WO2006095724A1

WO2006095724A1 - Interposer

Info

Publication number: WO2006095724A1
Application number: PCT/JP2006/304353
Authority: WO
Inventors: Shin Yoshida; Taiji Okamoto; Tomoyuki Higuchi
Original assignee: Alps Electric Co., Ltd.
Priority date: 2005-03-10
Filing date: 2006-03-07
Publication date: 2006-09-14
Also published as: CN101138133A; KR20070101389A; JP2006253388A

Abstract

[PROBLEMS] To provide an interposer capable of connecting electrodes of an electronic part with simple structure without requiring formation of a through hole. [MEANS FOR SOLVING PROBLEMS] Elastic contacts (20A, 20B) are formed in an elastic contact formation area A while contacts (14A, 14B) are formed in a contact formation area B on a substrate sheet (12). The substrate sheet (12) is folded at the portion between the two types of contacts in a folding area C along an outer shape of a spacer (11). The connection between the elastic contact (20A) and the contact (14A) and the connection between the elastic contact (20B) and the contact (14B) are made by connection lines formed on the substrate sheet (12). Accordingly, when the interposer (10) is mounted on a mounting unit (31) of a device body (30) and an electronic part (40) is mounted thereon before closing the cover, it is possible to connect the electrodes (32, 33) of the device body (30) to the electrodes (41, 42) of the electronic part (40), respectively. Thus, it is possible to connect electrodes of the electronic part with a simple structure without forming a through hole.

Description

Relay board

Technical field

The present invention relates to, for example, a relay substrate provided between electrodes of an electronic component disposed opposite to each other and securing an electrical connection between both electrodes, which can be easily manufactured with a particularly simple configuration. Relay board.

Background art

In recent years, with the multifunctionalization and higher performance of semiconductor integrated circuits (ICs), the number of input / output pins of an IC package (hereinafter referred to as “package” as appropriate) in which a semiconductor bare chip is sealed is It tends to increase year by year, for example, the one with more than 1000 pins has begun to appear

For this reason, the type of input / output pins has been changed from the method of taking out from both sides and four sides of the conventional package to the method of taking out from the entire bottom of the package, for example, BGA (Ball Grid Array; ) and LGA (Land Grid _Array; semiconductor devices called flat contact) of any number of CSP having a pin terminal (Chip Size Package) has been developed.

The input / output pins such as the BGA are arranged in a matrix (also referred to as a grid or grid) on the bottom surface of the CSP. The connection between such a BGA on the package side and an electrode formed on a circuit board such as a mother board on the device body side is performed using an IC socket as shown in Patent Document 1, for example.

The IC socket shown in Patent Document 1 has a large number of through holes (through holes) formed in a matrix on the bottom surface of the IC mounting portion, and a spring is provided inside each through hole. A sleeve is provided which has a contact probe which is biased back and forth. And the said sleeve is conductively connected to the electrode provided in the said circuit base material

[0006] When the package is positioned and mounted in the IC socket, each BGA of the package abuts on the tip of each contact probe and pushes down. At this time, each contour Since the contact portion of the Tat probe contacts each electrode on the circuit board side, the space between each BGA on the package side and each electrode on the circuit board side is through the contact portion of the spring body and the contact probe in each sleeve. And electrically connected.

At this point, the IC socket functions as a relay board (interposer) for electrically connecting each BGA on the package side and each electrode on the circuit board side.

Patent Document 1: Japanese Patent Application Laid-Open No. 2002-357622

Disclosure of the invention

Problem that invention tries to solve

However, the above-mentioned Patent Document 1 has a problem that a large number of through holes must be positioned with high precision and opened on the bottom surface of the IC mounting portion.

In addition, since it is necessary to provide a contact probe with the spring body in such a manner that the contact probe can be advanced and retracted in the through hole, the structure of the socket becomes complicated and the IC mounting portion becomes large. is there.

In addition, since it is necessary to secure a space for fixing a socket on the circuit board, it is difficult to miniaturize the circuit board, that is, the device body itself. Alternatively, there is also a problem that the space hinders the increase in the number of parts to be mounted on the circuit board.

By the way, since the pitch distance between the electrodes of the semiconductor bare chip is narrower than the pitch distance between the electrodes of the IC package which seals it, the IC package in the state where the distance between the electrodes of the semiconductor bare chip is extended. Rewiring technology to connect to the electrodes of However, conventionally, the configuration of rewiring of the electrodes between the two was performed by using the technology of the multilayer substrate, and there was a problem that the complicated process and the manufacturing cost increased.

The present invention is intended to solve the above-mentioned conventional problems, and it is an object of the present invention to provide a relay substrate capable of making an electrical connection between electrodes of an electronic component with a simple and easy configuration. And

Another object of the present invention is to provide a relay substrate in which connections between a large number of opposing electrodes can be made without forming through holes.

Furthermore, the present invention enables easy electrical connection between electrodes having different pitch spacings. The purpose is to provide a relay board.

Means to solve the problem

According to the present invention, there is provided a base material having a folding area at the center in the width direction, and a plurality of contacts provided on the surface of the base material and divided into one end side and the other end side in the width direction. Have

At least one of the contacts on the one end side and the other end is formed of an elastic contact, and conductive continuous connection is established between the contact provided on the one end side and the contact provided on the other end side. It is characterized by being connected.

In the above, the base material is folded in a mountain fold in the folding area with the surface on which the contact is exposed facing outward, and between the back surfaces of the base materials facing each other. It is preferable that a spacer be provided.

Furthermore, it is preferable that the spacer is formed of an insulating material or a material having conductivity! /.

The present invention is configured to electrically connect a contact located on one surface side to form a through hole in the relay substrate with a contact located on the other surface side, and the two are connected. Since the connecting wire can be formed integrally with the contact using a technique such as plating, manufacturing is easy and the manufacturing cost can be reduced.

Further, the thickness dimension of the relay substrate can be freely adjusted simply by selecting the spacer. Therefore, a small and thin relay board 10 can be obtained.

Further, according to the present invention, there is provided a base material provided with a folding area at the center in the width direction, and a plurality of contacts provided on the surface of the base material and divided into one end side and the other end side in the width direction. A conductive connecting line for connecting between the contact provided on the one end side and the contact provided on the other end side, and in the turnback region with the surface on which the contact is exposed facing outward A relay substrate having a spacer provided between the back surfaces of the base material folded in a mountain fold, wherein the spacer is formed of a soft material that can be elastically deformed. It is the day of the year.

[0021] In the above invention, the spacer may be deformed as a whole to be a relay board having an elastic contact.

In the above, for example, the arrangement order of the contacts provided on the one end side and the other end side The arrangement order of the contact points provided in can be the same order.

Furthermore, the pitch dimension between the contacts provided on the one end side and the pitch dimension between the contacts provided on the other end side may be formed to be different from each other.

According to the above means, rewiring in the IC package can be performed easily and inexpensively.

The relay substrate according to any one of claims 1 to 7, wherein the base material is formed of a flexible sheet.

According to the above means, the relay substrate can be easily formed from a single base sheet.

In the above, the elastic contact provided on the base material is a spiral contact that extends in a spiral manner toward the winding end on the center side of the winding start end provided on the base on the outer periphery side, In this case, it is preferable that the spiral contact has a chevron shape that protrudes vertically toward the winding end and the winding start end.

Effect of the invention

In the present invention, since it is not necessary to form a through hole in the substrate, a simple and easy relay substrate can be provided. Further, by changing the spacer, it is possible to freely adjust the thickness dimension of the relay substrate, and therefore, it is possible to easily provide a thin relay substrate.

Further, since the pitch dimension can be adjusted only by changing the distance between the contacts formed on the relay substrate, rewiring of the IC package can be easily performed.

BEST MODE FOR CARRYING OUT THE INVENTION

FIG. 1 is an external perspective view showing a relay substrate as an embodiment of the present invention, and FIG. 1A is a relay substrate seen from one direction, and FIG. 1B is a relay substrate seen from the reverse direction. 2 is an exploded perspective view of the relay substrate shown in FIG. 1, FIG. 3 is a perspective view showing a spiral contact as an example of an elastic contact, and FIG. 4 is an example of use of the relay substrate and FIG. FIG.

As shown in FIGS. 1A and 1B, the relay substrate 10 has a bar shape extending linearly in the direction of Y1 and Y2 shown. The relay substrate 10 has a spacer 11 functioning as a base and a base sheet (base material) 12 attached to the surface of the spacer 11. The spacer 11 is formed in a bar shape, and an arc-shaped curved surface 11 a is formed on at least one side surface in the width (X) direction. The material for forming the spacer 11 is, for example, an insulating hard substrate (glass epoxy), or a conductive metal material, or a soft material which can be elastically deformed, such as natural rubber, synthetic rubber, or elastomer. It is possible to select the material that suits the purpose of use. In the present embodiment, the insulating hard substrate is formed.

The base sheet 12 is preferably a thin sheet having an insulating property and flexibility, such as a polyimide sheet, for example. The surface of the base sheet 12 is provided with a plurality of contacts arranged regularly.

On one surface 10A of the relay substrate 10 shown in FIG. 1A, a plurality of elastic contacts (contacts) 20A and 20B arranged in two rows in the Y direction are provided. As shown in FIG. 2, one flexible contact 20A is provided along the imaginary line Ya located on the surface of the base sheet 12 and on the outer side (XI side) in the width direction (X direction), as shown in FIG. The other elastic contacts 20B are juxtaposed at the interval L along an imaginary line Yb similarly located on the inner side (X2 side). As shown in FIG. 1A, a predetermined inter-electrode distance (pitch dimension) W1 is provided between the virtual line Ya and the virtual line Yb, and the elastic contact 20A and the elastic contact 20B adjacent in the X direction are provided. Are paired. The area where the elastic contacts 20A and 20B are formed is the elastic contact area A.

Further, on the other surface 10B of the relay substrate 10 shown in FIG. 1B, a plurality of contacts 14A and 14B arranged in two rows in the Y direction are provided. The plurality of contacts 14A, 14B shown in FIG. 2 are ordinary contacts (fixed contacts with tips protruding in a convex shape) other than the elastic contacts 20A, 20B, and the elastic contacts 20A, 20B on the base sheet 12 It is formed on the same surface as the formed surface. As shown in FIG. 1B, one contact point 14A is juxtaposed in the illustrated Y direction along the imaginary line Yc located on the outer side (X2 side) of the base sheet 12 in the width direction (X direction). The other contact point 14B is juxtaposed at the distance L along an imaginary line Yd located inside (XI side). A predetermined inter-electrode distance (pitch dimension) ¹ \ ^ 2 (≥ ¹ ^ 1> 0) is also provided between the virtual line Yc and the virtual line Yd, and adjacent contact points 14A in the X direction It is paired with the contact 14B. In addition, the contacts 14A and 14B are formed. The area is the contact formation area B.

As shown in FIGS. 1A, 1B and 2, the flexible contact 20A located outside the elastic contact area A and the contact 14A located outside the contact area B are, for example, gold, silver and the like. Alternatively, the elastic contact 20B is connected by a thin-film connecting line (pattern line) 15a formed of a conductive material such as copper, and is similarly located inside the elastic contact area A, and the contact is formed. A thin-film connecting line (pattern line) 15b connects with a contact point 14B located inside the area B.

The elastic contacts 20A and 20B shown in the present embodiment are, for example, spiral contacts 21 and 21 having a spiral shape or a spiral shape. As shown in FIG. 3, a plurality of holes 12 a and 12 a penetrating the base sheet 12 are formed at positions where the spiral contacts 21 and 21 are to be formed on the base sheet 12. . In the vicinity of the holes 12a, 12a, bar-shaped bases 21a, 21a are formed by extending from the connecting lines 15a, 15b.

The base 21a is provided with an elastically deformable portion 21b extending in a spiral or spiral direction toward the center of the hole 12a. In the elastically deformable portion 21b, the base 21a side is the winding start end 21bl, and the tip is the winding end 21b2.

[0038] As shown in FIG. 3, the spiral contact 21 gradually protrudes in the Z1 direction according to the direction from the winding start end 21bl toward the winding end 21b2, and as a whole, it has a mountain shape or a convex shape. It has a shape. The spiral contact 21 is cantilevered on the base 21a in a state in which the elastically deformable portion 21b can be elastically deformed in the Z1 direction with the side of the winding start end 21bl as a fulcrum. Therefore, the elastic deformation portion 21b is in a state of being elastically deformable in the Z1 and Z2 directions as a whole.

The elastic contacts 20A and 20B, the contacts 14A and 14B, and the continuous connections 15a and 15b, which are the spiral contacts 21, may all be formed on one side (surface) of the base sheet 12. it can. Therefore, they can be integrally formed by using, for example, a technique such as a plating process or an etching process on a metal foil. For this reason, it is possible to manufacture easily and easily and to reduce the manufacturing cost.

Next, a method of assembling the relay substrate 10 will be described. As shown in FIG. 3, the central position in the width direction (X direction) of the base sheet 12, that is, the elastic contact formation area A provided on one end (XI) side and the other end (X2) side A turning area C is provided between the contact forming area B and the contact forming area B.

The relay substrate 10 is mountain-folded in the folding area C with the surface of the base sheet 12 as described above (the side on which the contacts 20A, 14A, etc. are exposed) directed outward. Turn back.

Then, the spacer 11 is interposed between the back surfaces of the base sheet 12 (between the back surface of the elastic contact area A and the back surface of the contact area B), and the adhesive is used to interpose the spacer 11. The back surface of the base sheet 12 is adhesively fixed to the front surface of the substrate 11. At this time, the intermediate curved surface 11 a of the spacer 11 is interposed between the back surfaces of the base sheet 12 in a state where the curved surface 11 a of the spacer 11 is opposed to the back surface of the turnback region C, as shown in FIGS. The substrate 10 can be used. As described above, when the folding area C is attached so as to follow the curved surface 11a, it is possible to prevent the occurrence of a defect such as a break in the connection lines 15a and 15b.

The relay substrate 10 described in the above embodiment is, for example, an electrode provided on the device main body side and a state in which the relay substrate 10 can be detachably attached to the device main body, for securing the electrical connection with the electrode of the electronic component In order to connect with the electrode exposed and formed on the surface of a certain memory card, or by arranging multiple relay substrates 10 side by side, with electrodes such as BGA and LGA arranged on the bottom of the IC package It can be used as a contact electrode for connection.

Therefore, an application example using the relay board 10 will be described below.

In the example of use shown in FIG. 4, the relay board 10 is loaded in a concave loading unit 31 provided in an apparatus main body 30 such as a portable telephone. The bottom surface 31a of the loading portion 31 is provided with a plurality of electrodes 32, 33 facing the plurality of contacts 14A, 14B, and the contacts 14A, 14B of the relay substrate 10 and the electrodes 32, of the loading portion 31, And 33 are fixed in a conductive state via connection means 36 such as solder or conductive adhesive.

An upper portion of the loading unit 31 is, for example, a storage area 34 of an electronic component 40 such as a small memory card. As shown in FIG. 4, the electronic component 40 is mounted on the storage area 34 with its electrode portions 41 and 42 facing downward. When the storage area 34 is closed by a lid (not shown), the electronic component 40 can be held between the storage area 34 and the lid. It is assumed.

In the state where the electronic component 40 is held, the electronic component 40 is pressed by the lid with a predetermined pressing force F in the Z2 direction in the figure, and therefore the spiral contact 21 of the relay substrate 10 The elastic contacts 20A and 20B are set in contact with the electrode portions 41 and 42 of the electronic component 40 and are elastically deformed in the contracting direction.

Therefore, the electrode parts 41 and 42 of the electronic component 40 and the electrodes 32 and 33 on the device body 30 side are respectively connected via the elastic contacts 20A and 20B, the connecting wires 15a and 15b, and the contacts 14A and 14B. Electrical connection can be made.

In addition, the spiral contact 21 forming the elastic contacts 20A and 20B used in the present embodiment has a protruding amount (a height dimension from the base 21a to the winding start end 21b2) h, It can be set smaller than the conventional contact pins and the like. Moreover, the spacer 11 can freely select the plate thickness dimension H at the time of manufacture. For this reason, the thin relay substrate 10 can be obtained by selecting the spacer 11 which has a thin plate thickness dimension H force.

In addition, a contact 14A provided on the lower side is also located below the elastic contact 20A provided on the outer side, and a contact provided on the lower side is also provided below the elastic contact 20B provided on the inner side. 14B is located, that is, the order of the elastic contacts 20A and 20B provided on the one end (elastic contact formation area A) side, and the contacts 14A and 14B provided on the other end (contact formation area B) side. The order of arrangement and force are arranged and formed in the same order. Therefore, the electrode parts 41 and 42 of the electronic component 40 can be made to correspond to the electrodes 32 and 33 on the device main body 30 side, and the respective electrodes can be positively connected in a correct state without misordering the positions. I can do it.

When connecting a plurality of such relay boards 10 in a socket to an electrode such as a BGA or LGA disposed on the bottom of the IC package, the above-mentioned planar contact may be used. Since the individual contact pressure of 21 is small, it is possible to hold the IC package with an extremely small pressure F as compared with the conventional contact pin or the like. Alternatively, when the IC package is held under the same large pressing force F as in the prior art, the load acting on each electrode of the IC package (elastic contact 20 A, 20 It is possible to reduce the contact pressure due to B).

In the relay substrate 10, the distance W1 between the electrodes on the elastic contact area A side and the distance W2 between the electrodes on the contact area B are different, ie, the distance between electrodes on the elastic contact area A The inter-electrode distance W2 on the contact formation region B side is wider than W1. Therefore, for example, when the relay substrate 10 is used for connection between a bare chip having a narrow distance between electrodes and a package side electrode holding the same, the distance W1 between the bare chips is increased by It is possible to extend to W2, that is, to facilitate rewiring. Also, since it is not necessary to use the multilayer substrate technology as in the prior art, rewiring can be made with a simple configuration.

Also, for example, even if a failure occurs in one relay substrate 10, it is not necessary to replace the entire socket if only the relevant relay substrate 10 is replaced. As a result, the repair process can be simplified, and the repair cost can be reduced.

The above embodiment has been described using the relay substrate 10 aligned in two rows in the longitudinal direction as the number of rows of elastic contacts and contacts, but the present invention is not limited to this. Each may be in one row configuration, or in three or more rows configuration.

Further, the number of rows of elastic contacts may be different from the number of rows of contacts! / ,. That is, the elastic contacts and the contacts do not necessarily have a one-to-one correspondence relationship. For example, two or more contacts may be connected by the connection line 15a or 15b to one elastic contact. .

In the above embodiment, the contact points 14 A and 14 B are formed as convex electrodes and are fixed to the electrodes 32 and 33 on the device body 30 by soldering or the like, but the present invention is not limited thereto. The contacts 14A and 14B which are not limited to the above are elastic contacts which also have the same spiral contact force as described above, and may be connected to the electrodes 32, 33 on the device side by elastic pressure.

Furthermore, in the above embodiment, a spiral contact has been described as one configuration of the elastic contacts 20A and 20B, but the elastic contacts 20A and 20B are not limited to spiral contacts. The tip end to be the contact point is curved in a substantially U shape It may be an elastic contact that can be deformed as a whole, such as a spring pin (contact pin) that can be elastically deformed, a stressed metal, or a bamboo panel, but as an elastic contact that can be made thinner. Preferred are spiral contacts and stressed metals as described above.

Furthermore, in the above embodiment, the spacer 11 is a hard substrate, and the contact located inside the elastic contact area A is an elastic contact, and the inner side of the contact area B is In the above description, the case where the contacts located on the side are the normal contacts 14A and 14B other than the elastic contacts is described, but when the spacer 11 is formed of a material having excellent elasticity such as a cushion material Both the elastic contact formation area A and the contact formation area B may be formed by ordinary contacts 14A and 14B other than the elastic contact. Even in this case, the aspect in which the defect of the elastic contact area A or the contact area B is an elastic contact is not excluded!

Brief description of the drawings

FIG. 1A is an external perspective view of a relay substrate according to an embodiment of the present invention as viewed from one direction,

[FIG. 1B] An appearance perspective view of the relay substrate seen from the reverse direction,

[Fig. 2] An exploded perspective view of the relay board,

[FIG. 3] A perspective view showing a spiral contact as an example of an elastic contact,

[FIG. 4] A cross-sectional view taken along line 4-4 of FIG.

10 relay board

11 Spacer (base)

11a Curved surface

12 base sheet

12a Forgiveness

14A, 14B Normal contact point

15a, 15b connecting line (pattern line)

20A, 20B elastic contacts (contacts)

21 Spiral contactor 21a base

21b Elastic deformation part

21bl Whisper beginning

21b2 end of winding

30 main unit

31 loading section

32, 33 electrodes

34 Storage area

36 Connection means

40 Electronic parts

41, 42 electrode plate

A Elastic contact formation area

B contact area

C wrap area

W1 Distance between electrodes between elastic contacts (pitch) W2 Distance between electrodes between regular contacts (pitch)

Claims

The scope of the claims

[1] It has a base material provided with a folding area at the center in the width direction, and a plurality of contact points divided on one end side and the other end side in the width direction on the surface of the base material,

At least one of the contacts on the one end side and the other end is formed of an elastic contact, and conductive continuous connection is established between the contact provided on the one end side and the contact provided on the other end side. A relay board characterized by being connected.

[2] The base material is folded in a mountain fold in the folding area with the surface on which the contacts are exposed facing outward, and a spacer is provided between the back surfaces of the base materials facing each other. The relay board according to claim 1, characterized in that:

[3] The relay substrate according to claim 2, wherein the spacer is formed of an insulating material or a conductive material.

[4] A base material provided with a folding area at the center in the width direction, a plurality of contacts provided on the surface of the base material and divided into one end and the other end in the width direction, and the one end A conductive connecting line for connecting between the provided contact point and the contact provided on the other end side, and a mountain fold in the folding area with the surface on which the contact is exposed facing outward A relay substrate having a spacer provided between the back surfaces of the base members, wherein the spacer is formed of a soft material which can be elastically deformed. .

[5] The shift of the invention is characterized in that the order of arrangement of the contacts provided on the one end side and the order of arrangement of the contacts provided on the other end side are the same as the force order. The relay board according to one item.

[6] The pitch dimension between the contacts provided on the one end side and the pitch dimension between the contacts provided on the other end side are formed with different dimensions, and the present invention is characterized in that 5. The relay board according to any one of 5 or more.

[7] The relay substrate according to any one of [1] to [6], wherein the base material is formed of a flexible sheet.

[8] The elastic contact provided on the base material is a spiral contact that extends in a spiral direction toward the winding end on the center side of the winding start end provided on the outer peripheral side base. Do The relay board according to any one of claims 1 to 7.

The relay substrate according to claim 8, wherein the spiral contact has a mountain-like shape in which the winding start force also protrudes three-dimensionally toward the winding end.