WO2006132663A3 - Nano-sized metals and alloys, and methods of assembling packages containing same - Google Patents

Nano-sized metals and alloys, and methods of assembling packages containing same Download PDF

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Publication number
WO2006132663A3
WO2006132663A3 PCT/US2005/035409 US2005035409W WO2006132663A3 WO 2006132663 A3 WO2006132663 A3 WO 2006132663A3 US 2005035409 W US2005035409 W US 2005035409W WO 2006132663 A3 WO2006132663 A3 WO 2006132663A3
Authority
WO
WIPO (PCT)
Prior art keywords
nano
alloys
methods
containing same
packages containing
Prior art date
Application number
PCT/US2005/035409
Other languages
French (fr)
Other versions
WO2006132663A2 (en
Inventor
Fay Hua
Michael Garner
Original Assignee
Intel Corp
Fay Hua
Michael Garner
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp, Fay Hua, Michael Garner filed Critical Intel Corp
Priority to CN2005800330551A priority Critical patent/CN101084079B/en
Priority to EP05857952A priority patent/EP1793949B1/en
Priority to DE602005021974T priority patent/DE602005021974D1/en
Priority to JP2007534841A priority patent/JP2008515635A/en
Priority to AT05857952T priority patent/ATE471780T1/en
Priority to KR1020077007239A priority patent/KR101060405B1/en
Publication of WO2006132663A2 publication Critical patent/WO2006132663A2/en
Publication of WO2006132663A3 publication Critical patent/WO2006132663A3/en
Priority to HK08105845.8A priority patent/HK1111123A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • H—ELECTRICITY
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H01L2924/11—Device type
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    • H01L2924/1204—Optical Diode
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    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0257—Nanoparticles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10S977/773—Nanoparticle, i.e. structure having three dimensions of 100 nm or less
    • Y10S977/775—Nanosized powder or flake, e.g. nanosized catalyst
    • Y10S977/777—Metallic powder or flake
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y10T428/12049—Nonmetal component

Abstract

A nano-sized metal particle composition includes a first metal that has a particle size of about 20 nanometer or smaller. The nano-sized metal particle can include a second metal that forms a shell about the first metal. A microelectronic package is also disclosed that uses the nano-sized metal particle composition. A method of assembling a microelectronic package is also disclosed. A computing system is also disclosed that includes the nano-sized metal particle composition.
PCT/US2005/035409 2004-09-30 2005-09-30 Nano-sized metals and alloys, and methods of assembling packages containing same WO2006132663A2 (en)

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CN2005800330551A CN101084079B (en) 2004-09-30 2005-09-30 Nano-sized metals and alloys, and methods of assembling packages containing same
EP05857952A EP1793949B1 (en) 2004-09-30 2005-09-30 Nano-sized metals and alloys, and methods of assembling packages containing same
DE602005021974T DE602005021974D1 (en) 2004-09-30 2005-09-30 METALS AND ALLOYS IN THE NANOMASSIST AND METHOD FOR MOUNTING ASSEMBLIES THEREWITH
JP2007534841A JP2008515635A (en) 2004-09-30 2005-09-30 Nano-sized metals and alloys, and methods for assembling packages containing them
AT05857952T ATE471780T1 (en) 2004-09-30 2005-09-30 METALS AND ALLOYS ON THE NANOM SCALE AND METHOD FOR MOUNTING ASSEMBLIES THEREWITH
KR1020077007239A KR101060405B1 (en) 2004-09-30 2005-09-30 Nano size metals and alloys, and packages containing them
HK08105845.8A HK1111123A1 (en) 2004-09-30 2008-05-26 Nano-sized metals and alloys, and methods of assembling packages containing same

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US10/957,196 US7524351B2 (en) 2004-09-30 2004-09-30 Nano-sized metals and alloys, and methods of assembling packages containing same
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US7524351B2 (en) 2009-04-28
EP1793949A2 (en) 2007-06-13
HK1111123A1 (en) 2008-08-01
CN101084079B (en) 2012-07-18
KR20110052751A (en) 2011-05-18
EP1793949B1 (en) 2010-06-23
TWI313502B (en) 2009-08-11
CN101084079A (en) 2007-12-05
WO2006132663A2 (en) 2006-12-14
KR101060405B1 (en) 2011-08-29
CN102646659B (en) 2015-07-29
US20060068216A1 (en) 2006-03-30
CN102646659A (en) 2012-08-22
JP2008515635A (en) 2008-05-15
HK1175025A1 (en) 2013-06-21
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ATE471780T1 (en) 2010-07-15
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