WO2007001334A3 - Activation of aluminum for electrodeposition or electroless deposition - Google Patents

Activation of aluminum for electrodeposition or electroless deposition Download PDF

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Publication number
WO2007001334A3
WO2007001334A3 PCT/US2005/028552 US2005028552W WO2007001334A3 WO 2007001334 A3 WO2007001334 A3 WO 2007001334A3 US 2005028552 W US2005028552 W US 2005028552W WO 2007001334 A3 WO2007001334 A3 WO 2007001334A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrodeposition
electroless deposition
aluminum
activation
alloy
Prior art date
Application number
PCT/US2005/028552
Other languages
French (fr)
Other versions
WO2007001334A2 (en
Inventor
Dmitri A Brevnov
Tim S Olson
Gabriel P Lopez
Plamen B Atanassov
Original Assignee
Stc Unm
Dmitri A Brevnov
Tim S Olson
Gabriel P Lopez
Plamen B Atanassov
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stc Unm, Dmitri A Brevnov, Tim S Olson, Gabriel P Lopez, Plamen B Atanassov filed Critical Stc Unm
Publication of WO2007001334A2 publication Critical patent/WO2007001334A2/en
Publication of WO2007001334A3 publication Critical patent/WO2007001334A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
    • C25D5/44—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
    • C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
    • C23C18/1837—Multistep pretreatment
    • C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/20—Acidic compositions for etching aluminium or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing

Abstract

Method for treating an aluminum alloy surface for electrodeposition or electroless deposition of a metal or alloy on the surface, the surface is oxidized (e.g. anodized) to form aluminum oxide, and then the oxidized surface is chemically etched to render the surface amenable for electrodeposition or electroless deposition of the metal or alloy thereon. A metallic coating can be electrodeposited or electroless deposited on the treated surface.
PCT/US2005/028552 2004-08-16 2005-08-11 Activation of aluminum for electrodeposition or electroless deposition WO2007001334A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US60191704P 2004-08-16 2004-08-16
US60/601,917 2004-08-16

Publications (2)

Publication Number Publication Date
WO2007001334A2 WO2007001334A2 (en) 2007-01-04
WO2007001334A3 true WO2007001334A3 (en) 2007-11-29

Family

ID=37595556

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/028552 WO2007001334A2 (en) 2004-08-16 2005-08-11 Activation of aluminum for electrodeposition or electroless deposition

Country Status (2)

Country Link
US (1) US20060032757A1 (en)
WO (1) WO2007001334A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060147683A1 (en) * 2004-12-30 2006-07-06 Harima Chemicals, Inc. Flux for soldering and circuit board
EP2074243A1 (en) * 2006-09-22 2009-07-01 Istanbul Teknik Universitesi Method for the preparation of nanostructures and nanowires
TW200827470A (en) * 2006-12-18 2008-07-01 Univ Nat Defense Process for preparing a nano-carbon material field emission cathode plate
US7741219B2 (en) * 2007-06-29 2010-06-22 Intel Corporation Method for manufacturing a semiconductor device using the self aligned contact (SAC) process flow for semiconductor devices with aluminum metal gates
US8545994B2 (en) * 2009-06-02 2013-10-01 Integran Technologies Inc. Electrodeposited metallic materials comprising cobalt
US8309233B2 (en) 2009-06-02 2012-11-13 Integran Technologies, Inc. Electrodeposited metallic-materials comprising cobalt on ferrous-alloy substrates
US9036397B2 (en) * 2010-04-02 2015-05-19 Macronix International Co., Ltd. Resistive memory array and method for controlling operations of the same
CN104634727A (en) * 2015-02-04 2015-05-20 北京工业大学 Method for optimizing corrosion resistant composition of ultrahigh-strength Al-Zn-Mg-Cu alloy
DE102015213162A1 (en) * 2015-07-14 2017-01-19 MTU Aero Engines AG Process for the galvanic coating of TiAl alloys
JP6869373B2 (en) 2017-01-18 2021-05-12 アーコニック テクノロジーズ エルエルシーＡｒｃｏｎｉｃ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｌｌｃ Preparation method of 7XXX aluminum alloy for adhesive bonding and related products
CN110249077B (en) 2017-03-06 2022-05-31 奥科宁克技术有限责任公司 Method of pre-processing 7XXX aluminum alloys for adhesive bonding and products related thereto
MX2019015390A (en) 2017-06-28 2020-02-20 Arconic Tech Llc Preparation methods for adhesive bonding of 7xxx aluminum alloys, and products relating to the same.

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4337091A (en) * 1981-03-23 1982-06-29 Hooker Chemicals & Plastics Corp. Electroless gold plating
US4624752A (en) * 1983-06-02 1986-11-25 The Secretary Of State For Defence In Her Brittanic Majesty's Government Of The United Kingdom Of Great Britian And Northern Ireland Surface pretreatment of aluminium and aluminium alloys prior to adhesive bonding, electroplating or painting
US5277790A (en) * 1992-07-10 1994-01-11 Technic Incorporated Non-cyanide electroplating solution for gold or alloys thereof
US6057236A (en) * 1998-06-26 2000-05-02 International Business Machines Corporation CVD/PVD method of filling structures using discontinuous CVD AL liner

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4657752A (en) * 1985-04-16 1987-04-14 Phillips Petroleum Company Process for preparing ferrous carbonate
US5218472A (en) * 1989-03-22 1993-06-08 Alcan International Limited Optical interference structures incorporating porous films
US5202290A (en) * 1991-12-02 1993-04-13 Martin Moskovits Process for manufacture of quantum dot and quantum wire semiconductors
US6404615B1 (en) * 2000-02-16 2002-06-11 Intarsia Corporation Thin film capacitors

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4337091A (en) * 1981-03-23 1982-06-29 Hooker Chemicals & Plastics Corp. Electroless gold plating
US4624752A (en) * 1983-06-02 1986-11-25 The Secretary Of State For Defence In Her Brittanic Majesty's Government Of The United Kingdom Of Great Britian And Northern Ireland Surface pretreatment of aluminium and aluminium alloys prior to adhesive bonding, electroplating or painting
US5277790A (en) * 1992-07-10 1994-01-11 Technic Incorporated Non-cyanide electroplating solution for gold or alloys thereof
US6057236A (en) * 1998-06-26 2000-05-02 International Business Machines Corporation CVD/PVD method of filling structures using discontinuous CVD AL liner

Also Published As

Publication number Publication date
US20060032757A1 (en) 2006-02-16
WO2007001334A2 (en) 2007-01-04

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