WO2006068939A3 - Remote test facility with wireless interface to local test facilities - Google Patents

Remote test facility with wireless interface to local test facilities Download PDF

Info

Publication number
WO2006068939A3
WO2006068939A3 PCT/US2005/045611 US2005045611W WO2006068939A3 WO 2006068939 A3 WO2006068939 A3 WO 2006068939A3 US 2005045611 W US2005045611 W US 2005045611W WO 2006068939 A3 WO2006068939 A3 WO 2006068939A3
Authority
WO
WIPO (PCT)
Prior art keywords
test
facility
electronic devices
local
central
Prior art date
Application number
PCT/US2005/045611
Other languages
French (fr)
Other versions
WO2006068939A2 (en
Inventor
Igor Y Khandros
Benjamin N Eldridge
Original Assignee
Formfactor Inc
Igor Y Khandros
Benjamin N Eldridge
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formfactor Inc, Igor Y Khandros, Benjamin N Eldridge filed Critical Formfactor Inc
Priority to JP2007546938A priority Critical patent/JP5355894B2/en
Priority to KR1020077015952A priority patent/KR101238601B1/en
Priority to EP05854353A priority patent/EP1836504A4/en
Publication of WO2006068939A2 publication Critical patent/WO2006068939A2/en
Publication of WO2006068939A3 publication Critical patent/WO2006068939A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/319—Tester hardware, i.e. output processing circuits
    • G01R31/31903—Tester hardware, i.e. output processing circuits tester configuration
    • G01R31/31907—Modular tester, e.g. controlling and coordinating instruments in a bus based architecture
    • G—PHYSICS
    • G08—SIGNALLING
    • G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
    • G08C17/02—Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/3025—Wireless interface with the DUT

Abstract

A central test facility transmits wirelessly test data to a local test facility, which tests electronic devices using the test data. The local test facility transmits wirelessly response data generated by the electronic devices back to the central test facility, which analyzes the response data to determine which electronic devices passed the testing. The central test facility may provide the results of the testing to other entities, such as a design facility where the electronic devices were designed or a manufacturing facility where the electronic devices where manufactured. The central test facility may accept requests for test resources from any of a number of local test facilities, schedule test times corresponding to each test request, and at a scheduled test time, wirelessly transmits test data to a corresponding local test facility.
PCT/US2005/045611 2004-12-21 2005-12-15 Remote test facility with wireless interface to local test facilities WO2006068939A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007546938A JP5355894B2 (en) 2004-12-21 2005-12-15 Remote test facility with wireless interface to local test facility
KR1020077015952A KR101238601B1 (en) 2004-12-21 2005-12-15 Remote test facility with wireless interface to local test facilities
EP05854353A EP1836504A4 (en) 2004-12-21 2005-12-15 Remote test facility with wireless interface to local test facilities

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/905,199 US7253651B2 (en) 2004-12-21 2004-12-21 Remote test facility with wireless interface to local test facilities
US10/905,199 2004-12-21

Publications (2)

Publication Number Publication Date
WO2006068939A2 WO2006068939A2 (en) 2006-06-29
WO2006068939A3 true WO2006068939A3 (en) 2006-12-28

Family

ID=36594864

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/045611 WO2006068939A2 (en) 2004-12-21 2005-12-15 Remote test facility with wireless interface to local test facilities

Country Status (7)

Country Link
US (3) US7253651B2 (en)
EP (1) EP1836504A4 (en)
JP (1) JP5355894B2 (en)
KR (1) KR101238601B1 (en)
CN (1) CN101080642A (en)
TW (1) TWI403736B (en)
WO (1) WO2006068939A2 (en)

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US7253651B2 (en) 2004-12-21 2007-08-07 Formfactor, Inc. Remote test facility with wireless interface to local test facilities
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TWM358407U (en) * 2008-12-31 2009-06-01 Princeton Technology Corp Semiconductor device test system of network monitoring
TWI416117B (en) * 2009-10-28 2013-11-21 Mpi Corp Probe card
US8458526B2 (en) * 2009-12-23 2013-06-04 Western Digital Technologies, Inc. Data storage device tester
US8626463B2 (en) * 2009-12-23 2014-01-07 Western Digital Technologies, Inc. Data storage device tester
US10409698B2 (en) * 2010-04-09 2019-09-10 Advantest Corporation Method and automatic test equipment for performing a plurality of tests of a device under test
JP2014515095A (en) 2011-03-16 2014-06-26 フォームファクター， インコーポレイテッド Wireless probe card verification system and method
EP3264271B1 (en) 2012-02-07 2020-09-09 Mts Systems Corporation Mobile or cloud communication platform for test system applications, mobile application tool and graphical user interface
US8774729B2 (en) * 2012-05-02 2014-07-08 Litepoint Corporation System and method for synchronized triggering of test equipment for testing MIMO transceivers
TW201419776A (en) * 2012-11-09 2014-05-16 Askey Computer Corp Signal detection method for communication apparatus and signal detection system
CN105593826B (en) * 2013-09-30 2019-11-19 Mts系统公司 A kind of method for the test that long-range monitoring executes in a test device and calculate equipment
CN103701664A (en) * 2013-12-25 2014-04-02 北京航天测控技术有限公司 Method for testing runtime of equipment and testing server
KR102581480B1 (en) * 2016-07-27 2023-09-21 삼성전자주식회사 Test board and test system for semiconductor package, method of manufacturing semiconductor package
WO2019113465A1 (en) 2017-12-07 2019-06-13 Mts Systems Corporation Integrated machine information management with application interactive user interface
GB2581861B (en) * 2018-09-14 2022-10-05 Sino Ic Tech Co Ltd IC Test Information Management System Based on Industrial Internet
CN113589125A (en) * 2021-07-28 2021-11-02 苏州赛迈测控技术有限公司 Remote test system and method for separating radio frequency signal acquisition and measurement

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US20050193294A1 (en) * 2004-03-01 2005-09-01 Hildebrant Andrew S. Wireless no-touch testing of integrated circuits

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Also Published As

Publication number Publication date
US20060132161A1 (en) 2006-06-22
JP2008524595A (en) 2008-07-10
TWI403736B (en) 2013-08-01
EP1836504A2 (en) 2007-09-26
US20070271071A1 (en) 2007-11-22
CN101080642A (en) 2007-11-28
JP5355894B2 (en) 2013-11-27
US7253651B2 (en) 2007-08-07
KR101238601B1 (en) 2013-02-28
WO2006068939A2 (en) 2006-06-29
TW200636265A (en) 2006-10-16
US7613591B2 (en) 2009-11-03
KR20070089853A (en) 2007-09-03
EP1836504A4 (en) 2011-12-07
US20100049356A1 (en) 2010-02-25
US7920989B2 (en) 2011-04-05

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