WO2006078791A3 - Systems, masks and methods for printing contact holes and other patterns - Google Patents
Systems, masks and methods for printing contact holes and other patterns Download PDFInfo
- Publication number
- WO2006078791A3 WO2006078791A3 PCT/US2006/001854 US2006001854W WO2006078791A3 WO 2006078791 A3 WO2006078791 A3 WO 2006078791A3 US 2006001854 W US2006001854 W US 2006001854W WO 2006078791 A3 WO2006078791 A3 WO 2006078791A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- masks
- contact holes
- patterns
- methods
- systems
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
Abstract
Contact hole patterns are disclosed having a plurality of peripheral regions formed around a target area in which a contact hole is to be formed. The peripheral regions visually resemble 'lobes' or 'leaves' extending outwards towards the periphery of the target area. The lobes may be disjoint or connected to each other. Present methods can be used to prepare masks for printing contact holes on wafers, as well as to prepare design patterns for laser-writers or direct- write lithography in order to print contact holes on masks or directly on wafers. The methods apply to both binary and phase-shift mask designs with varying illuminations.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US64527605P | 2005-01-18 | 2005-01-18 | |
US60/645,276 | 2005-01-18 | ||
US72365305P | 2005-10-04 | 2005-10-04 | |
US60/723,653 | 2005-10-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006078791A2 WO2006078791A2 (en) | 2006-07-27 |
WO2006078791A3 true WO2006078791A3 (en) | 2006-12-28 |
Family
ID=36692858
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2006/001854 WO2006078791A2 (en) | 2005-01-18 | 2006-01-18 | Systems, masks and methods for printing contact holes and other patterns |
Country Status (4)
Country | Link |
---|---|
US (1) | US20060172204A1 (en) |
KR (1) | KR20070100896A (en) |
TW (1) | TW200639590A (en) |
WO (1) | WO2006078791A2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7698665B2 (en) | 2003-04-06 | 2010-04-13 | Luminescent Technologies, Inc. | Systems, masks, and methods for manufacturable masks using a functional representation of polygon pattern |
US7703049B2 (en) | 2005-10-06 | 2010-04-20 | Luminescent Technologies, Inc. | System, masks, and methods for photomasks optimized with approximate and accurate merit functions |
US7788627B2 (en) | 2005-10-03 | 2010-08-31 | Luminescent Technologies, Inc. | Lithography verification using guard bands |
US7793253B2 (en) | 2005-10-04 | 2010-09-07 | Luminescent Technologies, Inc. | Mask-patterns including intentional breaks |
US7921385B2 (en) | 2005-10-03 | 2011-04-05 | Luminescent Technologies Inc. | Mask-pattern determination using topology types |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7124394B1 (en) | 2003-04-06 | 2006-10-17 | Luminescent Technologies, Inc. | Method for time-evolving rectilinear contours representing photo masks |
JP2005116756A (en) * | 2003-10-07 | 2005-04-28 | Fujitsu Ltd | Semiconductor device and its manufacturing method |
US7707541B2 (en) | 2005-09-13 | 2010-04-27 | Luminescent Technologies, Inc. | Systems, masks, and methods for photolithography |
US7721247B2 (en) * | 2006-12-28 | 2010-05-18 | Macronix International Co., Ltd. | Side lobe image searching method in lithography |
US8028252B2 (en) * | 2007-09-14 | 2011-09-27 | Luminescent Technologies Inc. | Technique for determining mask patterns and write patterns |
US20090191468A1 (en) * | 2008-01-29 | 2009-07-30 | International Business Machines Corporation | Contact Level Mask Layouts By Introducing Anisotropic Sub-Resolution Assist Features |
US20090250760A1 (en) * | 2008-04-02 | 2009-10-08 | International Business Machines Corporation | Methods of forming high-k/metal gates for nfets and pfets |
TWI427677B (en) * | 2008-05-12 | 2014-02-21 | Richtek Technology Corp | Used to reduce the embossing of the metal mask, hole layout and methods |
US7975246B2 (en) * | 2008-08-14 | 2011-07-05 | International Business Machines Corporation | MEEF reduction by elongation of square shapes |
CN102219177A (en) * | 2010-04-14 | 2011-10-19 | 原相科技股份有限公司 | Micro electro mechanical system photomask and method for improving topological appearance of tungsten sediment |
US20170053058A1 (en) * | 2015-08-21 | 2017-02-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Model-based rule table generation |
CN112506000A (en) * | 2019-09-16 | 2021-03-16 | 长鑫存储技术有限公司 | Improved OPC method and mask pattern manufacturing method |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020177050A1 (en) * | 2001-05-24 | 2002-11-28 | Nec Corporation | Phase shift mask and design method therefor |
US6596466B1 (en) * | 2000-01-25 | 2003-07-22 | Cypress Semiconductor Corporation | Contact structure and method of forming a contact structure |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000101222A (en) * | 1998-09-21 | 2000-04-07 | Mitsubishi Electric Corp | Printed wiring board and producing method therefor |
IT1313154B1 (en) * | 1999-08-05 | 2002-06-17 | St Microelectronics Srl | Attenuated phase shifting mask used in integrated circuit manufacture, has partially transparent layer made of phase shift material having octagonal window, placed over quartz plate |
US6803155B2 (en) * | 2001-07-31 | 2004-10-12 | Micron Technology, Inc. | Microlithographic device, microlithographic assist features, system for forming contacts and other structures, and method of determining mask patterns |
-
2006
- 2006-01-18 WO PCT/US2006/001854 patent/WO2006078791A2/en active Application Filing
- 2006-01-18 TW TW095101905A patent/TW200639590A/en unknown
- 2006-01-18 US US11/335,018 patent/US20060172204A1/en not_active Abandoned
- 2006-01-18 KR KR1020077018939A patent/KR20070100896A/en not_active Application Discontinuation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6596466B1 (en) * | 2000-01-25 | 2003-07-22 | Cypress Semiconductor Corporation | Contact structure and method of forming a contact structure |
US20020177050A1 (en) * | 2001-05-24 | 2002-11-28 | Nec Corporation | Phase shift mask and design method therefor |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7698665B2 (en) | 2003-04-06 | 2010-04-13 | Luminescent Technologies, Inc. | Systems, masks, and methods for manufacturable masks using a functional representation of polygon pattern |
US7788627B2 (en) | 2005-10-03 | 2010-08-31 | Luminescent Technologies, Inc. | Lithography verification using guard bands |
US7921385B2 (en) | 2005-10-03 | 2011-04-05 | Luminescent Technologies Inc. | Mask-pattern determination using topology types |
US7793253B2 (en) | 2005-10-04 | 2010-09-07 | Luminescent Technologies, Inc. | Mask-patterns including intentional breaks |
US7703049B2 (en) | 2005-10-06 | 2010-04-20 | Luminescent Technologies, Inc. | System, masks, and methods for photomasks optimized with approximate and accurate merit functions |
Also Published As
Publication number | Publication date |
---|---|
KR20070100896A (en) | 2007-10-12 |
US20060172204A1 (en) | 2006-08-03 |
WO2006078791A2 (en) | 2006-07-27 |
TW200639590A (en) | 2006-11-16 |
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