WO2006124792A3 - Superhard cutters and associated methods - Google Patents

Superhard cutters and associated methods Download PDF

Info

Publication number
WO2006124792A3
WO2006124792A3 PCT/US2006/018761 US2006018761W WO2006124792A3 WO 2006124792 A3 WO2006124792 A3 WO 2006124792A3 US 2006018761 W US2006018761 W US 2006018761W WO 2006124792 A3 WO2006124792 A3 WO 2006124792A3
Authority
WO
WIPO (PCT)
Prior art keywords
associated methods
cutting
superhard cutters
base
working side
Prior art date
Application number
PCT/US2006/018761
Other languages
French (fr)
Other versions
WO2006124792A2 (en
Inventor
Chien-Min Sung
Original Assignee
Chien-Min Sung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chien-Min Sung filed Critical Chien-Min Sung
Priority to JP2008512410A priority Critical patent/JP2008540154A/en
Priority to EP06759862A priority patent/EP1879719A2/en
Publication of WO2006124792A2 publication Critical patent/WO2006124792A2/en
Publication of WO2006124792A3 publication Critical patent/WO2006124792A3/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/24Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting

Abstract

A cutting device (10) comprises a base (12) having a working side (14) that is oriented to face a workpiece (19) from which material is to be removed. A plurality of individual cutting elements (16) are arranged on the working side of the base, with each cutting element having a peak that comprises at least one cutting edge (18) that is formed from a polycrystalline superhard material. The peaks of the cutting elements are aligned in a common plane (20).
PCT/US2006/018761 2005-05-16 2006-05-12 Superhard cutters and associated methods WO2006124792A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008512410A JP2008540154A (en) 2005-05-16 2006-05-12 Carbide cutting tool and related method
EP06759862A EP1879719A2 (en) 2005-05-16 2006-05-12 Superhard cutters and associated methods

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US68179805P 2005-05-16 2005-05-16
US60/681,798 2005-05-16
US11/357,713 US20060258276A1 (en) 2005-05-16 2006-02-17 Superhard cutters and associated methods
US11/357,713 2006-02-17

Publications (2)

Publication Number Publication Date
WO2006124792A2 WO2006124792A2 (en) 2006-11-23
WO2006124792A3 true WO2006124792A3 (en) 2007-08-16

Family

ID=37419762

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/018761 WO2006124792A2 (en) 2005-05-16 2006-05-12 Superhard cutters and associated methods

Country Status (6)

Country Link
US (1) US20060258276A1 (en)
EP (1) EP1879719A2 (en)
JP (1) JP2008540154A (en)
KR (1) KR20080007343A (en)
TW (1) TWI304761B (en)
WO (1) WO2006124792A2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8974270B2 (en) 2011-05-23 2015-03-10 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US9475169B2 (en) 2009-09-29 2016-10-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9868100B2 (en) 1997-04-04 2018-01-16 Chien-Min Sung Brazed diamond tools and methods for making the same
US20070060026A1 (en) 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
US8622787B2 (en) 2006-11-16 2014-01-07 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US9724802B2 (en) 2005-05-16 2017-08-08 Chien-Min Sung CMP pad dressers having leveled tips and associated methods
US8398466B2 (en) 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
BRPI0615020A2 (en) * 2005-08-25 2009-08-04 Hiroshi Ishizuka tool with sintered body polishing surface and manufacturing method
US20150017884A1 (en) * 2006-11-16 2015-01-15 Chien-Min Sung CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods
US20080153398A1 (en) * 2006-11-16 2008-06-26 Chien-Min Sung Cmp pad conditioners and associated methods
DE102007051047B4 (en) * 2007-10-16 2023-03-23 Nagel Maschinen- Und Werkzeugfabrik Gmbh Press-on device for finishing belt and device and method for finishing peripheral surfaces on cylindrical workpiece sections
CN101903131B (en) 2007-11-13 2013-01-02 宋健民 CMP pad dressers
US9011563B2 (en) 2007-12-06 2015-04-21 Chien-Min Sung Methods for orienting superabrasive particles on a surface and associated tools
CN101463836B (en) * 2007-12-17 2014-08-13 建准电机工业股份有限公司 Fan frame body
WO2009088772A2 (en) * 2007-12-31 2009-07-16 Saint-Gobain Abrasives, Inc. Interface pad for use between an abrasive article and a support tool
GB0823086D0 (en) * 2008-12-18 2009-01-28 Univ Nottingham Abrasive Tools
KR20120112662A (en) * 2009-12-30 2012-10-11 쓰리엠 이노베이티브 프로퍼티즈 컴파니 Organic particulate loaded polishing pads and method of making and using the same
JP6004941B2 (en) 2009-12-30 2016-10-12 スリーエム イノベイティブ プロパティズ カンパニー Polishing pad containing a phase-separated polymer blend and method for making and using the same
KR101091030B1 (en) * 2010-04-08 2011-12-09 이화다이아몬드공업 주식회사 Method for producing pad conditioner having reduced friction
CN103221180A (en) 2010-09-21 2013-07-24 铼钻科技股份有限公司 Superabrasive tools having substantially leveled particle tips and associated methods
US20120171935A1 (en) * 2010-12-20 2012-07-05 Diamond Innovations, Inc. CMP PAD Conditioning Tool
JP2013049112A (en) * 2011-08-31 2013-03-14 Kyushu Institute Of Technology Polishing pad and manufacturing method thereof
CN103372809A (en) * 2012-04-12 2013-10-30 江西赛维Ldk太阳能高科技有限公司 Method for improving silicon block ground surface quality
JP6188286B2 (en) * 2012-07-13 2017-08-30 スリーエム イノベイティブ プロパティズ カンパニー Polishing pad and glass, ceramics, and metal material polishing method
TWI529893B (en) * 2012-09-01 2016-04-11 萬國半導體股份有限公司 An assembly method of die with thick metal
JP5976228B2 (en) * 2013-08-26 2016-08-23 株式会社東京精密 Dicing blade
JP6337458B2 (en) * 2013-12-16 2018-06-06 株式会社リコー Polishing sheet and polishing tool
JP6199231B2 (en) * 2014-04-15 2017-09-20 株式会社ノリタケカンパニーリミテド Whetstone for lapping
CN112388522A (en) * 2019-08-12 2021-02-23 南昌巨晶砂轮科技有限公司 Preparation method of grinding tool for grinding arc teeth
KR102570825B1 (en) * 2020-07-16 2023-08-28 한국생산기술연구원 Polishing pad including porous protruding pattern and polishing apparatus including the same
US20230226660A1 (en) * 2020-07-16 2023-07-20 Korea Institute Of Industrial Technology Polishing pad, polishing device including same, and manufacturing method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3852078A (en) * 1970-12-24 1974-12-03 M Wakatsuki Mass of polycrystalline cubic system boron nitride and composites of polycrystalline cubic system boron nitride and other hard materials, and processes for manufacturing the same
US6027659A (en) * 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
US6213856B1 (en) * 1998-04-25 2001-04-10 Samsung Electronics Co., Ltd. Conditioner and conditioning disk for a CMP pad, and method of fabricating, reworking, and cleaning conditioning disk
US20030114094A1 (en) * 1999-10-12 2003-06-19 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same

Family Cites Families (66)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3767371A (en) * 1971-07-01 1973-10-23 Gen Electric Cubic boron nitride/sintered carbide abrasive bodies
US3743489A (en) * 1971-07-01 1973-07-03 Gen Electric Abrasive bodies of finely-divided cubic boron nitride crystals
IE48798B1 (en) * 1978-08-18 1985-05-15 De Beers Ind Diamond Method of making tool inserts,wire-drawing die blank and drill bit comprising such inserts
US4662896A (en) * 1986-02-19 1987-05-05 Strata Bit Corporation Method of making an abrasive cutting element
US5195404A (en) * 1987-06-18 1993-03-23 Notter Theo A Drill bit with cutting insert
US4849602A (en) * 1988-08-12 1989-07-18 Iscar Ltd. Method for fabricating cutting pieces
US4923490A (en) * 1988-12-16 1990-05-08 General Electric Company Novel grinding wheels utilizing polycrystalline diamond or cubic boron nitride grit
US4925457B1 (en) * 1989-01-30 1995-09-26 Ultimate Abrasive Syst Inc Method for making an abrasive tool
US5049165B1 (en) * 1989-01-30 1995-09-26 Ultimate Abrasive Syst Inc Composite material
US5190568B1 (en) * 1989-01-30 1996-03-12 Ultimate Abrasive Syst Inc Abrasive tool with contoured surface
US4954139A (en) * 1989-03-31 1990-09-04 The General Electric Company Method for producing polycrystalline compact tool blanks with flat carbide support/diamond or CBN interfaces
GB9006703D0 (en) * 1990-03-26 1990-05-23 De Beers Ind Diamond Abrasive product
EP0488623B1 (en) * 1990-11-26 1996-02-21 De Beers Industrial Diamond Division (Proprietary) Limited Cutting insert for a rotary cutting tool
GB9104366D0 (en) * 1991-03-01 1991-04-17 De Beers Ind Diamond Composite cutting insert
US5380390B1 (en) * 1991-06-10 1996-10-01 Ultimate Abras Systems Inc Patterned abrasive material and method
US5247765A (en) * 1991-07-23 1993-09-28 Abrasive Technology Europe, S.A. Abrasive product comprising a plurality of discrete composite abrasive pellets in a resilient resin matrix
DE4210957A1 (en) * 1992-04-02 1993-10-07 Heidelberger Druckmasch Ag Method for monitoring the transport of printed products in a printing machine
JPH0639729A (en) * 1992-05-29 1994-02-15 Canon Inc Precision grinding wheel and its manufacture
GB9310500D0 (en) * 1993-05-21 1993-07-07 De Beers Ind Diamond Cutting tool
WO1995000295A1 (en) * 1993-06-17 1995-01-05 Minnesota Mining And Manufacturing Company Patterned abrading articles and methods making and using same
US5681612A (en) * 1993-06-17 1997-10-28 Minnesota Mining And Manufacturing Company Coated abrasives and methods of preparation
US5453106A (en) * 1993-10-27 1995-09-26 Roberts; Ellis E. Oriented particles in hard surfaces
US5486131A (en) * 1994-01-04 1996-01-23 Speedfam Corporation Device for conditioning polishing pads
US5547417A (en) * 1994-03-21 1996-08-20 Intel Corporation Method and apparatus for conditioning a semiconductor polishing pad
US5536202A (en) * 1994-07-27 1996-07-16 Texas Instruments Incorporated Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish
EP0783394B1 (en) * 1994-09-30 2003-05-14 Minnesota Mining And Manufacturing Company Coated abrasive article and method for preparing the same
US5527424A (en) * 1995-01-30 1996-06-18 Motorola, Inc. Preconditioner for a polishing pad and method for using the same
US6478831B2 (en) * 1995-06-07 2002-11-12 Ultimate Abrasive Systems, L.L.C. Abrasive surface and article and methods for making them
US5560754A (en) * 1995-06-13 1996-10-01 General Electric Company Reduction of stresses in the polycrystalline abrasive layer of a composite compact with in situ bonded carbide/carbide support
US6371838B1 (en) * 1996-07-15 2002-04-16 Speedfam-Ipec Corporation Polishing pad conditioning device with cutting elements
US5851138A (en) * 1996-08-15 1998-12-22 Texas Instruments Incorporated Polishing pad conditioning system and method
US6190240B1 (en) * 1996-10-15 2001-02-20 Nippon Steel Corporation Method for producing pad conditioner for semiconductor substrates
US6884155B2 (en) * 1999-11-22 2005-04-26 Kinik Diamond grid CMP pad dresser
US6368198B1 (en) * 1999-11-22 2002-04-09 Kinik Company Diamond grid CMP pad dresser
US7124753B2 (en) * 1997-04-04 2006-10-24 Chien-Min Sung Brazed diamond tools and methods for making the same
US5921855A (en) * 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
JP3244454B2 (en) * 1997-06-05 2002-01-07 理化学研究所 Cutting and grinding dual use tool
US6054183A (en) * 1997-07-10 2000-04-25 Zimmer; Jerry W. Method for making CVD diamond coated substrate for polishing pad conditioning head
US5921856A (en) * 1997-07-10 1999-07-13 Sp3, Inc. CVD diamond coated substrate for polishing pad conditioning head and method for making same
CA2261491C (en) * 1998-03-06 2005-05-24 Smith International, Inc. Cutting element with improved polycrystalline material toughness and method for making same
JP3295888B2 (en) * 1998-04-22 2002-06-24 株式会社藤森技術研究所 Polishing dresser for polishing machine of chemical machine polisher
US6354918B1 (en) * 1998-06-19 2002-03-12 Ebara Corporation Apparatus and method for polishing workpiece
US6299508B1 (en) * 1998-08-05 2001-10-09 3M Innovative Properties Company Abrasive article with integrally molded front surface protrusions containing a grinding aid and methods of making and using
GB2354470B (en) * 1999-05-24 2004-02-04 Honda Motor Co Ltd Cutting tip and manufacturing method thereof
US6319108B1 (en) * 1999-07-09 2001-11-20 3M Innovative Properties Company Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece
US6755720B1 (en) * 1999-07-15 2004-06-29 Noritake Co., Limited Vitrified bond tool and method of manufacturing the same
US6281129B1 (en) * 1999-09-20 2001-08-28 Agere Systems Guardian Corp. Corrosion-resistant polishing pad conditioner
US7201645B2 (en) * 1999-11-22 2007-04-10 Chien-Min Sung Contoured CMP pad dresser and associated methods
JP3527448B2 (en) * 1999-12-20 2004-05-17 株式会社リード Dresser for CMP polishing cloth and its manufacturing method
WO2002011876A2 (en) * 2000-08-08 2002-02-14 Element Six (Pty) Ltd. Method of producing an abrasive product containing diamond
US20020042200A1 (en) * 2000-10-02 2002-04-11 Clyde Fawcett Method for conditioning polishing pads
US20030207659A1 (en) * 2000-11-03 2003-11-06 3M Innovative Properties Company Abrasive product and method of making and using the same
US8545583B2 (en) * 2000-11-17 2013-10-01 Wayne O. Duescher Method of forming a flexible abrasive sheet article
WO2002049807A1 (en) * 2000-12-21 2002-06-27 Nippon Steel Corporation Cmp conditioner, method for arranging rigid grains used for cmp conditioner, and method for manufacturing cmp conditioner
DE60231473D1 (en) * 2001-01-12 2009-04-23 Oxford Instr Superconductivity METHOD AND DEVICE FOR GENERATING A MAGNETIC FIELD
US6672943B2 (en) * 2001-01-26 2004-01-06 Wafer Solutions, Inc. Eccentric abrasive wheel for wafer processing
KR100428947B1 (en) * 2001-09-28 2004-04-29 이화다이아몬드공업 주식회사 Diamond Tool
US20050060941A1 (en) * 2003-09-23 2005-03-24 3M Innovative Properties Company Abrasive article and methods of making the same
JP2005262341A (en) * 2004-03-16 2005-09-29 Noritake Super Abrasive:Kk Cmp pad conditioner
US20050260939A1 (en) * 2004-05-18 2005-11-24 Saint-Gobain Abrasives, Inc. Brazed diamond dressing tool
US6945857B1 (en) * 2004-07-08 2005-09-20 Applied Materials, Inc. Polishing pad conditioner and methods of manufacture and recycling
US20070060026A1 (en) * 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
US7066795B2 (en) * 2004-10-12 2006-06-27 Applied Materials, Inc. Polishing pad conditioner with shaped abrasive patterns and channels
US7258708B2 (en) * 2004-12-30 2007-08-21 Chien-Min Sung Chemical mechanical polishing pad dresser
KR100693251B1 (en) * 2005-03-07 2007-03-13 삼성전자주식회사 Pad conditioner for improving removal rate and roughness of polishing pad and chemical mechanical polishing apparatus using the same
US7300338B2 (en) * 2005-09-22 2007-11-27 Abrasive Technology, Inc. CMP diamond conditioning disk

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3852078A (en) * 1970-12-24 1974-12-03 M Wakatsuki Mass of polycrystalline cubic system boron nitride and composites of polycrystalline cubic system boron nitride and other hard materials, and processes for manufacturing the same
US6027659A (en) * 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
US6213856B1 (en) * 1998-04-25 2001-04-10 Samsung Electronics Co., Ltd. Conditioner and conditioning disk for a CMP pad, and method of fabricating, reworking, and cleaning conditioning disk
US20030114094A1 (en) * 1999-10-12 2003-06-19 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9199357B2 (en) 1997-04-04 2015-12-01 Chien-Min Sung Brazed diamond tools and methods for making the same
US9221154B2 (en) 1997-04-04 2015-12-29 Chien-Min Sung Diamond tools and methods for making the same
US9238207B2 (en) 1997-04-04 2016-01-19 Chien-Min Sung Brazed diamond tools and methods for making the same
US9409280B2 (en) 1997-04-04 2016-08-09 Chien-Min Sung Brazed diamond tools and methods for making the same
US9463552B2 (en) 1997-04-04 2016-10-11 Chien-Min Sung Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods
US9475169B2 (en) 2009-09-29 2016-10-25 Chien-Min Sung System for evaluating and/or improving performance of a CMP pad dresser
US8974270B2 (en) 2011-05-23 2015-03-10 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US9138862B2 (en) 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods

Also Published As

Publication number Publication date
TW200730302A (en) 2007-08-16
WO2006124792A2 (en) 2006-11-23
US20060258276A1 (en) 2006-11-16
KR20080007343A (en) 2008-01-18
TWI304761B (en) 2009-01-01
JP2008540154A (en) 2008-11-20
EP1879719A2 (en) 2008-01-23

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