WO2007011544A3 - Electronically connecting substrate with electrical device - Google Patents
Electronically connecting substrate with electrical device Download PDFInfo
- Publication number
- WO2007011544A3 WO2007011544A3 PCT/US2006/026446 US2006026446W WO2007011544A3 WO 2007011544 A3 WO2007011544 A3 WO 2007011544A3 US 2006026446 W US2006026446 W US 2006026446W WO 2007011544 A3 WO2007011544 A3 WO 2007011544A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrical device
- connecting substrate
- electronically connecting
- substrate
- wire
- Prior art date
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Classifications
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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Abstract
A substrate is electrically connected with an electrical device mounted on the substrate (100). A ball bond is formed between a first end of a wire and a bonding pad of the substrate (106). A reverse-motion loop is formed within the wire (108). A bond is formed between a second end of the wire and a bonding pad of the electrical device (118).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06786563A EP1908102A2 (en) | 2005-07-14 | 2006-06-29 | Electronically connecting substrate with electrical device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/181,479 US7476608B2 (en) | 2005-07-14 | 2005-07-14 | Electrically connecting substrate with electrical device |
US11/181,479 | 2005-07-14 |
Publications (2)
Publication Number | Publication Date |
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WO2007011544A2 WO2007011544A2 (en) | 2007-01-25 |
WO2007011544A3 true WO2007011544A3 (en) | 2007-08-30 |
Family
ID=37662160
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2006/026446 WO2007011544A2 (en) | 2005-07-14 | 2006-06-29 | Electronically connecting substrate with electrical device |
Country Status (4)
Country | Link |
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US (2) | US7476608B2 (en) |
EP (1) | EP1908102A2 (en) |
TW (1) | TWI416672B (en) |
WO (1) | WO2007011544A2 (en) |
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2006
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- 2006-06-29 EP EP06786563A patent/EP1908102A2/en not_active Withdrawn
- 2006-06-29 WO PCT/US2006/026446 patent/WO2007011544A2/en active Application Filing
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2008
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US20030102358A1 (en) * | 2001-12-05 | 2003-06-05 | Bowen Neal M. | Stacked chip connection using stand off stitch bonding |
EP1422014A1 (en) * | 2002-11-21 | 2004-05-26 | Kaijo Corporation | Semiconductor device having a wire loop with a crushed part on a ball, loop wire bonding method and loop wire bonding apparatus for carrying out such method |
Also Published As
Publication number | Publication date |
---|---|
TWI416672B (en) | 2013-11-21 |
US7576439B2 (en) | 2009-08-18 |
US20090014850A1 (en) | 2009-01-15 |
WO2007011544A2 (en) | 2007-01-25 |
US20070015353A1 (en) | 2007-01-18 |
US7476608B2 (en) | 2009-01-13 |
TW200705623A (en) | 2007-02-01 |
EP1908102A2 (en) | 2008-04-09 |
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