WO2006104803A3 - Novel photosensitive resin compositions - Google Patents
Novel photosensitive resin compositions Download PDFInfo
- Publication number
- WO2006104803A3 WO2006104803A3 PCT/US2006/010394 US2006010394W WO2006104803A3 WO 2006104803 A3 WO2006104803 A3 WO 2006104803A3 US 2006010394 W US2006010394 W US 2006010394W WO 2006104803 A3 WO2006104803 A3 WO 2006104803A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- composition
- compound
- present
- photosensitive resin
- substrate
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/085—Photosensitive compositions characterised by adhesion-promoting non-macromolecular additives
Abstract
A photosensitive resin composition comprising: (a) at least one polybenzoxazole precursor polymer; (b) at least one compound having Structure Vl wherein, V is CH or N, Y is O or NR3 wherein R3 is H, CH3 or C2H5, R1 and R2 each independently are H, C1 - C4 alkyl group, C1 - C4 alkoxy group, cyclopentyl or cyclohexyl, or alternatively, R1 and R2 can be fused to produce a substituted or unsubstituted benzene ring; and (c) at least one solvent; wherein the amount of the compound of Structure VI present in the composition is effective to inhibit residue from forming when the composition is coated on a substrate and the coated substrate is subsequently processed to form an image on the substrate, and with the proviso that if the polybenzoxazole precursor polymer solely consists of polybenzoxazole precursor polymers that do not contain a photoactive moiety in the polymer, then (d) at least one photoactive compound is also present in the composition.. The present invention also concerns a process for forming a relief pattern and electronic parts using the composition.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008503127A JP2008535003A (en) | 2005-03-25 | 2006-03-22 | Novel photosensitive resin composition |
EP06739266A EP1861749A4 (en) | 2005-03-25 | 2006-03-22 | Novel photosensitive resin compositions |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US66554605P | 2005-03-25 | 2005-03-25 | |
US60/665,546 | 2005-03-25 | ||
US68934705P | 2005-06-10 | 2005-06-10 | |
US60/689,347 | 2005-06-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006104803A2 WO2006104803A2 (en) | 2006-10-05 |
WO2006104803A3 true WO2006104803A3 (en) | 2008-01-10 |
Family
ID=37053909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2006/010394 WO2006104803A2 (en) | 2005-03-25 | 2006-03-22 | Novel photosensitive resin compositions |
Country Status (6)
Country | Link |
---|---|
US (1) | US7407731B2 (en) |
EP (1) | EP1861749A4 (en) |
JP (1) | JP2008535003A (en) |
KR (1) | KR20070118584A (en) |
TW (1) | TW200640998A (en) |
WO (1) | WO2006104803A2 (en) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4925732B2 (en) * | 2005-06-07 | 2012-05-09 | 旭化成イーマテリアルズ株式会社 | Positive photosensitive resin composition |
WO2008020573A1 (en) * | 2006-08-15 | 2008-02-21 | Asahi Kasei Emd Corporation | Positive photosensitive resin composition |
CN101606103A (en) * | 2007-02-09 | 2009-12-16 | 索尼化学&信息部件株式会社 | Photosensitive polyimide resin composition |
JP5205772B2 (en) * | 2007-03-01 | 2013-06-05 | 住友ベークライト株式会社 | Positive photosensitive resin composition, cured film, protective film, insulating film, and semiconductor device and display device using the same |
DE602008003423D1 (en) * | 2007-03-23 | 2010-12-23 | Council Scient Ind Res | NEW DIAZO NAPHTHOCHINONE SULFURIC ACID BISPHENOL DERIVATIVE FOR PHOTOLITHOGRAPHIC SUBMICRON STRUCTURING AND MANUFACTURING METHOD THEREFOR |
US9519216B2 (en) * | 2008-02-04 | 2016-12-13 | Fujifilm Electronic Materials U.S.A., Inc. | Positive photosensitive resin compositions |
KR100932765B1 (en) * | 2008-02-28 | 2009-12-21 | 한양대학교 산학협력단 | Polyimide-polybenzoxazole copolymer, preparation method thereof, and gas separation membrane comprising the same |
CA2640517A1 (en) * | 2008-05-19 | 2009-11-19 | Industry-University Cooperation Foundation, Hanyang University | Polyamic acids dope composition, preparation method of hollow fiber using the same and hollow fiber prepared therefrom |
US8013103B2 (en) * | 2008-10-10 | 2011-09-06 | Industry-University Cooperation Foundation, Hanyang University | Polymer compounds and a preparation method thereof |
US8487064B2 (en) | 2008-10-10 | 2013-07-16 | Industry-University Cooperation Foundation, Hanyang University | Polymer compounds and a preparation method thereof |
US8231785B2 (en) * | 2009-05-12 | 2012-07-31 | Uop Llc | Staged membrane system for gas, vapor, and liquid separations |
JP5562585B2 (en) * | 2009-07-06 | 2014-07-30 | 旭化成イーマテリアルズ株式会社 | Photosensitive resin composition |
CN102317862B (en) * | 2009-08-28 | 2013-08-14 | 株式会社Lg化学 | Photosensitive resin composition which is curable at a low temperature, and dry film produced using same |
KR20110023354A (en) * | 2009-08-31 | 2011-03-08 | 금호석유화학 주식회사 | Positive typed photosensitive composition |
KR101200140B1 (en) * | 2009-08-31 | 2012-11-12 | 금호석유화학 주식회사 | Positive typed photosensitive composition |
JP2011053458A (en) * | 2009-09-02 | 2011-03-17 | Hitachi Chemical Dupont Microsystems Ltd | Photosensitive resin composition, method of manufacturing pattern-cured film using the same, and electronic component |
KR101333698B1 (en) | 2009-11-10 | 2013-11-27 | 제일모직주식회사 | Positive photosensitive resin composition |
KR101186675B1 (en) * | 2010-01-22 | 2012-09-27 | 금호석유화학 주식회사 | Positive typed photosensitive composition |
CN102985880A (en) * | 2010-07-09 | 2013-03-20 | 住友电木株式会社 | Method for forming cured film |
KR20120066923A (en) | 2010-12-15 | 2012-06-25 | 제일모직주식회사 | Novel phenol compounds and positive photosensitive resin composition including the same |
KR101423539B1 (en) | 2010-12-20 | 2014-07-25 | 삼성전자 주식회사 | Positive type photosensitive resin composition |
JP5920345B2 (en) * | 2011-06-15 | 2016-05-18 | 日立化成デュポンマイクロシステムズ株式会社 | Photosensitive resin composition, method for producing patterned cured film using the resin composition, and electronic component |
JP2014084347A (en) * | 2012-10-22 | 2014-05-12 | Sumitomo Bakelite Co Ltd | Polyamide resin, positive type photosensitive resin composition, cured film, protection film, insulating film, semiconductor device, and display device |
US8841062B2 (en) * | 2012-12-04 | 2014-09-23 | Az Electronic Materials (Luxembourg) S.A.R.L. | Positive working photosensitive material |
JP6225445B2 (en) * | 2013-03-26 | 2017-11-08 | 東レ株式会社 | Photoresist for dry etching, relief pattern using the same, and method for manufacturing light emitting device |
KR102028483B1 (en) * | 2013-09-17 | 2019-10-07 | 동우 화인켐 주식회사 | A colored photosensitive resin composition, color filter and liquid crystal display device having the same |
JP6364788B2 (en) * | 2014-01-29 | 2018-08-01 | 日立化成デュポンマイクロシステムズ株式会社 | Photosensitive resin composition and method for producing patterned cured film using the same |
US9754805B1 (en) | 2016-02-25 | 2017-09-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Packaging method and structure |
JP6782298B2 (en) * | 2016-08-31 | 2020-11-11 | 富士フイルム株式会社 | Resin composition and its applications |
JP2017125210A (en) * | 2017-04-05 | 2017-07-20 | 住友ベークライト株式会社 | Polyamide resin, positive photosensitive resin composition, cured film, protective film, insulation film, semiconductor device and display device |
JP7094150B2 (en) * | 2018-05-31 | 2022-07-01 | 太陽ホールディングス株式会社 | Photosensitive resin compositions, dry films, cured products, and electronic components |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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US3645772A (en) * | 1970-06-30 | 1972-02-29 | Du Pont | Process for improving bonding of a photoresist to copper |
US3873316A (en) * | 1970-06-11 | 1975-03-25 | Kalle Ag | Process for the production of a light-sensitive copying material having a copper-containing support, and copying material so produced |
JPH09316326A (en) * | 1996-05-31 | 1997-12-09 | Toyobo Co Ltd | Polybenzazole composition and fiber |
US6001517A (en) * | 1996-10-31 | 1999-12-14 | Kabushiki Kaisha Toshiba | Positive photosensitive polymer composition, method of forming a pattern and electronic parts |
US6159654A (en) * | 1996-03-04 | 2000-12-12 | Kabushiki Kaisha Toshiba | Negative photosensitive polymer composition of a thermosetting polymer precursor curable by cyclodehydration upon heating |
US6183934B1 (en) * | 1997-07-01 | 2001-02-06 | Kabushiki Kaisha Toshiba | Negative photosensitive resin composition, method of forming a pattern and electronic parts |
JP2004264537A (en) * | 2003-02-28 | 2004-09-24 | Hitachi Chemical Dupont Microsystems Ltd | Heat-resistant photosensitive resin composition, method for manufacturing pattern using the composition, and electronic parts |
WO2005101125A1 (en) * | 2004-03-31 | 2005-10-27 | Hitachi Chemical Dupont Microsystems Ltd. | Heat-resistant photosensitive resin composition, process for producing pattern from the composition, and electronic part |
Family Cites Families (11)
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TW263534B (en) * | 1993-08-11 | 1995-11-21 | Makkusu Kk | |
JP3748086B2 (en) | 1996-06-05 | 2006-02-22 | 日立化成工業株式会社 | Photosensitive material, relief pattern manufacturing method and polyimide pattern manufacturing method |
DE60032943T2 (en) * | 1999-11-10 | 2007-10-25 | Pi R & D Co. Ltd., Yokohama | IMID-BENZOXAZOLPOLYKONDENSAT AND METHOD FOR THE PRODUCTION |
JP2003295436A (en) * | 2002-04-04 | 2003-10-15 | Hitachi Chemical Dupont Microsystems Ltd | Alkali negative developable photosensitive resin composition |
JP4337389B2 (en) * | 2002-04-26 | 2009-09-30 | 東レ株式会社 | Method for producing heat-resistant resin precursor composition |
US7282323B2 (en) * | 2002-07-11 | 2007-10-16 | Asahi Kasei Emd Corporation | Highly heat-resistant, negative-type photosensitive resin composition |
JP4317875B2 (en) * | 2003-03-11 | 2009-08-19 | フジフィルム・エレクトロニック・マテリアルズ・ユーエスエイ・インコーポレイテッド | Novel photosensitive resin composition |
WO2005000912A2 (en) * | 2003-06-05 | 2005-01-06 | Fujifilm Electronic Materials U.S.A., Inc. | Novel positive photosensitive resin compositions |
JP4543923B2 (en) * | 2004-12-28 | 2010-09-15 | 住友ベークライト株式会社 | Positive photosensitive resin composition and semiconductor device and display element using the same |
EP1861750A4 (en) * | 2005-03-25 | 2010-10-06 | Fujifilm Electronic Materials | Pretreatment compositions |
US7220520B2 (en) * | 2005-06-03 | 2007-05-22 | Fujifilm Electronic Materials U.S.A., Inc. | Photosensitive resin compositions |
-
2006
- 2006-03-22 JP JP2008503127A patent/JP2008535003A/en not_active Ceased
- 2006-03-22 EP EP06739266A patent/EP1861749A4/en not_active Withdrawn
- 2006-03-22 KR KR1020077012597A patent/KR20070118584A/en not_active Application Discontinuation
- 2006-03-22 US US11/386,471 patent/US7407731B2/en not_active Expired - Fee Related
- 2006-03-22 WO PCT/US2006/010394 patent/WO2006104803A2/en active Application Filing
- 2006-03-24 TW TW095110320A patent/TW200640998A/en unknown
Patent Citations (8)
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US3873316A (en) * | 1970-06-11 | 1975-03-25 | Kalle Ag | Process for the production of a light-sensitive copying material having a copper-containing support, and copying material so produced |
US3645772A (en) * | 1970-06-30 | 1972-02-29 | Du Pont | Process for improving bonding of a photoresist to copper |
US6159654A (en) * | 1996-03-04 | 2000-12-12 | Kabushiki Kaisha Toshiba | Negative photosensitive polymer composition of a thermosetting polymer precursor curable by cyclodehydration upon heating |
JPH09316326A (en) * | 1996-05-31 | 1997-12-09 | Toyobo Co Ltd | Polybenzazole composition and fiber |
US6001517A (en) * | 1996-10-31 | 1999-12-14 | Kabushiki Kaisha Toshiba | Positive photosensitive polymer composition, method of forming a pattern and electronic parts |
US6183934B1 (en) * | 1997-07-01 | 2001-02-06 | Kabushiki Kaisha Toshiba | Negative photosensitive resin composition, method of forming a pattern and electronic parts |
JP2004264537A (en) * | 2003-02-28 | 2004-09-24 | Hitachi Chemical Dupont Microsystems Ltd | Heat-resistant photosensitive resin composition, method for manufacturing pattern using the composition, and electronic parts |
WO2005101125A1 (en) * | 2004-03-31 | 2005-10-27 | Hitachi Chemical Dupont Microsystems Ltd. | Heat-resistant photosensitive resin composition, process for producing pattern from the composition, and electronic part |
Non-Patent Citations (3)
Title |
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DATABASE WPI Week 200580, Derwent World Patents Index; AN 2005-785981, XP008115311 * |
GI XUE ET AL.: "The formation of an effective anti-corrosion film on copper surfaces from 2-mercaptobenzimidazole solution", J. ELECTROANAL. CHEM., vol. 310, 1991, pages 139 - 148, XP026534786 * |
JIAN DONG ET AL.: "Studies of polyimide/copper interface and its improvement by a two-component primer", DIE ANGEWANDTE MAKROMOLEKULARE CHEMIE, vol. 230, no. 4044, 1995, pages 143 - 157, XP000535892 * |
Also Published As
Publication number | Publication date |
---|---|
TW200640998A (en) | 2006-12-01 |
EP1861749A4 (en) | 2010-10-06 |
KR20070118584A (en) | 2007-12-17 |
US20060216641A1 (en) | 2006-09-28 |
WO2006104803A2 (en) | 2006-10-05 |
EP1861749A2 (en) | 2007-12-05 |
JP2008535003A (en) | 2008-08-28 |
US7407731B2 (en) | 2008-08-05 |
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