WO2006111451A1 - Process for contact printing of pattern of electroless deposition catalyst. - Google Patents
Process for contact printing of pattern of electroless deposition catalyst. Download PDFInfo
- Publication number
- WO2006111451A1 WO2006111451A1 PCT/EP2006/061055 EP2006061055W WO2006111451A1 WO 2006111451 A1 WO2006111451 A1 WO 2006111451A1 EP 2006061055 W EP2006061055 W EP 2006061055W WO 2006111451 A1 WO2006111451 A1 WO 2006111451A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- printing
- electroless deposition
- process according
- pattern
- phase
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N3/00—Preparing for use and conserving printing surfaces
- B41N3/08—Damping; Neutralising or similar differentiation treatments for lithographic printing formes; Gumming or finishing solutions, fountain solutions, correction or deletion fluids, or on-press development
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1689—After-treatment
- C23C18/1692—Heat-treatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
- C23C18/1831—Use of metal, e.g. activation, sensitisation with noble metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2053—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment only one step pretreatment
- C23C18/206—Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C23C18/44—Coating with noble metals using reducing agents
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/02—Letterpress printing, e.g. book printing
- B41M1/04—Flexographic printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/10—Intaglio printing ; Gravure printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0709—Catalytic ink or adhesive for electroless plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
Definitions
- the present invention relates to a process for the contact printing of patterns of electroless deposition catalyst via a hydrophilic phase.
- WO 01/88958 discloses in claim 1 a method of forming a pattern of a functional material on a substrate comprising: applying a first pattern of a first material to said substrate; and applying a second functional material to said substrate and said first material, wherein said first material, said second functional material, and said substrate interact to spontaneously form a second pattern of said second functional material on said substrate, to thereby form a pattern of a functional material on a substrate.
- WO 01/88958 further discloses in claim 27 a method of forming a pattern of a functional material on a substrate comprising: non- contact printing a first pattern of a first material on said substrate; and applying a second functional material to said substrate and said first material, wherein said first material, said second material, and said substrate interact to spontaneously form a second pattern of said second functional material on said substrate, to thereby form a pattern of a functional material on a substrate.
- WO 01/88958 also discloses in claim 47 a method of forming a pattern of a functional material on a substrate comprising: non- contact printing a first pattern of a first material on said substrate; and applying a second functional material to said substrate and said first material, wherein said first and second functional materials are selected to have a sufficient difference in at least one property of hydrophobicity and hydrophilicity relative to one another such that said first material, said second functional material, and said substrate interact to spontaneously form a second pattern of said second functional material on said substrate, to thereby form on said substrate a second pattern of said second functional material, wherein said second pattern is the inverse of said first pattern, to thereby form a pattern of a functional material on a substrate.
- WO 01/88958 also discloses in claim 57 a method of forming an 5 electrical circuit element, comprising: applying a first pattern of a first material on a substrate; and applying a second material to said substrate and said first material, wherein said first material, said second material, and said substrate interact to spontaneously form a second pattern of said second material on said substrate,
- WO 01/88958 also discloses in claim 110 an electrical circuit element comprising: a substrate; a first pattern of an insulating material applied to said substrate; and a second pattern of an electrically conducting material applied to said substrate and said
- WO 01/88958 also discloses in claim 123 an electronic device comprising: a) a first element comprising i) a first substrate; ii) a first pattern of an insulating material applied to said substrate and iii) a second pattern of an electrically conducting material
- a second circuit element comprising i) a second substrate; ii) a third pattern of an insulating material applied to said second substrate and iii) a fourth pattern of an electrically conducting material applied to said second substrate and said third material, wherein
- said insulating, electrically conducting material, and said second substrate interact to spontaneously form a fourth pattern of said electrically conducting material on said substrate when said electrically conducting material is applied to said substrate having said third pattern of said insulating material applied thereon;
- WO 01/88958 also discloses in claim 127 a Radio Frequency (RF) tag comprising a pattern of a non-conductive first material on a substrate and a coating of an electrically conductive second material disposed over said substrate and said first material, wherein said first material, said second material, and said substrate interact to spontaneously form a second pattern of said 5 second material on said substrate, to thereby form an Inductor- Capacitor (LC) resonator on said substrate.
- RF Radio Frequency
- WO 01/88958 also discloses in claim 141 a mechanical device comprising: a) a first component comprising: i) a first substrate; ii) a first pattern of first material to said first substrate and
- first and second components are oriented in a such a way that the second and fourth patterns oppose each other, and are selected from the group consisting of identical patterns, inverse patterns, and any mechanically useful combinations.
- Offset printing and gravure printing provide the highest quality prints with resolutions down to 10 ⁇ m.
- Line Patterning does not involve printing of the polymers and incorporates mostly standard office equipment, e.g. an office type laser printer. It is rapid and inexpensive.
- electronic components e.g. a liquid crystal and a push-button assembly were reported.
- Offset (lithographic) printing presses use a so-called printing master such as a printing plate which is mounted on a cylinder of the printing press.
- the master carries a lithographic image on its surface, which consists of oleophilic (or hydrophobic, i.e. ink-accepting, water-repelling) areas as well as hydrophilic (or oleophobic, i.e. water-accepting, ink-repelling) areas.
- a print is obtained by first applying a fountain medium (also called dampening liquid) and then the ink to lithographic image on the surface of the printing plate on a drum, both are then transferred to an intermediate (rubber) roll, known as the offset blanket, from which they are further transferred onto the final substrate.
- the fountain medium is first transferred via a series of rolls to the printing plate. It conventionally acts as a weak sacrificial layer and prevents ink from depositing on the non- image area of the plate and has the function of rebuilding the nonprinting (desensitized) areas of the printing plate during a press run.
- fountain media have historically contained isopropyl alcohol to reduce the surface tension and thereby to provide for more uniform dampening of the printing plate, but, by eliminating (or greatly reducing) the isopropyl alcohol as a fountain medium additive, printers are able to reduce VOC (volatile organic compound) emissions significantly.
- isopropyl alcohol is replaced with lower volatility glycols, glycol ethers, or surfactant formulations.
- Conventional fountain media may also contain anti-corrosion agents, pH-regulators and surfactants .
- EP-A 1 415 826 discloses a process for the offset printing of a receiving medium with a functional pattern comprising in any order the steps of: applying a printing ink to a printing plate and wetting said printing plate with an aqueous fountain medium containing a solution or a dispersion containing at least one moiety having at least colouring, pH-indicating, whitening, fluorescent, phosphorescent, X-ray phosphor or conductive properties.
- reverse lithography a water- or glycol-based hydrophilic colored ink is used in combination with an oleophilic fountain medium.
- the printing plate contains image areas which preferentially attract a hydrophilic liquid and non-image areas which are repellent to the hydrophilic liquids.
- Printing plates can be prepared by applying a pattern of a material with a good tolerance to aqueous (miscible) liquids such as a vinylacetate- ethylene copolymer resin, polyester resin or a composition containing shellac, polyethylene glycol and wax onto a hydrophobic base sheet, such as polystyrene or polyethylene coated Mylar.
- aqueous (miscible) liquids such as a vinylacetate- ethylene copolymer resin, polyester resin or a composition containing shellac, polyethylene glycol and wax onto a hydrophobic base sheet, such as polystyrene or polyethylene coated Mylar.
- the printing plate can be prepared by applying a hydrophilic liquid-repelling thermosetting siloxane composition as the non-image pattern on a zinc base material (US 3,356,030) .
- Additives like carbon black or zinc oxide may be added to the resin to increase the surface roughness, thereby improving the ink uptake.
- the hydrophilic inks can be dye- or pigment-based and contain a binder and water and/or ethylene glycol as the main vehicle.
- the (hydrophobic) fountain medium is based on hydrocarbons such as Textile Spirits or Super Naphtholite, mineral oils or silicon oils. Waterless or driographic offset printing was developed, for example by Toray Industries of Japan, to reduce the emission of VOCs from the fountain medium in conventional offset printing by dispensing with a fountain medium and only using an oleophilic ink.
- the non-image areas of a driographic printing plate are coated with an ink-repellant polymer, such as a silicone, while the image areas are ink-accepting surfaces for example a grained aluminium base plate, optionally overcoated with an additional coating layer.
- an ink-repellant polymer such as a silicone
- the image areas are ink-accepting surfaces for example a grained aluminium base plate, optionally overcoated with an additional coating layer.
- Reverse offset printing inks using a hydrocarbon or mineral oil as fountain medium are described, for example, in US 3,532,532, US 3,797,388, GB 1,343,784A and US 3,356,030. None of these patents disclose the addition of functional materials, other than dyes and/or pigments, to the hydrophilic ink or to the hydrophobic fountain medium.
- Water-based driographic offset inks are, for example, described in WO 99/27022A, WO 03/057789A and DE 4119348A. None of these patents discloses the addition to the hydrophilic ink of functional materials, other than dyes and/or pigments.
- Single fluid inks for offset printing are, for example, disclosed in US 4,981,517 and in WO 00/032705A, but neither discloses an ink containing functional materials in the hydrophilic (fountain) part of the ink emulsion.
- US 2005/0003101A discloses a method of preparing a substrate such that it is capable of sponsoring autocatalytic plating of metal patterns over a pre-determined area of its surface comprising the steps of: i) coating some or all of the substrate material by a pattern transfer mechanism with a first layer composed of a first layer material comprising a catalytic material; ii) coating the first layer by a pattern transfer mechanism with a second layer composed of a second layer material such that the second layer overlaps the first layer to form a seal, the second layer material being incapable of promoting and/or sustaining the desired catalytic reaction iii) using an energetic ablative scribing process to remove a pre-determined pattern of material from the second layer material in order to expose the first layer material .
- the catalytic material is applied via a pattern transfer mechanism, such as inkjet printing or screen printing, coating a second layer over the first layer to form a seal and using an energetic ablative scribing process to remove a pre-determined pattern of the second layer in order to expose the first layer.
- Metal is deposited on the first catalytic layer by electroless plating.
- the disadvantage of this process is that the described scribing processes, such as e-beam, focused UV beam, collimated X-ray beam or plasma beams are slow processes.
- DE 2757029A discloses a process for the manufacture of integrated circuits in which an ink enriched with palladium, copper or silver nuclei is printed on a substrate provided with an adhesion-providing layer, the conductive patterns thereby produced then being metallized chemically in a copper depositing bath to electrically conductive circuits. Neither the printing method nor 5 the ink compositions are further specified.
- WO 92/21790A discloses a method comprising printing a catalytic ink in a two-dimensional image on a moving web from a rotating gravure roll; wherein said catalytic ink comprises a solution of less than 10% by weight solids comprising polymer and a Group IB or
- W Group 8 metal compound, complex or colloid wherein said ink has a viscosity between 20 and 600 centipoises as measured with a Brookfield No. 1 spindle at 100 rpm and 25°C; and wherein said image is adaptable to electroless deposition of metal.
- This method has the disadvantage of the image not being directly usable for
- rotogravure printing suffers from the disadvantages of the high cost of a gravure roll compared to an offset printing plate.
- WO 93/04215A discloses an aqueous, catalyst emulsion adapted for forming crosslinked, polymeric coatings which can catalyze the
- US 6,521,285 discloses a method for electroless deposition of conductive material (8) on a substrate (5) , using a stamp (1) having a surface onto which an ink is applied, preconditioning said substrate (5) by providing a seed layer (6) having enhanced affinity
- US 5,300,140 discloses a hydroprimer for the deposition of firmly adhering metal coatings onto substrate surfaces by application of a thin layer of the hydroprimer to the substrate surface, if appropriate sensitisation and subsequent currentless wet-chemical metallisation, wherein the hydroprimer contains, as the essential constituents, a) a water-dispersible polymer selected from the group consisting of water-dispersible polyacrylates, polybutadienes, polyesters, melamine resins, polyurethanes, and polyurethane-ureas, b) as metallisation catalyst an ionic noble metal, a colloidal noble metal or both or a covalent or complex compound of a noble metal with organic ligands, c) a filler selected from the group consisting of organic and inorganic fillers, in an amount of 5 to 35% by weight, and d) water.
- a water-dispersible polymer selected from the group consisting of water-dispersible polyacrylates, polybutadienes, polyesters,
- US 5,300,140 discloses that the hydroprimer can be applied to the surfaces of the plastic by the customary methods, such as printing, stamping, dipping, brushing, knife-coating, painting on and rolling on and spraying.
- US 4,253,875 discloses a catalytic lacquer for the production of printed circuit boards using basic materials and metal deposition methods having a composition of: (a) a binding agent comprising water soluble or dispersable compounds selected from the group consisting of acrylic resins, phenolic resins, methyl and carboxymethyl cellulose, guar, gelatin, zeins and alginates; (b) water; (c) a metal salt selected from the group consisting of water soluble palladium, copper, silver, gold and nickel salts; (d) a complex former for said metal; and (e) a reducing agent.
- a reducing agent is essential to the invention disclosed in US 4,253,875, which indicates that the catalyst is not deposited as such, but is generated in a post-deposition step.
- Flexographic printing of a catalyst layer for the manufacturing of electromagnetic wave shield material is disclosed in JP patent 2002-223095A, but fails to disclose printing of a catalyst layer from a hydrophilic phase and suffers from the disadvantage of requiring relatively high viscosity inks, usually of the order of 200-600 mPa.s, for which binders are required.
- Other additives such as defoamers, waxes, surfactants, slip agents and plasticizers are often required to obtain the required printing properties.
- US 3,989,526 discloses a processing composition
- a processing composition comprising a reducing agent and an inert transition metal complex oxidizing agent which undergo redox reaction in a liquid medium in the presence of catalytic material which is a zero valent metal or chalcogen of a Group VIII or IB element, wherein said liquid is a solvent for said reducing agent and said inert transition metal ion complex
- said inert transition metal complex comprising (a) Lewis bases and (b) Lewis acids which are capable of existing in at least two valence 5 states and said oxidizing agent and said reducing agent being so chosen that (1) the reaction products thereof are noncatalytic for said oxidation-reduction reaction and (2) when test samples thereof are each dissolved in an inert solvent at a concentration of about 0.01 molar at 20 0 C, there is essentially no redox reaction between
- said oxidizing agent and said reducing agent, and said oxidizing agent being a complex of a metal ion with a liquid which, when a test sample thereof is dissolved at 0.1 molar concentration at 20 0 C in an inert solvent solution containing a 0.1 molar concentration of a tagged ligand of the same species which is uncoordinated, exhibits
- electroless deposition catalyst by either modifying a uniform coating by local application of an energy source be it with heat, light, X-rays, electrons, ions or some other energy source, by contactless printing techniques, such as ink-jet, electrostatic or electrophotographic techniques, by relatively low resolution contact
- an energy source be it with heat, light, X-rays, electrons, ions or some other energy source
- contactless printing techniques such as ink-jet, electrostatic or electrophotographic techniques
- 25 printing processes such as screen printing or relatively slow contact printing processes such as stamp printing.
- the avoidance of additives is preferred to prevent poisoning of the catalytic species and the resulting reduction in catalytic activity and to avoid embedding of the catalyst resulting in inaccessibility of the catalyst . 5
- aqueous medium means a medium containing water and water-miscible organic solvents containing between 50% by weight of water and 100% by weight of water.
- transparent layer as used in disclosing the present invention means permitting the passage of light in such a way that objects can be clearly seen through the layer.
- layer as used in disclosing the present invention, means a continuous coating unless qualified by the adjective "non- continuous” .
- pattern means a non-continuous coating, which may be an array, arrangement or configuration of lines and/or shapes, areas and/or regions.
- the term "functional” in the expression "functional patterns" as used in disclosing the present invention means having at least one function that is non-decorative, although functional materials as used in disclosing the present application may have a decorative function or utility in addition to a non-decorative function or utility. Examples of such functions are non-decorative colouring, pH-indicating, whitening, fluorescent, phosphorescent, X-ray phosphor, conductive properties and catalysis.
- the term functional pattern therefore includes patterns of catalytic species including electroless deposition catalysts.
- catalyst in the expression "electroless deposition catalyst” as used in disclosing the present invention means a substance which alters the rate of a chemical reaction or physical process without itself being consumed i.e. it can accelerate or decelerate a chemical reaction e.g. electroless deposition.
- catalyst does not include species which of themselves have no electroless deposition catalytic properties, although they may be precursors of a species which does perform the function of an electroless deposition catalyst. Autocatalysts are here included in the term catalyst.
- electroless deposition means deposition of conducting species, such as s metals, without using electrochemical techniques. Electroless deposition techniques usually involve a reaction between an oxidizing species and a reducing species.
- hydrophilic phase means a phase with substantially hydrophilic properties
- the hydrophilic phase mainly contains water and hydrophilic substances e.g. alcohols and cellulose derivatives, although small quantities of hydrophobic substances may be present.
- contact printing otherwise known as impact printing, as used in disclosing the present invention, is defined as a printing process of applying ink to a substrate utilizing physical
- the printing device contact between some part of the printing device and the substrate i.e. in which there is direct contact between the substrate to be printed and the delivery mechanism e.g. offset printing, flexographic printing, lithographic printing, letterpress printing, screen printing, gravure printing, rotogravure printing, intaglio
- the delivery mechanism e.g. offset printing, flexographic printing, lithographic printing, letterpress printing, screen printing, gravure printing, rotogravure printing, intaglio
- Contact printing is thereby distinguished from non- contact printing processes, otherwise known as non-impact printing processes, which is a printing processes in which an ink is applied to a substrate without utilizing physical contact between some part
- the printing device and the substrate e.g. inkjet printing, laser printing, electrographic printing, electrophoretic printing and electrophotographic printing using solid or liquid toners.
- coating nor spraying can be regarded as a printing process, since no printing is involved.
- printing ink means an ink or one phase of a single fluid ink.
- the ink can be either hydrophilic i.e. accepted by the hydrophilic areas of a printing plate, roll or stamp, as used, for example, in reverse offset inks, or oleophilic i.e. accepted by the oleophilic areas of
- a printing plate, roll or stamp as used, for example, in conventional offset inks. It may or may not contain at least one dye and/or pigment as colorant (s) .
- the term "dye”, as used in disclosing the present invention, means a coloring agent having a solubility of 10 mg/L or more in the medium in which it is applied and under the ambient conditions pertaining.
- the term "pigment”, as used in disclosing the present invention, is defined in DIN 55943, herein incorporated by reference, as an inorganic or organic, chromatic or achromatic coloring agent that is practically insoluble in the application medium under the pertaining ambient conditions, hence having a solubility of less than 10 mg/L therein.
- binder means a polymeric species, which may be naturally occurring material, a modified naturally occurring material or a synthetic material .
- coated paper as used in disclosing the present invention, means paper coated with any substance i.e. includes both clay-coated paper and resin-coated paper.
- PET as used in the present disclosure represents poly (ethylene terephthalate) .
- DTR diffusion transfer reversal
- ionomer means a polymer with covalent bonds between the elements of the chain, and ionic bonds between the chains e.g. metal salts of copolymers of ethylene and methacrylic acid commercialized by Du Pont under the tradename SURLYN®.
- the pattern of an electroless deposition catalyst is printed via a hydrophilic phase.
- the pattern of electroless deposition catalyst consists of continuous areas of electroless deposition catalyst.
- the contact printing process comprises the steps of: applying a pattern of an electroless deposition catalyst via a hydrophilic phase to an intermediate plate or roller and transferring the pattern of electroless deposition catalyst from the intermediate plate or roller to a receiving medium.
- the contact printing process comprises the steps of: applying a pattern of an electroless deposition catalyst via a hydrophilic phase to a printing plate master and transferring the pattern of electroless deposition catalyst from the printing plate master to a receiving medium.
- Preferred printing techniques include conventional offset printing with an aqueous fountain and an oleophilic ink, reverse offset printing using a hydrocarbon or mineral oil as fountain medium and a hydrophilic ink, offset printing using single fluid inks consisting of a fine emulsion of the ink in the fountain or of a fine emulsion of the fountain in the ink v and driography using water-based driographic inks .
- Offset printing has the advantage of printing smooth continuous areas at very high speeds with high resolution. Evaporation of solvent and/or water from the offset fluids is very low in the printing press compared to e.g. screen printing.
- the pattern of an electroless deposition catalyst is printed via a hydrophilic phase.
- Electroless deposition catalysts e.g. noble metal particles, such as silver particles, and colloidal heavy metal sulfide particles, such as colloidal palladium sulfide, nickel sulfide and mixed silver-nickel sulfide. These nuclei may be present with or without a binding agent .
- the electroless deposition catalyst is non- metallic e.g. palladium, silver, nickel, and cobalt sulphides.
- the electroless deposition catalyst is a heavy metal sulphide, e.g. palladium, silver, nickel, cobalt, copper, lead and mercury sulphides, or a mixed sulphide, e.g. silver-nickel sulphide.
- the electroless deposition catalyst is metallic e.g. silver, platinum, rhodium, iridium, gold, ruthenium, palladium and copper particles .
- the electroless deposition catalyst is capable of catalyzing silver deposition.
- the pattern of an electroless deposition catalyst is printed via a hydrophilic phase.
- the hydrophilic phase may also contain: water-soluble gums, a pH buffer system, desensitizing salts, acids or their salts, wetting agents, solvents, non-piling or lubricating additives, emulsion control agents, viscosity builders, biocides and defoamers.
- the hydrophilic phase only contains water and the electroless deposition catalyst.
- the hydrophilic phase further contains at least one water-miscible organic compound, such as aliphatic alcohols, ketones, arenes , esters, glycol ethers, cyclic ethers, such as tetrahydrofuran, and their mixtures, preferably an organic solvent.
- at least one water-miscible organic compound such as aliphatic alcohols, ketones, arenes , esters, glycol ethers, cyclic ethers, such as tetrahydrofuran, and their mixtures, preferably an organic solvent.
- less than 10% by weight of the dissolved and dispersed solids in the hydrophilic phase is binder.
- the hydrophilic phase is exclusive of a water-dispersible polymer.
- the hydrophilic phase is exclusive of a reducing agent.
- the hydrophilic phase is an aqueous fountain medium, such as used in conventional offset printing.
- the hydrophilic phase is a hydrophilic ink, such as used in reverse offset printing with an oleophilic fountain e.g. of a hydrocarbon or mineral oil, in which the electroless deposition catalyst may replace part or all of the dyes and/or pigments.
- the electroless deposition catalyst may replace part or all of the dyes and/or pigments.
- the hydrophilic phase is a hydrophilic ink in which the concentration of electroless deposition catalyst is
- R between 10 and 1 mol/L, preferably between 0.001 and 0.1 mol/L.
- the hydrophilic phase is the dispersing phase of a single fluid ink, such as used in offset printing.
- the hydrophilic phase in single fluid inks is mainly based on ethylene glycols. To prevent coagulation and maintain a high efficiency of the catalyst, it may be necessary to replace part of the ethylene glycols with water.
- the hydrophilic phase is the dispersing phase of a single fluid ink and the electroless deposition catalyst is present in a concentration of between 10 and 1 mol/L, preferably between 0.001 and 0.1 mol/L.
- the hydrophilic phase is the dispersed phase of a single fluid ink, such as used in offset printing.
- the hydrophilic phase is a water-based driographic ink, in which the electroless deposition catalyst may replace a part or all of the dyes and/or pigments.
- the electroless deposition catalyst may replace a part or all of the dyes and/or pigments.
- the hydrophilic phase is a water-based 5 driographic ink, which contains electroless deposition catalyst in a concentration of between 10 ⁇ 8 and 1 mol/L, preferably between 0.001 and 0.1 mol/L.
- the hydrophilic phase is W exclusive of an ionomer.
- the hydrophilic phase comprises other functional ingredients e.g. selected from the group consisting of fluorescent, phosphorescent, pH-indicating, coloring, whitening and 15 intrinsically conductive ingredients.
- the electroless deposition catalyst is incorporated into a hydrophilic phase, which has a viscosity at 25°C after stirring to constant viscosity of at least 20 30 mPa.s as measured according to DIN 53211 i.e. until successive measurements according to DIN 53211 are reproducible.
- the electroless deposition catalyst is incorporated in a hydrophilic phase, which has a viscosity at 25°C 25 after stirring to constant viscosity of at least 100 mPa.s as measured according to DIN 53211 i.e. until successive measurements according to DIN 53211 are reproducible.
- the electroless deposition catalyst is 30 incorporated into a hydrophilic phase, which has a viscosity at 25°C after stirring to constant viscosity of at least 200 mPa.s as measured according to DIN 53211 i.e. until successive measurements according to DIN 53211 are reproducible.
- the electroless deposition catalyst is incorporated into a hydrophilic phase, which has a pH between 1.5 and 5.5.
- the electroless deposition catalyst is incorporated into an aqueous fountain medium. According to a twenty-ninth embodiment of the process, according to the present invention, the electroless deposition catalyst is
- the electroless deposition catalyst is incorporated into an aqueous fountain medium, which further comprises an anti-foaming agent.
- Suitable anti-foaming agents include the silicone antifoam agent X50860A from Shin-Etsu.
- the electroless deposition catalyst is incorporated into an aqueous fountain medium, which further contains a water-soluble gum, such as gum arabic, larch gum, CMC, PVP, and acrylics .
- a water-soluble gum such as gum arabic, larch gum, CMC, PVP, and acrylics .
- the hydrophilic phase further contains at least one water-miscible organic compound, such as aliphatic alcohols, ketones, arenes, esters, glycol ethers, cyclic ethers, such as tetrahydrofuran, and their mixtures.
- water-miscible organic compound such as aliphatic alcohols, ketones, arenes, esters, glycol ethers, cyclic ethers, such as tetrahydrofuran, and their mixtures.
- the pattern of an electroless deposition catalyst is printed via a hydrophilic phase.
- an oleophilic phase is involved in the contact printing process.
- an oleophilic phase is involved in the contact printing process and the oleophilic phase is an oleophilic fountain.
- an oleophilic phase is involved in the contact printing process and the oleophilic phase is the dispersed phase of a single fluid ink.
- an oleophilic phase is involved in the contact printing process and the oleophilic phase is the continuous phase of a single fluid ink.
- an oleophilic phase is involved in the contact printing process and the oleophilic phase is an oleophilic ink.
- the pattern of an electroless deposition catalyst is printed via a hydrophilic phase and an oleophilic phase may be involved in the contact printing process .
- the hydrophilic phase contains at least one colorant, which may be a pigment or dye.
- the colorant in the hydrophilic phase is a dye .
- an oleophilic phase is involved in the contact printing process and the oleophilic phase contains a colorant, which may be a pigment or a dye.
- an oleophilic phase is involved in the contact printing process and the oleophilic phase contains a dye.
- the colorant may be selected from the group consisting of pigments and dyes, may either be present in the hydrophilic phase or in an oleophilic phase e.g. the dispersed phase in a single fluid ink, an oleophilic fountain in the case of reverse offset printing or the oleophilic "ink” in the case of conventional offset printing.
- Transparent coloured compositions can be realized by incorporating pigments e.g. azo pigments e.g. DALMAR® Azo Yellow and LEVANYL® Yellow HRLF, dioxazine pigments e.g. LEVANYL® Violet BNZ, phthalocyanine blue pigments, phthalocyanine green pigments, Molybdate Orange pigments, Chrome Yellow pigments, Quinacridone pigments, Barium precipitated Permanent Red 2B, manganese precipitated BON Red, Rhodamine B pigments and Rhodamine Y pigments.
- Suitable dyes include:
- the hydrophilic and/or oleophilic phase contains a dye and/or a pigment such that the colour tone of the ink and the background cannot be distinguished by the human eye e.g. by colour matching or colour masking by for example matching the CIELAB a*, b* and L* values as defined in ASTM Norm E179-90 in a R (45/0) geometry with evaluation according to ASTM Norm E308-90.
- the aqueous fountain medium further contains at least one surfactant i.e. at least one surfactant selected from the group consisting of cationic, anionic, amphoteric and non-ionic surfactants.
- the aqueous fountain medium further contains at least one non-ionic surfactant e.g. ethoxylated/fluoro- alkyl surfactants, polyethoxylated silicone surfactants, polysiloxane/polyether surfactants, ammonium salts of perfluoro- alkylcarboxylic acids, polyethoxylated surfactants and fluorine- containing surfactants .
- non-ionic surfactant e.g. ethoxylated/fluoro- alkyl surfactants, polyethoxylated silicone surfactants, polysiloxane/polyether surfactants, ammonium salts of perfluoro- alkylcarboxylic acids, polyethoxylated surfactants and fluorine- containing surfactants .
- Suitable non-ionic surfactants include:
- NONOl SURFYNOL® 440 an acetylene compound with two polyethylene oxide chains having 40wt% of polyethylene oxide groups from Air Products
- NON02 SYNPERONIC®13 /6.55 a tridecylpolyethylene-glycol NON03 ZONYL® FSO-100: a mixture of ethoxylated fluorosurfactants
- NON04 ARKOPALTM N060 a nonylphenylpolyethylene-glycol from HOECHST NON05 FLUORAD® FC129: a fluoroaliphatic polymeric ester from 3M NON06 PLURONIC® L35 a polyethylene-glycol /propylene-glycol NON07 TEGOGLIDECS ) 410: a polysiloxane-polymer copolymer surfactant, from Goldschmidt; NON08 TEGOWET®: a polysiloxane-polyester copolymer surfactant, from Goldschmidt; NON09 FLUORAD® FC126: a mixture of ammonium salts of perfluorocarboxylic acids, from 3M;
- NONlO FLUORAD® FC430 a 98.5% active fluoroaliphatic ester from 3M
- NONIl FLUORAD® FC431 CF 3 (CF 2 ) 7 SO 2 (C 2 H 5 )N-CH 2 CO-(OCH 2 CH 2 ) n OH from 3M
- NON13 ZONYL® FSN a 40% by weight solution of
- NON15 ZONYL® FS300 a 40% by weight aqueous solution of a fluorinated surfactant, from DuPont;
- the aqueous fountain medium further contains at least one anionic surfactant.
- anionic surfactants include:
- ANOl HOSTAPON® T a 95% concentrate of purified sodium salt of N- methyl-N-2-sulfoethyl-oleylamide, from HOECHST ANO2 LOMAR® D
- ANO3 AEROSOL® OT an aqueous solution of 10g/L of the sodium salt of the di-2-ethylhexyl ester of sulphosuccinic acid from American Cyanamid
- ANO4 DOWFAX 2Al a 45% by weight aqueous solution of a mixture of the sodium salt of bis (p-dodecyl, sulpho-phenyl)-ether and the sodium salt of (p-dodecyl, sulpho-phenyI)- (sulphophenyl)ether from Dow Corning
- ANO5 SPREMI tetraethylammonium perfluoro-octylsulphonate ANO6 TERGO sodium 1-isobutyl , 4-ethyl-n-octylsulphate AN07 ZONYL® 7950 a fluorinated surfactant, from DuPont; ANO8 ZONYL® FSA a 25% by weight solution of
- AN13 ZONYL® TBS 33% by weight solution of F (CF 2 CF 2 ) 3 _ 8 CH 2 CH 2 SO 3 H in a
- the aqueous fountain medium further contains at least one amphoteric surfactant.
- Suitable amphoteric surfactants include:
- AMPOl AMBITERIC® H a 20% by weight solution of hexadecyldimethyl- ammonium acetic acid in ethanol
- the receiving medium is any receiving medium suitable for printing, which may be flexible or rigid.
- Flexible media include but are not limited to paper, carton, cardboard, coated paper, a metallic foil or a plastic sheet or a composite of any of these materials.
- Rigid media include but are not limited to glass, ceramics, epoxy resins or plastics or a composite of any of these materials.
- the receiving medium is paper, coated paper, a metallic foil or a plastic sheet.
- the receiving medium may be translucent, transparent or opaque.
- Suitable plastic sheets include a polymer laminate, a thermoplastic polymer foil or a duroplastic polymer foil e.g. made of a cellulose ester, cellulose triacetate, cellulose butyrate, cellulose nitrate, polypropylene, polycarbonate or polyester, with poly (ethylene terephthalate) or poly (ethylene naphthalene-1, 4-dicarboxylate) being particularly preferred.
- Coated papers include laminates of paper, cardboard or carton with one or more layers of a polymeric material such as polyethylene or polypropylene.
- the receiving medium is coated with additional layers, such as a subbing layer or receiver layer to render the substrate additionally adherent and receptive.
- additional layers such as a subbing layer or receiver layer to render the substrate additionally adherent and receptive.
- subbing materials which are well known in e.g. the photographic arts can be used.
- Typical of such subbing materials are gelatin, vinyl polymers such as polyvinyl alcohol and numerous polymeric materials, as well as other chemical compounds and compositions.
- the electroless deposition catalyst can serve as nuclei for electroless plating.
- electroless plating is well known to those skilled in the art and is for example used in PCB manufacturing.
- Different metals such as nickel, silver, copper, gold, gold alloys, platinum, ruthenium, rhodium, cobalt and cobalt alloys ["Electroless Plating - Fundamentals and Applications", edited by Glenn 0. Mallory and June B. Hajdu, William Andrew Publishing/Noyes (1990)] can be plated electrolessly .
- the process further comprises the step of electroless deposition on the pattern of electroless deposition catalyst .
- multiple layers of electroless deposition catalyst are printed sequentially to fabricate devices.
- Each layer can have a different pattern and can be followed by a necessary process step, e.g. developing or plating, before the next printing step is carried out.
- DTR Diffusion transfer reversal
- the process further comprises the step of electroless deposition on the pattern of electroless deposition catalyst by a diffusion transfer reversal process in which a pattern of development nuclei is physically developed via a silver salt.
- the three steps of printing development nuclei, a DTR process to convert the nuclei pattern to a conductive pattern and printing an insulating layer can be repeated several times to create multilayered printed circuit boards.
- the printing of development nuclei and subsequent DTR to produce a conductive pattern can be followed by the printing of enzymes for building in this way a (bio) sensor.
- the process further comprises the step of electroless deposition on the pattern of electroless deposition catalyst by a diffusion transfer reversal process comprising developing the electroless deposition catalyst with an unexposed silver halide containing layer (transfer emulsion layer) on a substrate, the amount of silver halide in the transfer emulsion layer being preferably between 0.1 and 10 g/m AgNO 3 and particularly
- the process further comprises the steps of electroless deposition on the pattern of electroless deposition catalyst by a diffusion transfer reversal process; and removal of the colored ink pattern which does not contain electroless deposition catalyst from the substrate, e.g. when the transfer emulsion layer is separated from the substrate after the DTR process. This will occur when the oleophilic colored ink in a conventional offset printing process has a low affinity towards the substrate, compared to the affinity towards the transfer emulsion layer.
- the advantage of the removal of the ink pattern is that a second pattern of electroless deposition catalyst can be printed via the fountain medium, without the risk of poor transfer of the fountain medium from the offset blanket to the oleophilic ink-covered substrate regions.
- a first pattern of electroless deposition catalyst is (partially) overcoated with an oleophilic colored ink in a second print step
- the electroless deposition catalyst will be less or no longer available to interact with chemicals with which the printed substrate is brought in contact. Removal of the oleophilic colored ink of the second print step via DTR would uncover the underlying layer of electroless deposition catalyst again, regaining its functionality.
- the process according to the present invention can, for example, be used to produce conductive patterns for a multiplicity of applications including electroplating with metallic layers, sensors, the production of electrical circuitry for single and limited use items such as toys, in capacitive antennae as part of radiofrequency tags, in electroluminescent devices which can be used in lamps, 5 displays, back-lights e.g. LCD, automobile dashboard and keyswitch backlighting, emergency lighting, cellular phones, personal digital assistants, home electronics, indicator lamps and other applications in which light emission is required.
- back-lights e.g. LCD, automobile dashboard and keyswitch backlighting
- emergency lighting cellular phones
- personal digital assistants personal digital assistants
- home electronics indicator lamps and other applications in which light emission is required.
- the coating solution for the adhesion promoting layer No. 01 has the following composition and was coated at 130 in 2 /!:
- Kieselsol TM IOOF a colloidal silica from BAYER 16.7 g
- the coating solution for the subbing layer No . 02 has the following composition and was coated at 30 m 2 /!:
- Kieselsol TM 100F-30 a colloidal silica from BAYER 10.08 g
- Trimethylolpropane 0.33 g Copolymer of 74% maleic acid, 25% styrene and 1% 0.03 g methylmethacrylate
- the coating solution for the gelatin layer No. 03 has the following composition:
- PE-coated paper No. 04 is a photographic paper from F. Schoeller, consisting of paper (166 g/m ) with a TiC> 2 -containing PE layer (28 g/m 2 ) , overcoated with a gelatin layer (0.25 g/m ) .
- the backside is a layer of 47% LDPE and 53% HDPE (24 g/m 2 ) .
- the silver areas on receiving medium 2 with "fountain medium A” showed a resistance of 1500 ⁇ /square.
- the silver areas on the other samples showed no conductivity.
- Neoganth 406 from Atotech
- electroless plating in a copper bath (Printoganth PV from Atotech) for 30 minutes. Copper was only deposited on the silver pattern, resulting in a change from a gray to a copper-colored pattern.
- Development nuclei were printed via the "fountain medium A" on 30 receiving medium 2 and then developed via the diffusion transfer reversal process described in example 1.
- the resistance was 1500 ⁇ /square.
- the receiving medium was then developed for a second time via the diffusion transfer reversal process, using the same conditions as described before, resulting in a resistance of 100 35 ⁇ /square. Since the transfer emulsion layer did not have to be photoexposed, problems of misalignment of the transfer emulsion layer to the already patterned receiving medium did not occur.
- the physical development nuclei were prepared, as described in the EXAMPLE in EP-A 0 769 723, by a double jet precipitation in which solution Al of (NH 4 J 2 PdCl 4 and solution Bl of sodium sulphide were added at a constant rate during 4 minutes to solution Cl containing sodium sulphide while stirring at 400 rpm. Subsequent to precipitation, the precipitated nuclei obtained were dialysed to a conductivity of 0.5 mS . A 250 g sample of this dispersion was concentrated by evaporation to 50 g and 5 g isopropanol was added. This was "fountain medium C".
- Printing was performed as described in Example 1 on receiving medium 5, with both "fountain medium A” and “fountain medium C”.
- “Fountain medium C” was prepared as described for Example 3. Printing was performed, as described in Example 1, on receiving medium 5, separately with both “fountain medium A” and “fountain medium C” . After DTR development was performed as described in Example 1, a silver grey pattern was formed in the non-inked areas with receiving medium 5 printed with both "fountain medium A” and “fountain medium C”. With “fountain medium A”, the silver areas showed no 5 conductivity, whereas the surface resistance realized with "fountain medium C” was 170 ⁇ /square . Hence an increase in the development nuclei concentration in the fountain medium improved the amount of deposited silver and thus the conductivity. The conductivity could be increased even further by a second DTR process, resulting in a W resistance of 30 ⁇ /square.
- the surface resistance of the layer obtained by DTR-processing of the development nuclei on receiving medium 2 could be reduced by a factor of 7.6 upon sintering together the silver particles formed in the DTR process by heating with an energy of 1250 mJ/cm 2 using a IR diode laser (wavelength 830 nm) beam.
- the silver particles formed in the DTR process sintered together, thereby reducing the surface resistance from 13 ⁇ /square to 1.7 ⁇ /square.
- a silver layer, obtained by DTR-processing of the development nuclei on receiving medium 2 was exposed to a photoflash lamp, having a setting of 40.
- the silver particles formed in the DTR process sintered together, thereby reducing the surface resistance from 13 ⁇ /square to 4 20 ⁇ /square.
- Development nuclei were printed via the "fountain medium C" on receiving media 4 and 5 as described in Examples 3 and 4. After performing DTR development as described in Example 1, silver grey patterns were formed in the non-inked areas. The silver patterns 30 were dipped in a 0.5% solution of palladium chloride (pH adjusted to 1.5 with hydrochloric acid) for 0.5 seconds, then thoroughly rinsed with water and finally placed in an electroless copper plating solution with the composition given in Table 2 below.
- palladium chloride pH adjusted to 1.5 with hydrochloric acid
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06725324A EP1877263A1 (en) | 2005-04-20 | 2006-03-27 | Process for contact printing of pattern of electroless deposition catalyst |
JP2008507039A JP2008538335A (en) | 2005-04-20 | 2006-03-27 | Electroless deposition catalyst pattern contact printing method |
IL186691A IL186691A0 (en) | 2005-04-20 | 2007-10-16 | Process for contact printing of pattern of electroless deposition catalyst |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05103157.3 | 2005-04-20 | ||
US11/112,013 US20060236884A1 (en) | 2005-04-20 | 2005-04-20 | Process for contact printing of patterns of electroless deposition catalyst |
EP05103157 | 2005-04-20 | ||
US11/112,013 | 2005-04-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006111451A1 true WO2006111451A1 (en) | 2006-10-26 |
Family
ID=36709989
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2006/061055 WO2006111451A1 (en) | 2005-04-20 | 2006-03-27 | Process for contact printing of pattern of electroless deposition catalyst. |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1877263A1 (en) |
JP (1) | JP2008538335A (en) |
KR (1) | KR20080011206A (en) |
IL (1) | IL186691A0 (en) |
WO (1) | WO2006111451A1 (en) |
Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3356030A (en) | 1964-04-30 | 1967-12-05 | Interchem Corp | Planographic printing method |
US3532532A (en) | 1968-02-14 | 1970-10-06 | Bell & Howell Co | Reverse lithographic printing process |
GB1343784A (en) | 1970-01-15 | 1974-01-16 | Olivetti & Co Spa | Reverse lithographic printing method |
US3797388A (en) | 1971-12-07 | 1974-03-19 | Olivetti & Co Spa | Apparatus for printing by reverse lithography |
US4253875A (en) * | 1976-08-04 | 1981-03-03 | Schering Aktiengesellschaft | Catalytic lacquer for producing printing circuits |
US4981517A (en) | 1989-06-12 | 1991-01-01 | Desanto Jr Ronald F | Printing ink emulsion |
WO1992021790A1 (en) * | 1991-06-07 | 1992-12-10 | Monsanto Company | Fabricating metal articles from printed images |
WO1993004215A1 (en) * | 1991-08-15 | 1993-03-04 | Monsanto Company | Catalytic emulsions for electroless deposition |
US5300140A (en) * | 1991-03-09 | 1994-04-05 | Bayer Aktiengesellschaft | Hydroprimer for metallising substrate surfaces |
WO1999027022A1 (en) | 1997-11-26 | 1999-06-03 | Sun Chemical Corporation | Water-based offset lithographic newspaper printing ink |
WO2001088958A2 (en) | 2000-05-15 | 2001-11-22 | The Trustees Of The University Of Pennsylvania | Spontaneous pattern formation of functional materials |
US6521285B1 (en) * | 1999-06-18 | 2003-02-18 | International Business Machines Corporation | Method for printing a catalyst on substrates for electroless deposition |
EP1415826A2 (en) | 2002-10-31 | 2004-05-06 | Agfa-Gevaert | Process for the offset printing of patterns via the fountain medium |
-
2006
- 2006-03-27 KR KR1020077026900A patent/KR20080011206A/en not_active Application Discontinuation
- 2006-03-27 WO PCT/EP2006/061055 patent/WO2006111451A1/en active Application Filing
- 2006-03-27 JP JP2008507039A patent/JP2008538335A/en active Pending
- 2006-03-27 EP EP06725324A patent/EP1877263A1/en not_active Withdrawn
-
2007
- 2007-10-16 IL IL186691A patent/IL186691A0/en unknown
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3356030A (en) | 1964-04-30 | 1967-12-05 | Interchem Corp | Planographic printing method |
US3532532A (en) | 1968-02-14 | 1970-10-06 | Bell & Howell Co | Reverse lithographic printing process |
GB1343784A (en) | 1970-01-15 | 1974-01-16 | Olivetti & Co Spa | Reverse lithographic printing method |
US3797388A (en) | 1971-12-07 | 1974-03-19 | Olivetti & Co Spa | Apparatus for printing by reverse lithography |
US4253875A (en) * | 1976-08-04 | 1981-03-03 | Schering Aktiengesellschaft | Catalytic lacquer for producing printing circuits |
US4981517A (en) | 1989-06-12 | 1991-01-01 | Desanto Jr Ronald F | Printing ink emulsion |
US5300140A (en) * | 1991-03-09 | 1994-04-05 | Bayer Aktiengesellschaft | Hydroprimer for metallising substrate surfaces |
WO1992021790A1 (en) * | 1991-06-07 | 1992-12-10 | Monsanto Company | Fabricating metal articles from printed images |
WO1993004215A1 (en) * | 1991-08-15 | 1993-03-04 | Monsanto Company | Catalytic emulsions for electroless deposition |
WO1999027022A1 (en) | 1997-11-26 | 1999-06-03 | Sun Chemical Corporation | Water-based offset lithographic newspaper printing ink |
US6521285B1 (en) * | 1999-06-18 | 2003-02-18 | International Business Machines Corporation | Method for printing a catalyst on substrates for electroless deposition |
WO2001088958A2 (en) | 2000-05-15 | 2001-11-22 | The Trustees Of The University Of Pennsylvania | Spontaneous pattern formation of functional materials |
EP1415826A2 (en) | 2002-10-31 | 2004-05-06 | Agfa-Gevaert | Process for the offset printing of patterns via the fountain medium |
Also Published As
Publication number | Publication date |
---|---|
IL186691A0 (en) | 2008-02-09 |
KR20080011206A (en) | 2008-01-31 |
EP1877263A1 (en) | 2008-01-16 |
JP2008538335A (en) | 2008-10-23 |
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