WO2006124792A3 - Superhard cutters and associated methods - Google Patents
Superhard cutters and associated methods Download PDFInfo
- Publication number
- WO2006124792A3 WO2006124792A3 PCT/US2006/018761 US2006018761W WO2006124792A3 WO 2006124792 A3 WO2006124792 A3 WO 2006124792A3 US 2006018761 W US2006018761 W US 2006018761W WO 2006124792 A3 WO2006124792 A3 WO 2006124792A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- associated methods
- cutting
- superhard cutters
- base
- working side
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008512410A JP2008540154A (en) | 2005-05-16 | 2006-05-12 | Carbide cutting tool and related method |
EP06759862A EP1879719A2 (en) | 2005-05-16 | 2006-05-12 | Superhard cutters and associated methods |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US68179805P | 2005-05-16 | 2005-05-16 | |
US60/681,798 | 2005-05-16 | ||
US11/357,713 US20060258276A1 (en) | 2005-05-16 | 2006-02-17 | Superhard cutters and associated methods |
US11/357,713 | 2006-02-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006124792A2 WO2006124792A2 (en) | 2006-11-23 |
WO2006124792A3 true WO2006124792A3 (en) | 2007-08-16 |
Family
ID=37419762
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2006/018761 WO2006124792A2 (en) | 2005-05-16 | 2006-05-12 | Superhard cutters and associated methods |
Country Status (6)
Country | Link |
---|---|
US (1) | US20060258276A1 (en) |
EP (1) | EP1879719A2 (en) |
JP (1) | JP2008540154A (en) |
KR (1) | KR20080007343A (en) |
TW (1) | TWI304761B (en) |
WO (1) | WO2006124792A2 (en) |
Cited By (8)
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---|---|---|---|---|
US8974270B2 (en) | 2011-05-23 | 2015-03-10 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
US9138862B2 (en) | 2011-05-23 | 2015-09-22 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
US9199357B2 (en) | 1997-04-04 | 2015-12-01 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9221154B2 (en) | 1997-04-04 | 2015-12-29 | Chien-Min Sung | Diamond tools and methods for making the same |
US9238207B2 (en) | 1997-04-04 | 2016-01-19 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9409280B2 (en) | 1997-04-04 | 2016-08-09 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9463552B2 (en) | 1997-04-04 | 2016-10-11 | Chien-Min Sung | Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods |
US9475169B2 (en) | 2009-09-29 | 2016-10-25 | Chien-Min Sung | System for evaluating and/or improving performance of a CMP pad dresser |
Families Citing this family (30)
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---|---|---|---|---|
US9868100B2 (en) | 1997-04-04 | 2018-01-16 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US20070060026A1 (en) | 2005-09-09 | 2007-03-15 | Chien-Min Sung | Methods of bonding superabrasive particles in an organic matrix |
US8622787B2 (en) | 2006-11-16 | 2014-01-07 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
US9724802B2 (en) | 2005-05-16 | 2017-08-08 | Chien-Min Sung | CMP pad dressers having leveled tips and associated methods |
US8398466B2 (en) | 2006-11-16 | 2013-03-19 | Chien-Min Sung | CMP pad conditioners with mosaic abrasive segments and associated methods |
US8393934B2 (en) | 2006-11-16 | 2013-03-12 | Chien-Min Sung | CMP pad dressers with hybridized abrasive surface and related methods |
BRPI0615020A2 (en) * | 2005-08-25 | 2009-08-04 | Hiroshi Ishizuka | tool with sintered body polishing surface and manufacturing method |
US20150017884A1 (en) * | 2006-11-16 | 2015-01-15 | Chien-Min Sung | CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods |
US20080153398A1 (en) * | 2006-11-16 | 2008-06-26 | Chien-Min Sung | Cmp pad conditioners and associated methods |
DE102007051047B4 (en) * | 2007-10-16 | 2023-03-23 | Nagel Maschinen- Und Werkzeugfabrik Gmbh | Press-on device for finishing belt and device and method for finishing peripheral surfaces on cylindrical workpiece sections |
CN101903131B (en) | 2007-11-13 | 2013-01-02 | 宋健民 | CMP pad dressers |
US9011563B2 (en) | 2007-12-06 | 2015-04-21 | Chien-Min Sung | Methods for orienting superabrasive particles on a surface and associated tools |
CN101463836B (en) * | 2007-12-17 | 2014-08-13 | 建准电机工业股份有限公司 | Fan frame body |
WO2009088772A2 (en) * | 2007-12-31 | 2009-07-16 | Saint-Gobain Abrasives, Inc. | Interface pad for use between an abrasive article and a support tool |
GB0823086D0 (en) * | 2008-12-18 | 2009-01-28 | Univ Nottingham | Abrasive Tools |
KR20120112662A (en) * | 2009-12-30 | 2012-10-11 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Organic particulate loaded polishing pads and method of making and using the same |
JP6004941B2 (en) | 2009-12-30 | 2016-10-12 | スリーエム イノベイティブ プロパティズ カンパニー | Polishing pad containing a phase-separated polymer blend and method for making and using the same |
KR101091030B1 (en) * | 2010-04-08 | 2011-12-09 | 이화다이아몬드공업 주식회사 | Method for producing pad conditioner having reduced friction |
CN103221180A (en) | 2010-09-21 | 2013-07-24 | 铼钻科技股份有限公司 | Superabrasive tools having substantially leveled particle tips and associated methods |
US20120171935A1 (en) * | 2010-12-20 | 2012-07-05 | Diamond Innovations, Inc. | CMP PAD Conditioning Tool |
JP2013049112A (en) * | 2011-08-31 | 2013-03-14 | Kyushu Institute Of Technology | Polishing pad and manufacturing method thereof |
CN103372809A (en) * | 2012-04-12 | 2013-10-30 | 江西赛维Ldk太阳能高科技有限公司 | Method for improving silicon block ground surface quality |
JP6188286B2 (en) * | 2012-07-13 | 2017-08-30 | スリーエム イノベイティブ プロパティズ カンパニー | Polishing pad and glass, ceramics, and metal material polishing method |
TWI529893B (en) * | 2012-09-01 | 2016-04-11 | 萬國半導體股份有限公司 | An assembly method of die with thick metal |
JP5976228B2 (en) * | 2013-08-26 | 2016-08-23 | 株式会社東京精密 | Dicing blade |
JP6337458B2 (en) * | 2013-12-16 | 2018-06-06 | 株式会社リコー | Polishing sheet and polishing tool |
JP6199231B2 (en) * | 2014-04-15 | 2017-09-20 | 株式会社ノリタケカンパニーリミテド | Whetstone for lapping |
CN112388522A (en) * | 2019-08-12 | 2021-02-23 | 南昌巨晶砂轮科技有限公司 | Preparation method of grinding tool for grinding arc teeth |
KR102570825B1 (en) * | 2020-07-16 | 2023-08-28 | 한국생산기술연구원 | Polishing pad including porous protruding pattern and polishing apparatus including the same |
US20230226660A1 (en) * | 2020-07-16 | 2023-07-20 | Korea Institute Of Industrial Technology | Polishing pad, polishing device including same, and manufacturing method thereof |
Citations (4)
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US3852078A (en) * | 1970-12-24 | 1974-12-03 | M Wakatsuki | Mass of polycrystalline cubic system boron nitride and composites of polycrystalline cubic system boron nitride and other hard materials, and processes for manufacturing the same |
US6027659A (en) * | 1997-12-03 | 2000-02-22 | Intel Corporation | Polishing pad conditioning surface having integral conditioning points |
US6213856B1 (en) * | 1998-04-25 | 2001-04-10 | Samsung Electronics Co., Ltd. | Conditioner and conditioning disk for a CMP pad, and method of fabricating, reworking, and cleaning conditioning disk |
US20030114094A1 (en) * | 1999-10-12 | 2003-06-19 | Hunatech Co., Ltd. | Conditioner for polishing pad and method for manufacturing the same |
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US7258708B2 (en) * | 2004-12-30 | 2007-08-21 | Chien-Min Sung | Chemical mechanical polishing pad dresser |
KR100693251B1 (en) * | 2005-03-07 | 2007-03-13 | 삼성전자주식회사 | Pad conditioner for improving removal rate and roughness of polishing pad and chemical mechanical polishing apparatus using the same |
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-
2006
- 2006-02-17 US US11/357,713 patent/US20060258276A1/en not_active Abandoned
- 2006-05-04 TW TW095115836A patent/TWI304761B/en not_active IP Right Cessation
- 2006-05-12 JP JP2008512410A patent/JP2008540154A/en not_active Withdrawn
- 2006-05-12 KR KR1020077025405A patent/KR20080007343A/en not_active Application Discontinuation
- 2006-05-12 WO PCT/US2006/018761 patent/WO2006124792A2/en active Application Filing
- 2006-05-12 EP EP06759862A patent/EP1879719A2/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3852078A (en) * | 1970-12-24 | 1974-12-03 | M Wakatsuki | Mass of polycrystalline cubic system boron nitride and composites of polycrystalline cubic system boron nitride and other hard materials, and processes for manufacturing the same |
US6027659A (en) * | 1997-12-03 | 2000-02-22 | Intel Corporation | Polishing pad conditioning surface having integral conditioning points |
US6213856B1 (en) * | 1998-04-25 | 2001-04-10 | Samsung Electronics Co., Ltd. | Conditioner and conditioning disk for a CMP pad, and method of fabricating, reworking, and cleaning conditioning disk |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9199357B2 (en) | 1997-04-04 | 2015-12-01 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9221154B2 (en) | 1997-04-04 | 2015-12-29 | Chien-Min Sung | Diamond tools and methods for making the same |
US9238207B2 (en) | 1997-04-04 | 2016-01-19 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9409280B2 (en) | 1997-04-04 | 2016-08-09 | Chien-Min Sung | Brazed diamond tools and methods for making the same |
US9463552B2 (en) | 1997-04-04 | 2016-10-11 | Chien-Min Sung | Superbrasvie tools containing uniformly leveled superabrasive particles and associated methods |
US9475169B2 (en) | 2009-09-29 | 2016-10-25 | Chien-Min Sung | System for evaluating and/or improving performance of a CMP pad dresser |
US8974270B2 (en) | 2011-05-23 | 2015-03-10 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
US9138862B2 (en) | 2011-05-23 | 2015-09-22 | Chien-Min Sung | CMP pad dresser having leveled tips and associated methods |
Also Published As
Publication number | Publication date |
---|---|
TW200730302A (en) | 2007-08-16 |
WO2006124792A2 (en) | 2006-11-23 |
US20060258276A1 (en) | 2006-11-16 |
KR20080007343A (en) | 2008-01-18 |
TWI304761B (en) | 2009-01-01 |
JP2008540154A (en) | 2008-11-20 |
EP1879719A2 (en) | 2008-01-23 |
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