WO2006078908A3 - Differential alternating phase shift mask optimization - Google Patents
Differential alternating phase shift mask optimization Download PDFInfo
- Publication number
- WO2006078908A3 WO2006078908A3 PCT/US2006/002046 US2006002046W WO2006078908A3 WO 2006078908 A3 WO2006078908 A3 WO 2006078908A3 US 2006002046 W US2006002046 W US 2006002046W WO 2006078908 A3 WO2006078908 A3 WO 2006078908A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- design
- mask
- mask design
- features
- rules
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/30—Alternating PSM, e.g. Levenson-Shibuya PSM; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/29—Rim PSM or outrigger PSM; Preparation thereof
Abstract
A method of mask design comprises creating a first mask design by aligning mask resolution enhancement technology (RET) features, such as alternating phase shifting regions or sub-resolution assist features, with critical width segments of the integrated circuit design, such that the first mask design meets manufacturability design rules, and creating a second mask design by aligning RET features with the critical width segments of the integrated circuit design, such that the second mask design meets lithographic design rules in regions local to the critical width segments. Features of the second mask design are identified that violate the manufacturability design rules, and then a third mask design is created, derived from the second mask design wherein the features of the second mask design that violate the manufacturability rules are selectively replaced by features from the first mask design so that the third mask design meets the manufacturability design rules.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06719024A EP1849112A2 (en) | 2005-01-21 | 2006-01-20 | Differential alternating phase shift mask optimization |
JP2007552287A JP4755655B2 (en) | 2005-01-21 | 2006-01-20 | Optimization of differential alternating phase shift mask |
CN2006800028621A CN101213547B (en) | 2005-01-21 | 2006-01-20 | Differential alternating phase shift mask design method and system |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/905,822 US7617473B2 (en) | 2005-01-21 | 2005-01-21 | Differential alternating phase shift mask optimization |
US10/905,822 | 2005-01-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006078908A2 WO2006078908A2 (en) | 2006-07-27 |
WO2006078908A3 true WO2006078908A3 (en) | 2007-11-22 |
Family
ID=36692923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2006/002046 WO2006078908A2 (en) | 2005-01-21 | 2006-01-20 | Differential alternating phase shift mask optimization |
Country Status (6)
Country | Link |
---|---|
US (2) | US7617473B2 (en) |
EP (1) | EP1849112A2 (en) |
JP (1) | JP4755655B2 (en) |
CN (1) | CN101213547B (en) |
TW (1) | TW200710694A (en) |
WO (1) | WO2006078908A2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7617473B2 (en) * | 2005-01-21 | 2009-11-10 | International Business Machines Corporation | Differential alternating phase shift mask optimization |
US20080028359A1 (en) * | 2006-07-31 | 2008-01-31 | Stefan Blawid | Termination structure, a mask for manufacturing a termination structure, a lithographic process and a semiconductor device with a termination structure |
US8875063B2 (en) | 2010-10-11 | 2014-10-28 | International Business Machines Corporation | Mask layout formation |
CN102289146B (en) * | 2011-09-14 | 2012-12-05 | 北京理工大学 | Method for optimizing two-phase phase shift mask based on generalized wavelet penalty function |
US9223911B2 (en) | 2014-01-30 | 2015-12-29 | Globalfoundries Inc. | Optical model employing phase transmission values for sub-resolution assist features |
EP2952964A1 (en) * | 2014-06-03 | 2015-12-09 | Aselta Nanographics | Method for determining the parameters of an ic manufacturing process by a differential procedure |
KR102305092B1 (en) | 2014-07-16 | 2021-09-24 | 삼성전자주식회사 | Mask for photolithography and method for fabricating the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4849369A (en) * | 1986-08-21 | 1989-07-18 | Commissariat A L'energie Atomique | Method of making an EPROM memory cell |
US6832364B2 (en) * | 2002-10-03 | 2004-12-14 | International Business Machines Corporation | Integrated lithographic layout optimization |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010024117A (en) * | 1997-09-17 | 2001-03-26 | 뉴메리컬 테크날러쥐스 인코포레이티드 | Design rule checking system and method |
US6335128B1 (en) | 1999-09-28 | 2002-01-01 | Nicolas Bailey Cobb | Method and apparatus for determining phase shifts and trim masks for an integrated circuit |
US6569574B2 (en) | 1999-10-18 | 2003-05-27 | Micron Technology, Inc. | Methods of patterning radiation, methods of forming radiation-patterning tools, and radiation-patterning tools |
US6503666B1 (en) | 2000-07-05 | 2003-01-07 | Numerical Technologies, Inc. | Phase shift masking for complex patterns |
JP4064617B2 (en) * | 2000-10-26 | 2008-03-19 | 株式会社東芝 | Mask pattern correction method, mask pattern correction apparatus, recording medium storing mask pattern correction program, and method of manufacturing semiconductor device |
US6573010B2 (en) | 2001-04-03 | 2003-06-03 | Numerical Technologies, Inc. | Method and apparatus for reducing incidental exposure by using a phase shifter with a variable regulator |
US6553560B2 (en) | 2001-04-03 | 2003-04-22 | Numerical Technologies, Inc. | Alleviating line end shortening in transistor endcaps by extending phase shifters |
US6703167B2 (en) * | 2001-04-18 | 2004-03-09 | Lacour Patrick Joseph | Prioritizing the application of resolution enhancement techniques |
US6569583B2 (en) * | 2001-05-04 | 2003-05-27 | Numerical Technologies, Inc. | Method and apparatus for using phase shifter cutbacks to resolve phase shifter conflicts |
US6821689B2 (en) * | 2002-09-16 | 2004-11-23 | Numerical Technologies | Using second exposure to assist a PSM exposure in printing a tight space adjacent to large feature |
US7172838B2 (en) * | 2002-09-27 | 2007-02-06 | Wilhelm Maurer | Chromeless phase mask layout generation |
US7229722B2 (en) * | 2004-01-28 | 2007-06-12 | International Business Machines Corporation | Alternating phase shift mask design for high performance circuitry |
US7175942B2 (en) * | 2004-02-05 | 2007-02-13 | International Business Machines Corporation | Method of conflict avoidance in fabrication of gate-shrink alternating phase shifting masks |
JP2007536581A (en) * | 2004-05-07 | 2007-12-13 | メンター・グラフィクス・コーポレーション | Integrated circuit layout design method using process variation band |
KR100716990B1 (en) | 2005-01-05 | 2007-05-14 | 삼성전자주식회사 | Liquid crystal device for compensating aberration and optical pickup and optical recording and/or reproducing apparatus employing it |
US7617473B2 (en) * | 2005-01-21 | 2009-11-10 | International Business Machines Corporation | Differential alternating phase shift mask optimization |
-
2005
- 2005-01-21 US US10/905,822 patent/US7617473B2/en not_active Expired - Fee Related
-
2006
- 2006-01-05 TW TW095100531A patent/TW200710694A/en unknown
- 2006-01-20 EP EP06719024A patent/EP1849112A2/en not_active Withdrawn
- 2006-01-20 JP JP2007552287A patent/JP4755655B2/en not_active Expired - Fee Related
- 2006-01-20 CN CN2006800028621A patent/CN101213547B/en active Active
- 2006-01-20 WO PCT/US2006/002046 patent/WO2006078908A2/en active Application Filing
-
2009
- 2009-09-03 US US12/553,505 patent/US8181126B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4849369A (en) * | 1986-08-21 | 1989-07-18 | Commissariat A L'energie Atomique | Method of making an EPROM memory cell |
US6832364B2 (en) * | 2002-10-03 | 2004-12-14 | International Business Machines Corporation | Integrated lithographic layout optimization |
Also Published As
Publication number | Publication date |
---|---|
CN101213547A (en) | 2008-07-02 |
EP1849112A2 (en) | 2007-10-31 |
WO2006078908A2 (en) | 2006-07-27 |
JP4755655B2 (en) | 2011-08-24 |
US20060166105A1 (en) | 2006-07-27 |
US20100017780A1 (en) | 2010-01-21 |
US8181126B2 (en) | 2012-05-15 |
CN101213547B (en) | 2012-05-09 |
JP2008529066A (en) | 2008-07-31 |
TW200710694A (en) | 2007-03-16 |
US7617473B2 (en) | 2009-11-10 |
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