WO2006138489A3 - Chip-based thermo-stack - Google Patents

Chip-based thermo-stack Download PDF

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Publication number
WO2006138489A3
WO2006138489A3 PCT/US2006/023361 US2006023361W WO2006138489A3 WO 2006138489 A3 WO2006138489 A3 WO 2006138489A3 US 2006023361 W US2006023361 W US 2006023361W WO 2006138489 A3 WO2006138489 A3 WO 2006138489A3
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WO
WIPO (PCT)
Prior art keywords
stack
chips
working fluid
chip
tube
Prior art date
Application number
PCT/US2006/023361
Other languages
French (fr)
Other versions
WO2006138489A2 (en
Inventor
John Trezza
Original Assignee
Cubic Wafer Inc
John Trezza
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cubic Wafer Inc, John Trezza filed Critical Cubic Wafer Inc
Publication of WO2006138489A2 publication Critical patent/WO2006138489A2/en
Publication of WO2006138489A3 publication Critical patent/WO2006138489A3/en

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    • H01L21/71Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
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Abstract

A chip unit has a stack of at least two electronic chips stacked one on top of the other, a through-chip connection within the stack, the through chip connection including a bounding material having an inner and outer perimeter, the inner perimeter defining an interior volume longitudinally extending through at least one of the at least two chips and at least partially into another of the at least two chips so as to form a tube extending between the one and the other of the chips, and an amount of working fluid hermetically sealed within the tube, the working fluid having a volume and being at a pressure such that the working fluid and tube will operate as a heat pipe and transfer heat from the stack of chips to the working fluid.
PCT/US2006/023361 2005-06-14 2006-06-14 Chip-based thermo-stack WO2006138489A2 (en)

Applications Claiming Priority (4)

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US69075905P 2005-06-14 2005-06-14
US60/690,759 2005-06-14
US11/329,558 2006-01-10
US11/329,558 US7560813B2 (en) 2005-06-14 2006-01-10 Chip-based thermo-stack

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WO2006138489A2 WO2006138489A2 (en) 2006-12-28
WO2006138489A3 true WO2006138489A3 (en) 2007-11-15

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US20060281219A1 (en) 2006-12-14

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