WO2006073998B1 - Fine pitch electrical interconnect assembly - Google Patents

Fine pitch electrical interconnect assembly

Info

Publication number
WO2006073998B1
WO2006073998B1 PCT/US2005/047246 US2005047246W WO2006073998B1 WO 2006073998 B1 WO2006073998 B1 WO 2006073998B1 US 2005047246 W US2005047246 W US 2005047246W WO 2006073998 B1 WO2006073998 B1 WO 2006073998B1
Authority
WO
WIPO (PCT)
Prior art keywords
electrical interconnect
interconnect assembly
base portion
housing
contact members
Prior art date
Application number
PCT/US2005/047246
Other languages
French (fr)
Other versions
WO2006073998A3 (en
WO2006073998A2 (en
Inventor
James J Rathburn
Martin Cavegn
Original Assignee
Gryphics Inc
James J Rathburn
Martin Cavegn
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/030,213 external-priority patent/US7326064B2/en
Application filed by Gryphics Inc, James J Rathburn, Martin Cavegn filed Critical Gryphics Inc
Priority to JP2007550405A priority Critical patent/JP2008527649A/en
Priority to EP05855757A priority patent/EP1834380A2/en
Publication of WO2006073998A2 publication Critical patent/WO2006073998A2/en
Publication of WO2006073998A3 publication Critical patent/WO2006073998A3/en
Publication of WO2006073998B1 publication Critical patent/WO2006073998B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/10—Sockets for co-operation with pins or blades
    • H01R13/11—Resilient sockets
    • H01R13/112—Resilient sockets forked sockets having two legs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7082—Coupling device supported only by cooperation with PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/10—Sockets for co-operation with pins or blades
    • H01R13/11—Resilient sockets
    • H01R13/115—U-shaped sockets having inwardly bent legs, e.g. spade type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads

Abstract

An electrical interconnect assembly (1750) for electrically interconnecting terminals on a first circuit member with terminals (1770) on a second circuit member (1772). A plurality of contact members (1700) are positioned in a plurality of the through openings (1761) in a housing. The contact members include a base portion (1708), a first beam (1704) having a proximal end attached to the base portion and a distal end extending away from the base portion in a first direction, and a second beam (1706) having a proximal end attached to the base portion and a distal end extending away from the base portion generally in the first direction. The first and second beams are configured to form at least one loop. At least one tab (1716, 1718) is attached to the base portion. The tab includes at least one engagement feature (1722, 1724) mechanically coupled to a solder member (1726).

Claims

AMENDED CLAIMS[received by the International Bureau on 28 September 2006 (28.09.2006)]
1. An electrical interconnect assembly for electrically interconnecting terminals on a first circuit member with terminals on a second circuit member, the electrical interconnect assembly comprising: a housing comprising a plurality of through openings that extend between a first surface and a second surface of the housing; a plurality of contact members positioned in a plurality of the through openings, the contact members comprising; a base portion; one or more beams having a proximal end attached to the base portion and a distal end extending away from the base portion generally in a first direction; one or more tabs attached to the base portion extending away from the base portion generally in a second direction, the tabs comprising at least one engagement feature; a solder member mechanically coupled with the engagement feature; and a sealing layer on the housing that substantially prevents solder from wicking between the contact members and the housing, and from the first surface and the second surface.
2. The electrical interconnect assembly of claim 1 wherein the mechanical coupling between the solder member and the contact member is the sole means of attachment.
3. The electrical interconnect assembly of claim 1 wherein the housing comprises a plurality of layers forming a plurality of substantially non-moldable through openings that extend between a first surface and a second surface.
4. The electrical interconnect assembly of claim 3 wherein at least one contact member comprises an interlocking relationship with a substantially non-moldable through opening.
47
5. The electrical interconnect assembly of claim 1 wherein the contact members are coupled to at least one layer of the housing using one or more of a compressive force, solder, a wedge bond, a conductive adhesive, an ultrasonic bond, a wire bond, a mechanical coupling between the contact members and the first circuit member, and an overmolded layer coupling the contact members to the housing.
6. The electrical interconnect assembly of claim 1 wherein the plurality of through openings are arranged in a two-dimensional array.
7. The electrical interconnect assembly of claim 1 wherein the housing comprises plurality of layers and at least one layer in the housing comprises a circuit layer.
8. The electrical interconnect assembly of claim 1 wherein the sealing layer comprises a curable polymeric material.
9. The electrical interconnect assembly of claim 1 wherein the beams comprise a generally serpentine shape.
10. The electrical interconnect assembly of claim 1 wherein the tabs comprise a pair of opposing tabs.
11. The electrical interconnect assembly of claim 1 wherein the solder member comprises a snap-fit relationship with the engagement features.
12. The electrical interconnect assembly of claim 1 wherein the solder member is free floating while being mechanically coupled with the base portion.
13. The electrical interconnect assembly of claim 1 wherein the solder member is retained between a tab and the base portion.
48
14. The electrical interconnection assembly of claim 1 wherein the engagement features comprise one of a hole, a recess, a protrusion, or a barb mechanically coupled to the solder member.
15. The electrical interconnection assembly of claim 1 wherein the solder member comprises a non-spherical structure.
16. The electrical interconnection assembly of claim 1 wherein at least one of the tabs and the engagement features are plastically deformed into engagement with the solder member.
17. The electrical interconnection assembly of claim 1 wherein at least one of the tabs and the engagement features are elastically deformed into engagement with the solder member.
18. An electrical interconnect assembly for electrically interconnecting terminals on a first circuit member with terminals on a second circuit member, the electrical interconnect assembly comprising: a housing comprising a plurality of through openings that extend between a first surface and a second surface of the housing; a plurality of contact members positioned in a plurality of the through openings, the contact members comprising; a base portion; first and second beams having a generally serpentine shape with proximal ends attached to the base portion and distal ends extending away from the base portion generally in a first direction; one or more tabs attached to the base portion extending away from the base portion generally in a second direction, the tabs comprising at least one engagement feature; and a solder member mechanically coupled with the engagement feature.
49
19. The electrical interconnect assembly of claim 18 wherein the first and second beams overlap at a location between the respective proximal ends and distal ends to form a first loop, the distal ends of the first and second beams comprising a second loop.
20. The electrical interconnect assembly of claim 18 wherein the distal ends of the first and second beams form a loop when engaged with one of the first or second circuit members.
21. The electrical interconnect assembly of claim 18 wherein the distal ends of the first and second beams are connected as part of a continuous sheet material.
22. The electrical interconnect assembly of claim 18 wherein the distal ends of the first and second beams comprise overlapping tips.
23. The electrical interconnect assembly of claim 18 wherein the pair of overlapping tips prevent the distal ends from separating.
24. The electrical interconnect assembly of claim 18 comprising a sealing layer on the housing that substantially prevents solder from wicking between the contact members and the housing, and from the first surface and the second surface.
25. An electrical interconnect assembly for electrically interconnecting terminals on a first circuit member with terminals on a second circuit member, the electrical interconnect assembly comprising: a housing comprising a plurality of through openings that extend between a first surface and a second surface of the housing; a plurality of contact members positioned in a plurality of the through openings, the contact members comprising; a base portion;
50 first and second beams having a generally serpentine shape with proximal ends attached to the base portion and distal ends extending away from the base portion generally in a first direction; one or more tabs attached to the base portion extending away from the base portion generally in a second direction, the tabs comprising at least one engagement feature; and a solder member mechanically coupled with the engagement feature, the mechanical coupling permitting the solder member to be free floating with respect to the base portion.
PCT/US2005/047246 2005-01-04 2005-12-29 Fine pitch electrical interconnect assembly WO2006073998A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007550405A JP2008527649A (en) 2005-01-04 2005-12-29 Fine pitch electrical interconnect assembly
EP05855757A EP1834380A2 (en) 2005-01-04 2005-12-29 Fine pitch electrical interconnect assembly

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/030,213 2005-01-04
US11/030,213 US7326064B2 (en) 2003-07-16 2005-01-04 Fine pitch electrical interconnect assembly
US11/253,510 2005-10-19
US11/253,510 US7297003B2 (en) 2003-07-16 2005-10-19 Fine pitch electrical interconnect assembly

Publications (3)

Publication Number Publication Date
WO2006073998A2 WO2006073998A2 (en) 2006-07-13
WO2006073998A3 WO2006073998A3 (en) 2007-01-04
WO2006073998B1 true WO2006073998B1 (en) 2007-04-12

Family

ID=36201402

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/047246 WO2006073998A2 (en) 2005-01-04 2005-12-29 Fine pitch electrical interconnect assembly

Country Status (4)

Country Link
US (2) US7297003B2 (en)
EP (1) EP1834380A2 (en)
KR (1) KR20070093063A (en)
WO (1) WO2006073998A2 (en)

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7529635B2 (en) 2004-02-12 2009-05-05 Seagate Technology, Llc Method and apparatus for head gimbal assembly testing
KR101353650B1 (en) * 2006-03-20 2014-02-07 알앤디 소켓, 인코포레이티드 Composite contact for fine pitch electrical interconnect assembly
US7479015B2 (en) * 2006-06-30 2009-01-20 Intel Corporation Socket assembly that includes improved contact arrangement
JP2009043591A (en) * 2007-08-09 2009-02-26 Yamaichi Electronics Co Ltd Ic socket
CN201178168Y (en) * 2007-11-26 2009-01-07 富士康(昆山)电脑接插件有限公司 Electric connector
US7544067B1 (en) * 2008-02-29 2009-06-09 Tyco Electronics Amp K.K. Board mount-type connector and board mount-type connector assembly
JP5029969B2 (en) * 2008-11-12 2012-09-19 山一電機株式会社 Electrical connection device
US7857631B2 (en) 2008-12-30 2010-12-28 Cascade Microtech, Inc. Socket with a housing with contacts with beams of unequal lengths
CA2753890A1 (en) 2009-03-10 2010-09-16 Johnstech International Corporation Electrically conductive pins for microcircuit tester
US20130002285A1 (en) 2010-03-10 2013-01-03 Johnstech International Corporation Electrically Conductive Pins For Microcircuit Tester
WO2011139619A1 (en) 2010-04-26 2011-11-10 Hsio Technologies, Llc Semiconductor device package adapter
US8955215B2 (en) 2009-05-28 2015-02-17 Hsio Technologies, Llc High performance surface mount electrical interconnect
US9276336B2 (en) 2009-05-28 2016-03-01 Hsio Technologies, Llc Metalized pad to electrical contact interface
US9536815B2 (en) 2009-05-28 2017-01-03 Hsio Technologies, Llc Semiconductor socket with direct selective metalization
WO2011002709A1 (en) 2009-06-29 2011-01-06 Hsio Technologies, Llc Compliant printed circuit semiconductor tester interface
WO2010141264A1 (en) 2009-06-03 2010-12-09 Hsio Technologies, Llc Compliant wafer level probe assembly
US8988093B2 (en) 2009-06-02 2015-03-24 Hsio Technologies, Llc Bumped semiconductor wafer or die level electrical interconnect
WO2010141297A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Compliant printed circuit wafer level semiconductor package
WO2012078493A1 (en) * 2010-12-06 2012-06-14 Hsio Technologies, Llc Electrical interconnect ic device socket
WO2010141296A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Compliant printed circuit semiconductor package
US8525346B2 (en) 2009-06-02 2013-09-03 Hsio Technologies, Llc Compliant conductive nano-particle electrical interconnect
US8987886B2 (en) 2009-06-02 2015-03-24 Hsio Technologies, Llc Copper pillar full metal via electrical circuit structure
US8928344B2 (en) 2009-06-02 2015-01-06 Hsio Technologies, Llc Compliant printed circuit socket diagnostic tool
US9054097B2 (en) 2009-06-02 2015-06-09 Hsio Technologies, Llc Compliant printed circuit area array semiconductor device package
US8789272B2 (en) 2009-06-02 2014-07-29 Hsio Technologies, Llc Method of making a compliant printed circuit peripheral lead semiconductor test socket
WO2010141295A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Compliant printed flexible circuit
US8912812B2 (en) 2009-06-02 2014-12-16 Hsio Technologies, Llc Compliant printed circuit wafer probe diagnostic tool
US9699906B2 (en) 2009-06-02 2017-07-04 Hsio Technologies, Llc Hybrid printed circuit assembly with low density main core and embedded high density circuit regions
US9231328B2 (en) 2009-06-02 2016-01-05 Hsio Technologies, Llc Resilient conductive electrical interconnect
US8970031B2 (en) 2009-06-16 2015-03-03 Hsio Technologies, Llc Semiconductor die terminal
US9232654B2 (en) 2009-06-02 2016-01-05 Hsio Technologies, Llc High performance electrical circuit structure
US8955216B2 (en) 2009-06-02 2015-02-17 Hsio Technologies, Llc Method of making a compliant printed circuit peripheral lead semiconductor package
US9613841B2 (en) 2009-06-02 2017-04-04 Hsio Technologies, Llc Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection
US9603249B2 (en) 2009-06-02 2017-03-21 Hsio Technologies, Llc Direct metalization of electrical circuit structures
US9093767B2 (en) 2009-06-02 2015-07-28 Hsio Technologies, Llc High performance surface mount electrical interconnect
US9276339B2 (en) 2009-06-02 2016-03-01 Hsio Technologies, Llc Electrical interconnect IC device socket
US9930775B2 (en) 2009-06-02 2018-03-27 Hsio Technologies, Llc Copper pillar full metal via electrical circuit structure
WO2010141298A1 (en) 2009-06-02 2010-12-09 Hsio Technologies, Llc Composite polymer-metal electrical contacts
WO2011002712A1 (en) 2009-06-29 2011-01-06 Hsio Technologies, Llc Singulated semiconductor device separable electrical interconnect
US9318862B2 (en) 2009-06-02 2016-04-19 Hsio Technologies, Llc Method of making an electronic interconnect
US9184527B2 (en) 2009-06-02 2015-11-10 Hsio Technologies, Llc Electrical connector insulator housing
US9196980B2 (en) 2009-06-02 2015-11-24 Hsio Technologies, Llc High performance surface mount electrical interconnect with external biased normal force loading
US8610265B2 (en) 2009-06-02 2013-12-17 Hsio Technologies, Llc Compliant core peripheral lead semiconductor test socket
WO2010147782A1 (en) 2009-06-16 2010-12-23 Hsio Technologies, Llc Simulated wirebond semiconductor package
US9320144B2 (en) 2009-06-17 2016-04-19 Hsio Technologies, Llc Method of forming a semiconductor socket
US8480066B2 (en) * 2009-08-24 2013-07-09 Ronald E. Anderson Head gimbal assembly alignment with compliant alignment pin
US8123572B2 (en) * 2010-04-02 2012-02-28 Tyco Electronics Corporation Electrical components having a contact configured to engage a via of a circuit board
US9350093B2 (en) 2010-06-03 2016-05-24 Hsio Technologies, Llc Selective metalization of electrical connector or socket housing
WO2014011228A1 (en) * 2012-07-10 2014-01-16 Hsio Technologies, Llc High speed circuit assembly with integral terminal and mating bias loading electrical connector assembly
US9689897B2 (en) * 2010-06-03 2017-06-27 Hsio Technologies, Llc Performance enhanced semiconductor socket
US8758067B2 (en) 2010-06-03 2014-06-24 Hsio Technologies, Llc Selective metalization of electrical connector or socket housing
US10159154B2 (en) 2010-06-03 2018-12-18 Hsio Technologies, Llc Fusion bonded liquid crystal polymer circuit structure
US9007082B2 (en) 2010-09-07 2015-04-14 Johnstech International Corporation Electrically conductive pins for microcircuit tester
TWI534432B (en) 2010-09-07 2016-05-21 瓊斯科技國際公司 Electrically conductive pins for microcircuit tester
CN102185233B (en) * 2011-02-22 2014-09-10 中兴通讯股份有限公司 Rotatable USB (Universal Serial Bus) interface equipment
US20130075568A1 (en) 2011-09-22 2013-03-28 BOT Research, LLC Holder for semiconductor wafers and flat substrates
TWI483489B (en) * 2012-03-07 2015-05-01 Hon Hai Prec Ind Co Ltd Electrical connector and assembly thereof
US9761520B2 (en) 2012-07-10 2017-09-12 Hsio Technologies, Llc Method of making an electrical connector having electrodeposited terminals
US10667410B2 (en) 2013-07-11 2020-05-26 Hsio Technologies, Llc Method of making a fusion bonded circuit structure
US10506722B2 (en) 2013-07-11 2019-12-10 Hsio Technologies, Llc Fusion bonded liquid crystal polymer electrical circuit structure
CN203942062U (en) * 2014-02-27 2014-11-12 番禺得意精密电子工业有限公司 Electric connector
US9847286B2 (en) 2014-04-18 2017-12-19 Halliburton Energy Services, Inc. High-temperature cycling BGA packaging
US9577375B2 (en) * 2014-08-29 2017-02-21 Advanced Interconnections Corp. Connector alignment assembly
US9755335B2 (en) 2015-03-18 2017-09-05 Hsio Technologies, Llc Low profile electrical interconnect with fusion bonded contact retention and solder wick reduction
US9774117B1 (en) * 2016-03-22 2017-09-26 Northrop Grumman Systems Corporation Resilient miniature mechanical support that can also serve as an electrical connector
US11089689B2 (en) * 2016-04-02 2021-08-10 Intel Corporation Fine feature formation techniques for printed circuit boards
CN206364218U (en) * 2016-12-20 2017-07-28 番禺得意精密电子工业有限公司 Electric connector
CN107202272B (en) * 2017-04-19 2023-07-07 赛尔富电子有限公司 Goods shelf electricity taking head and goods shelf electricity taking system thereof
SG11202108353UA (en) * 2019-02-22 2021-08-30 Amphenol Intercon Systems Inc Interposer assembly and method
US20230208058A1 (en) * 2021-12-28 2023-06-29 TE Connectivity Services Gmbh Socket connector

Family Cites Families (124)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2231347A (en) 1938-01-11 1941-02-11 Scovill Manufacturing Co Method of forming electric plug connectors
US2980881A (en) 1958-04-14 1961-04-18 United Carr Fastener Corp Connector and snap-in contact therefor
US3320658A (en) 1964-06-26 1967-05-23 Ibm Method of making electrical connectors and connections
DE1665757B2 (en) 1966-09-26 1972-07-13 Siemens AG, 1000 Berlin u. 8000 München CONNECTORS FOR PRINTED CIRCUITS
US3719981A (en) 1971-11-24 1973-03-13 Rca Corp Method of joining solder balls to solder bumps
GB1434833A (en) 1972-06-02 1976-05-05 Siemens Ag Solder carrying electrical connector wires
US3864004A (en) 1972-11-30 1975-02-04 Du Pont Circuit board socket
US3865462A (en) 1973-03-07 1975-02-11 Amp Inc Preloaded contact and latchable housing assembly
US3838382A (en) 1973-07-13 1974-09-24 Itt Retention system for electrical contacts
US3989331A (en) * 1974-08-21 1976-11-02 Augat, Inc. Dual-in-line socket
JPS5535238B2 (en) 1975-01-24 1980-09-12
US4140361A (en) 1975-06-06 1979-02-20 Sochor Jerzy R Flat receptacle contact for extremely high density mounting
US4054354A (en) 1975-10-01 1977-10-18 E. I. Du Pont De Nemours And Company Connector housing
US4056302A (en) 1976-06-04 1977-11-01 International Business Machines Corporation Electrical connection structure and method
JPS587187B2 (en) * 1976-09-29 1983-02-08 日本ペイント株式会社 Serum or plasma separation
US4274700A (en) 1977-10-12 1981-06-23 Bunker Ramo Corporation Low cost electrical connector
CH628484A5 (en) 1978-04-21 1982-02-26 Erni & Co Elektro Ind METHOD AND CONTACT BAR FOR THE PRODUCTION OF GAS-TIGHT CONNECTIONS FOR PRINTED BACKWALL WIRING.
US4396140A (en) 1981-01-27 1983-08-02 Bell Telephone Laboratories, Incorporated Method of bonding electronic components
US4802862A (en) 1981-03-30 1989-02-07 North American Specialties Corporation Solderable electrical contact
US4395086A (en) 1981-04-20 1983-07-26 The Bendix Corporation Electrical contact for electrical connector assembly
DE3173078D1 (en) 1981-12-29 1986-01-09 Ibm Soldering method of pins to eyelets of conductors formed on a ceramic substrate
US4380518A (en) 1982-01-04 1983-04-19 Western Electric Company, Inc. Method of producing solder spheres
US4482937A (en) 1982-09-30 1984-11-13 Control Data Corporation Board to board interconnect structure
US4664309A (en) 1983-06-30 1987-05-12 Raychem Corporation Chip mounting device
US4705205A (en) 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
US4602830A (en) 1984-09-20 1986-07-29 Amp Incorporated Double row electrical connector
US4678250A (en) 1985-01-08 1987-07-07 Methode Electronics, Inc. Multi-pin electrical header
US4655517A (en) 1985-02-15 1987-04-07 Crane Electronics, Inc. Electrical connector
US4884335A (en) 1985-06-21 1989-12-05 Minnesota Mining And Manufacturing Company Surface mount compatible connector system with solder strip and mounting connector to PCB
US4641426A (en) 1985-06-21 1987-02-10 Associated Enterprises, Inc. Surface mount compatible connector system with mechanical integrity
US4767344A (en) 1986-08-22 1988-08-30 Burndy Corporation Solder mounting of electrical contacts
EP0263222B1 (en) 1986-10-08 1992-03-25 International Business Machines Corporation Method of forming solder terminals for a pinless ceramic module
US4722470A (en) 1986-12-01 1988-02-02 International Business Machines Corporation Method and transfer plate for applying solder to component leads
JPH0795554B2 (en) 1987-09-14 1995-10-11 株式会社日立製作所 Solder ball alignment device
FR2634319B1 (en) 1988-07-13 1990-09-07 Europ Composants Electron METHOD FOR WELDING EXTERNAL CONNECTION WIRES TO AN ELECTRONIC COMPONENT
US4904212A (en) 1988-08-31 1990-02-27 Amp Incorporated Electrical connector assembly
US5024372A (en) 1989-01-03 1991-06-18 Motorola, Inc. Method of making high density solder bumps and a substrate socket for high density solder bumps
US5098311A (en) 1989-06-12 1992-03-24 Ohio Associated Enterprises, Inc. Hermaphroditic interconnect system
US5044992A (en) 1989-10-20 1991-09-03 The Charles Stark Draper Laboratory Printed circuit injection molded connector with removable bifurcated contacts capable of high temperature exposure
JP2590450B2 (en) 1990-02-05 1997-03-12 株式会社村田製作所 Method of forming bump electrode
US5060844A (en) 1990-07-18 1991-10-29 International Business Machines Corporation Interconnection structure and test method
US5111991A (en) 1990-10-22 1992-05-12 Motorola, Inc. Method of soldering components to printed circuit boards
US5145104A (en) 1991-03-21 1992-09-08 International Business Machines Corporation Substrate soldering in a reducing atmosphere
US5350292A (en) 1991-04-04 1994-09-27 Magnetek Electrical half connector with contact-centering vanes
US5131871A (en) 1991-04-16 1992-07-21 Molex Incorporated Universal contact pin electrical connector
US5118027A (en) 1991-04-24 1992-06-02 International Business Machines Corporation Method of aligning and mounting solder balls to a substrate
US5199885A (en) 1991-04-26 1993-04-06 Amp Incorporated Electrical connector having terminals which cooperate with an edge of a circuit board
US5167512A (en) 1991-07-05 1992-12-01 Walkup William B Multi-chip module connector element and system
US5120237A (en) 1991-07-22 1992-06-09 Fussell Don L Snap on cable connector
US5229016A (en) 1991-08-08 1993-07-20 Microfab Technologies, Inc. Method and apparatus for dispensing spherical-shaped quantities of liquid solder
US5203075A (en) 1991-08-12 1993-04-20 Inernational Business Machines Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders
US5261155A (en) 1991-08-12 1993-11-16 International Business Machines Corporation Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders
US5222649A (en) 1991-09-23 1993-06-29 International Business Machines Apparatus for soldering a semiconductor device to a circuitized substrate
US5207372A (en) 1991-09-23 1993-05-04 International Business Machines Method for soldering a semiconductor device to a circuitized substrate
US5255839A (en) 1992-01-02 1993-10-26 Motorola, Inc. Method for solder application and reflow
US5338208A (en) 1992-02-04 1994-08-16 International Business Machines Corporation High density electronic connector and method of assembly
GB9205088D0 (en) 1992-03-09 1992-04-22 Amp Holland Shielded back plane connector
US5269453A (en) 1992-04-02 1993-12-14 Motorola, Inc. Low temperature method for forming solder bump interconnections to a plated circuit trace
GB2269335A (en) 1992-08-04 1994-02-09 Ibm Solder particle deposition
US5284287A (en) 1992-08-31 1994-02-08 Motorola, Inc. Method for attaching conductive balls to a substrate
JP2532331B2 (en) 1992-11-09 1996-09-11 日本発条株式会社 Conductive contact
US5324569A (en) 1993-02-26 1994-06-28 Hewlett-Packard Company Composite transversely plastic interconnect for microchip carrier
US5489750A (en) 1993-03-11 1996-02-06 Matsushita Electric Industrial Co., Ltd. Method of mounting an electronic part with bumps on a circuit board
US5613882A (en) 1993-03-19 1997-03-25 The Whitaker Corporation Connector latch and polarizing structure
US5275330A (en) 1993-04-12 1994-01-04 International Business Machines Corp. Solder ball connect pad-on-via assembly process
US5355283A (en) 1993-04-14 1994-10-11 Amkor Electronics, Inc. Ball grid array with via interconnection
US5279028A (en) 1993-04-30 1994-01-18 The Whitaker Corporation Method of making a pin grid array and terminal for use therein
US5518410A (en) 1993-05-24 1996-05-21 Enplas Corporation Contact pin device for IC sockets
SG42943A1 (en) 1993-05-31 1997-10-17 Citizen Watch Co Ltd Solder ball supply device
US5358417A (en) 1993-08-27 1994-10-25 The Whitaker Corporation Surface mountable electrical connector
US5354218A (en) 1993-09-16 1994-10-11 Molex Incorporated Electrical connector with improved terminal latching means
US5346118A (en) 1993-09-28 1994-09-13 At&T Bell Laboratories Surface mount solder assembly of leadless integrated circuit packages to substrates
US5442852A (en) 1993-10-26 1995-08-22 Pacific Microelectronics Corporation Method of fabricating solder ball array
US5591941A (en) 1993-10-28 1997-01-07 International Business Machines Corporation Solder ball interconnected assembly
SG47417A1 (en) 1993-11-15 1998-04-17 Connector Systems Tech Nv Solderable connectors for high density electronic assemblies
US5772451A (en) * 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
JPH07142489A (en) 1993-11-17 1995-06-02 Matsushita Electric Ind Co Ltd Formation of bump
JP3008768B2 (en) 1994-01-11 2000-02-14 松下電器産業株式会社 Method of forming bump
US5495668A (en) 1994-01-13 1996-03-05 The Furukawa Electric Co., Ltd. Manufacturing method for a supermicro-connector
US5377902A (en) 1994-01-14 1995-01-03 Microfab Technologies, Inc. Method of making solder interconnection arrays
JPH07211381A (en) 1994-01-19 1995-08-11 Yazaki Corp Locking method and structure for double locking connector
US5395250A (en) 1994-01-21 1995-03-07 The Whitaker Corporation Low profile board to board connector
US5435482A (en) 1994-02-04 1995-07-25 Lsi Logic Corporation Integrated circuit having a coplanar solder ball contact array
US5431332A (en) 1994-02-07 1995-07-11 Motorola, Inc. Method and apparatus for solder sphere placement using an air knife
US5491303A (en) 1994-03-21 1996-02-13 Motorola, Inc. Surface mount interposer
US5498167A (en) 1994-04-13 1996-03-12 Molex Incorporated Board to board electrical connectors
JP3102259B2 (en) 1994-04-21 2000-10-23 株式会社村田製作所 High voltage connector
US5516030A (en) 1994-07-20 1996-05-14 Compaq Computer Corporation Method and apparatus for assembling ball grid array components on printed circuit boards by reflowing before placement
US5539153A (en) 1994-08-08 1996-07-23 Hewlett-Packard Company Method of bumping substrates by contained paste deposition
US5492266A (en) 1994-08-31 1996-02-20 International Business Machines Corporation Fine pitch solder deposits on printed circuit board process and product
US5519580A (en) 1994-09-09 1996-05-21 Intel Corporation Method of controlling solder ball size of BGA IC components
US5499487A (en) 1994-09-14 1996-03-19 Vanguard Automation, Inc. Method and apparatus for filling a ball grid array
US5542174A (en) 1994-09-15 1996-08-06 Intel Corporation Method and apparatus for forming solder balls and solder columns
US5462456A (en) 1994-10-11 1995-10-31 The Whitaker Corporation Contact retention device for an electrical connector
US5477933A (en) 1994-10-24 1995-12-26 At&T Corp. Electronic device interconnection techniques
US5593322A (en) 1995-01-17 1997-01-14 Dell Usa, L.P. Leadless high density connector
US5545051A (en) 1995-06-28 1996-08-13 The Whitaker Corporation Board to board matable assembly
US5580283A (en) 1995-09-08 1996-12-03 Molex Incorporated Electrical connector having terminal modules
US5702255A (en) 1995-11-03 1997-12-30 Advanced Interconnections Corporation Ball grid array socket assembly
US5746608A (en) * 1995-11-30 1998-05-05 Taylor; Attalee S. Surface mount socket for an electronic package, and contact for use therewith
US5643009A (en) 1996-02-26 1997-07-01 The Whitaker Corporation Electrical connector having a pivot lock
US5718607A (en) * 1996-03-01 1998-02-17 Molex Incorporated System for terminating the shield of a high speed cable
US5730606A (en) * 1996-04-02 1998-03-24 Aries Electronics, Inc. Universal production ball grid array socket
US5873742A (en) * 1996-06-18 1999-02-23 Hon Hai Precision Ind. Co., Ltd. Board-to-board connector assembly
US5947749A (en) * 1996-07-02 1999-09-07 Johnstech International Corporation Electrical interconnect contact system
US6042389A (en) * 1996-10-10 2000-03-28 Berg Technology, Inc. Low profile connector
US6042423A (en) * 1997-02-27 2000-03-28 The Whitaker Corporation Alignment adapters for post header
US6409521B1 (en) * 1997-05-06 2002-06-25 Gryphics, Inc. Multi-mode compliant connector and replaceable chip module utilizing the same
JP3924329B2 (en) * 1997-05-06 2007-06-06 グリフィクス インコーポレーティッド Multi-stage bending mode connector and replaceable chip module using the connector
US5913687A (en) * 1997-05-06 1999-06-22 Gryphics, Inc. Replacement chip module
US6394819B1 (en) * 1998-10-29 2002-05-28 The Whitaker Corporation Dielectric member for absorbing thermal expansion and contraction at electrical interfaces
TW395604U (en) * 1998-12-18 2000-06-21 Hon Hai Prec Ind Co Ltd Electrical connector
US6095842A (en) * 1999-04-19 2000-08-01 Hon Hai Precision Ind. Co., Ltd. Contact with dual compliant pin sections used in a ZIF socket
JP3396807B2 (en) * 1999-06-25 2003-04-14 京セラエルコ株式会社 Board relay connector
JP3413186B2 (en) * 2001-07-13 2003-06-03 モルデック株式会社 Connector and manufacturing method thereof
US6702594B2 (en) * 2001-12-14 2004-03-09 Hon Hai Precision Ind. Co., Ltd. Electrical contact for retaining solder preform
US6533590B1 (en) * 2001-12-17 2003-03-18 Hon Hai Precision Ind. Co., Ltd. Ball grid array connector having improved contact configuration
US6877992B2 (en) * 2002-11-01 2005-04-12 Airborn, Inc. Area array connector having stacked contacts for improved current carrying capacity
US6623284B1 (en) * 2003-01-07 2003-09-23 Hon Hai Precision Ind. Co., Ltd. Electrical connector
CN2598183Y (en) * 2003-01-29 2004-01-07 莫列斯公司 Conducting terminal and electric connector using same
CN2598184Y (en) * 2003-01-29 2004-01-07 莫列斯公司 Conducting terminal and electric connector using same
CN2598181Y (en) * 2003-01-29 2004-01-07 莫列斯公司 Conducting terminal and electric connector using same
US7040902B2 (en) * 2003-03-24 2006-05-09 Che-Yu Li & Company, Llc Electrical contact
US8328564B2 (en) * 2003-06-13 2012-12-11 Molex Incoporated Electrical connector solder terminal

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US7422439B2 (en) 2008-09-09
EP1834380A2 (en) 2007-09-19
US20080057753A1 (en) 2008-03-06
KR20070093063A (en) 2007-09-17
WO2006073998A3 (en) 2007-01-04
US7297003B2 (en) 2007-11-20
US20060035483A1 (en) 2006-02-16
WO2006073998A2 (en) 2006-07-13

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