WO2006076381A3 - Radial circuit board, system, and methods - Google Patents

Radial circuit board, system, and methods Download PDF

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Publication number
WO2006076381A3
WO2006076381A3 PCT/US2006/000860 US2006000860W WO2006076381A3 WO 2006076381 A3 WO2006076381 A3 WO 2006076381A3 US 2006000860 W US2006000860 W US 2006000860W WO 2006076381 A3 WO2006076381 A3 WO 2006076381A3
Authority
WO
WIPO (PCT)
Prior art keywords
components
circuit board
radially arrayed
methods
relates
Prior art date
Application number
PCT/US2006/000860
Other languages
French (fr)
Other versions
WO2006076381A2 (en
Inventor
Donald W Mecker
Original Assignee
Legacy Electronics Inc
Donald W Mecker
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Legacy Electronics Inc, Donald W Mecker filed Critical Legacy Electronics Inc
Publication of WO2006076381A2 publication Critical patent/WO2006076381A2/en
Publication of WO2006076381A3 publication Critical patent/WO2006076381A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
    • G11C5/063—Voltage and signal distribution in integrated semi-conductor memory access lines, e.g. word-line, bit-line, cross-over resistance, propagation delay
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09027—Non-rectangular flat PCB, e.g. circular
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09418—Special orientation of pads, lands or terminals of component, e.g. radial or polygonal orientation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

The present invention relates to circuit boards with radially arrayed components. One specific embodiment is a memory circuit board (20) with memory components (27), such as, for example, DRAM chips, radially arrayed around a central point. The present invention also relates to stacking and connecting multiple circuit boards (60) with radially arrayed components. Another embodiment of the invention involves methods of preparing radially arrayed components on a circuit board module with substantially equidistant paths to the components.
PCT/US2006/000860 2005-01-12 2006-01-10 Radial circuit board, system, and methods WO2006076381A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US64312805P 2005-01-12 2005-01-12
US60/643,128 2005-01-12

Publications (2)

Publication Number Publication Date
WO2006076381A2 WO2006076381A2 (en) 2006-07-20
WO2006076381A3 true WO2006076381A3 (en) 2007-12-06

Family

ID=36678138

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/000860 WO2006076381A2 (en) 2005-01-12 2006-01-10 Radial circuit board, system, and methods

Country Status (2)

Country Link
US (1) US7435097B2 (en)
WO (1) WO2006076381A2 (en)

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JP2012008695A (en) * 2010-06-23 2012-01-12 Elpida Memory Inc Memory system, memory module, and module socket
US8842432B2 (en) * 2012-09-22 2014-09-23 Facebook, Inc. Arrangement of computing assets in a data center
US20140185214A1 (en) * 2012-12-31 2014-07-03 Zhen Jia Stacked power module for graphics processing unit
KR102144367B1 (en) * 2013-10-22 2020-08-14 삼성전자주식회사 Semiconductor package and method of fabricating the same
CN108431932A (en) * 2015-09-04 2018-08-21 欧克特沃系统有限责任公司 Use the improved system of the system in package parts
CN107770956A (en) * 2016-08-16 2018-03-06 光宝电子(广州)有限公司 Board structure of circuit
US10365445B2 (en) 2017-04-24 2019-07-30 Mellanox Technologies, Ltd. Optical modules integrated into an IC package of a network switch having electrical connections extend on different planes
US10116074B1 (en) 2017-04-30 2018-10-30 Mellanox Technologies, Ltd. Graded midplane
KR102334500B1 (en) * 2019-02-18 2021-12-02 엘에스일렉트릭(주) Module type inverter system

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Also Published As

Publication number Publication date
US7435097B2 (en) 2008-10-14
WO2006076381A2 (en) 2006-07-20
US20060164820A1 (en) 2006-07-27

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