WO2006069256A3 - Integrated thermal unit - Google Patents
Integrated thermal unit Download PDFInfo
- Publication number
- WO2006069256A3 WO2006069256A3 PCT/US2005/046637 US2005046637W WO2006069256A3 WO 2006069256 A3 WO2006069256 A3 WO 2006069256A3 US 2005046637 W US2005046637 W US 2005046637W WO 2006069256 A3 WO2006069256 A3 WO 2006069256A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- plate
- thermal unit
- integrated thermal
- bake plate
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67724—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations by means of a cart or a vehicule
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
- H05B1/0227—Applications
- H05B1/023—Industrial applications
- H05B1/0233—Industrial applications for semiconductors manufacturing
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007548478A JP2008526030A (en) | 2004-12-22 | 2005-12-21 | Integrated heat unit |
CN2005800485660A CN101443131B (en) | 2004-12-22 | 2005-12-21 | Integrated thermal unit |
Applications Claiming Priority (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US63910904P | 2004-12-22 | 2004-12-22 | |
US60/639,109 | 2004-12-22 | ||
US67401805P | 2005-04-21 | 2005-04-21 | |
US60/674,018 | 2005-04-21 | ||
US11/174,681 US7274005B2 (en) | 2004-12-22 | 2005-07-05 | Bake plate having engageable thermal mass |
US11/174,988 | 2005-07-05 | ||
US11/174,781 | 2005-07-05 | ||
US11/174,781 US7297906B2 (en) | 2004-12-22 | 2005-07-05 | Integrated thermal unit having a shuttle with two-axis movement |
US11/174,782 | 2005-07-05 | ||
US11/174,681 | 2005-07-05 | ||
US11/174,782 US7288746B2 (en) | 2004-12-22 | 2005-07-05 | Integrated thermal unit having laterally adjacent bake and chill plates on different planes |
US11/174,988 US7282675B2 (en) | 2004-12-22 | 2005-07-05 | Integrated thermal unit having a shuttle with a temperature controlled surface |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006069256A2 WO2006069256A2 (en) | 2006-06-29 |
WO2006069256A3 true WO2006069256A3 (en) | 2009-04-09 |
Family
ID=36602334
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/046637 WO2006069256A2 (en) | 2004-12-22 | 2005-12-21 | Integrated thermal unit |
Country Status (3)
Country | Link |
---|---|
JP (3) | JP2008526030A (en) |
KR (3) | KR101071004B1 (en) |
WO (1) | WO2006069256A2 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8636458B2 (en) * | 2007-06-06 | 2014-01-28 | Asml Netherlands B.V. | Integrated post-exposure bake track |
US20090308860A1 (en) * | 2008-06-11 | 2009-12-17 | Applied Materials, Inc. | Short thermal profile oven useful for screen printing |
JP5220505B2 (en) * | 2008-07-28 | 2013-06-26 | 株式会社Sokudo | Heat treatment apparatus and substrate processing apparatus |
JP5220517B2 (en) * | 2008-08-27 | 2013-06-26 | 株式会社Sokudo | Substrate processing equipment |
US8127713B2 (en) * | 2008-12-12 | 2012-03-06 | Sokudo Co., Ltd. | Multi-channel developer system |
JP2012253171A (en) * | 2011-06-02 | 2012-12-20 | Toppan Printing Co Ltd | Prebake apparatus and prebake method |
TWI424541B (en) * | 2011-07-15 | 2014-01-21 | Sokudo Co Ltd | Rapid temperature change system |
NL2009533A (en) * | 2011-10-27 | 2013-05-07 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
CN102645698B (en) * | 2012-01-09 | 2016-03-30 | 京东方科技集团股份有限公司 | Light guide plate mesh point, method for manufacturing light guide plate and backlight module, display device |
JP6964005B2 (en) * | 2018-01-09 | 2021-11-10 | 東京エレクトロン株式会社 | Heat treatment equipment, hot plate cooling method and computer-readable recording medium |
JP7403234B2 (en) * | 2019-04-25 | 2023-12-22 | 東京エレクトロン株式会社 | Substrate processing equipment and substrate processing method |
US20230161260A1 (en) * | 2021-11-24 | 2023-05-25 | Applied Materials, Inc. | Chamber and methods of cooling a substrate after baking |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5651823A (en) * | 1993-07-16 | 1997-07-29 | Semiconductor Systems, Inc. | Clustered photolithography system |
US6499777B1 (en) * | 1999-05-11 | 2002-12-31 | Matrix Integrated Systems, Inc. | End-effector with integrated cooling mechanism |
US6515731B1 (en) * | 1999-05-06 | 2003-02-04 | Tokyo Electron Limited | Substrate processing apparatus and substrate processing method |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3556882B2 (en) * | 2000-05-10 | 2004-08-25 | 東京エレクトロン株式会社 | Coating and development processing system |
-
2005
- 2005-12-21 KR KR1020077019639A patent/KR101071004B1/en active IP Right Grant
- 2005-12-21 KR KR1020077016811A patent/KR20070087682A/en not_active Application Discontinuation
- 2005-12-21 JP JP2007548478A patent/JP2008526030A/en active Pending
- 2005-12-21 WO PCT/US2005/046637 patent/WO2006069256A2/en active Application Filing
- 2005-12-21 KR KR1020077019641A patent/KR101068328B1/en active IP Right Grant
-
2007
- 2007-08-23 JP JP2007217582A patent/JP2008141163A/en active Pending
- 2007-08-23 JP JP2007217581A patent/JP2008135702A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5651823A (en) * | 1993-07-16 | 1997-07-29 | Semiconductor Systems, Inc. | Clustered photolithography system |
US6515731B1 (en) * | 1999-05-06 | 2003-02-04 | Tokyo Electron Limited | Substrate processing apparatus and substrate processing method |
US6499777B1 (en) * | 1999-05-11 | 2002-12-31 | Matrix Integrated Systems, Inc. | End-effector with integrated cooling mechanism |
Also Published As
Publication number | Publication date |
---|---|
JP2008526030A (en) | 2008-07-17 |
KR20070092332A (en) | 2007-09-12 |
JP2008135702A (en) | 2008-06-12 |
KR20070087682A (en) | 2007-08-28 |
KR20070092331A (en) | 2007-09-12 |
KR101068328B1 (en) | 2011-09-28 |
JP2008141163A (en) | 2008-06-19 |
WO2006069256A2 (en) | 2006-06-29 |
KR101071004B1 (en) | 2011-10-06 |
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