einfaches Basismaterial ist.2. Printed circuit board according to claim 1, characterized in that the printed circuit board consists of a base material, which is a low-cost and therefore a simple base material in relation to other base materials.
3. Leiterplatte nach Anspruch 1 oder 2, dadurch gekennzeichnet , dass die Leiterplatte aus einem als FRl-Basismaterial bekannten Basismaterial besteht. 3. Printed circuit board according to claim 1 or 2, characterized in that the printed circuit board consists of a base material known as FRI base material.
PCT/EP2006/063920 2005-09-30 2006-07-05 Printed board WO2007039332A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200510046970 DE102005046970A1 (en) 2005-09-30 2005-09-30 Printed circuit board for ball grid array components has pre-drilled or milled zones located beneath the components
DE102005046970.1 2005-09-30

Publications (1)

Publication Number Publication Date
WO2007039332A1 true WO2007039332A1 (en) 2007-04-12

Family

ID=37000140

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/063920 WO2007039332A1 (en) 2005-09-30 2006-07-05 Printed board

Country Status (3)

Country Link
DE (1) DE102005046970A1 (en)
TW (1) TW200719774A (en)
WO (1) WO2007039332A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5120678A (en) * 1990-11-05 1992-06-09 Motorola Inc. Electrical component package comprising polymer-reinforced solder bump interconnection
EP0712266A2 (en) * 1994-11-10 1996-05-15 Vlt Corporation Packaging electrical components
EP1416778A2 (en) * 2002-11-01 2004-05-06 Alps Electric Co., Ltd. Small and securely-soldered electronic unit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5120678A (en) * 1990-11-05 1992-06-09 Motorola Inc. Electrical component package comprising polymer-reinforced solder bump interconnection
EP0712266A2 (en) * 1994-11-10 1996-05-15 Vlt Corporation Packaging electrical components
EP1416778A2 (en) * 2002-11-01 2004-05-06 Alps Electric Co., Ltd. Small and securely-soldered electronic unit

Also Published As

Publication number Publication date
TW200719774A (en) 2007-05-16
DE102005046970A1 (en) 2007-04-05

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