WO2006090400A3 - Method and structure for bio-mediated, self-assembled metal-filled nanotube devices and interconnects - Google Patents

Method and structure for bio-mediated, self-assembled metal-filled nanotube devices and interconnects Download PDF

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Publication number
WO2006090400A3
WO2006090400A3 PCT/IL2006/000274 IL2006000274W WO2006090400A3 WO 2006090400 A3 WO2006090400 A3 WO 2006090400A3 IL 2006000274 W IL2006000274 W IL 2006000274W WO 2006090400 A3 WO2006090400 A3 WO 2006090400A3
Authority
WO
WIPO (PCT)
Prior art keywords
self
interconnects
bio
mediated
assembled metal
Prior art date
Application number
PCT/IL2006/000274
Other languages
French (fr)
Other versions
WO2006090400A2 (en
Inventor
Miron Hazani
Original Assignee
Bionnections Inc
Miron Hazani
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bionnections Inc, Miron Hazani filed Critical Bionnections Inc
Publication of WO2006090400A2 publication Critical patent/WO2006090400A2/en
Publication of WO2006090400A3 publication Critical patent/WO2006090400A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/15—Nano-sized carbon materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/10—Applying interconnections to be used for carrying current between separate components within a device
    • H01L2221/1068—Formation and after-treatment of conductors
    • H01L2221/1094—Conducting structures comprising nanotubes or nanowires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
    • H10K85/221—Carbon nanotubes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60—Organic compounds having low molecular weight
    • H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene

Abstract

A nanoparticle structure useful for the construction of self-assembling conductive interconnects and circuits, including: (a) a first nanotube; (b) a first conductive filling disposed at least partially within the first nanotube, for attaching to a second conductive filling disposed at least partially within the second nanotube, and (c) a first linking agent attached, at a first end thereof, to the first conductive filling, and having a second end for attaching to the second conductive filling of the second nanotube.
PCT/IL2006/000274 2005-02-28 2006-02-28 Method and structure for bio-mediated, self-assembled metal-filled nanotube devices and interconnects WO2006090400A2 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US65638705P 2005-02-28 2005-02-28
US60/656,387 2005-02-28
US59505405P 2005-06-02 2005-06-02
US60/595,054 2005-06-02
US59672705P 2005-10-17 2005-10-17
US60/596,727 2005-10-17

Publications (2)

Publication Number Publication Date
WO2006090400A2 WO2006090400A2 (en) 2006-08-31
WO2006090400A3 true WO2006090400A3 (en) 2007-04-12

Family

ID=36927835

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2006/000274 WO2006090400A2 (en) 2005-02-28 2006-02-28 Method and structure for bio-mediated, self-assembled metal-filled nanotube devices and interconnects

Country Status (1)

Country Link
WO (1) WO2006090400A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2950332B1 (en) * 2009-09-18 2011-10-28 Commissariat Energie Atomique COMPRISING AN ELECTROMECHANICAL COMPONENT FOR A MICRO- OR NANO-SYSTEM COMPRISING A COMPONENT-ROTATING AXIS ROD AND COVERED WITH GRAPHENE
WO2011038259A1 (en) * 2009-09-25 2011-03-31 Incitor Incorporated Synthetic glycosyl hydrolase based on dna nanoweaves

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020172963A1 (en) * 2001-01-10 2002-11-21 Kelley Shana O. DNA-bridged carbon nanotube arrays

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020172963A1 (en) * 2001-01-10 2002-11-21 Kelley Shana O. DNA-bridged carbon nanotube arrays

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
LEONHARDT A. ET AL.: "Synthesis and properties of filled carbon nanotubes", DIAMOND AND RELATED MATERIALS, vol. 12, 2003, pages 790 - 793, XP004423760 *

Also Published As

Publication number Publication date
WO2006090400A2 (en) 2006-08-31

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