WO2006065580A3 - Wafer support apparatus for electroplating process and method for using the same - Google Patents
Wafer support apparatus for electroplating process and method for using the same Download PDFInfo
- Publication number
- WO2006065580A3 WO2006065580A3 PCT/US2005/044047 US2005044047W WO2006065580A3 WO 2006065580 A3 WO2006065580 A3 WO 2006065580A3 US 2005044047 W US2005044047 W US 2005044047W WO 2006065580 A3 WO2006065580 A3 WO 2006065580A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- film layer
- wafer
- top film
- support apparatus
- wafer support
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05848890A EP1838905A2 (en) | 2004-12-15 | 2005-12-05 | Wafer support apparatus for electroplating process and method for using the same |
CN2005800483326A CN101443485B (en) | 2004-12-15 | 2005-12-05 | Wafer support apparatus for electroplating process and method for using the same |
JP2007546741A JP5238261B2 (en) | 2004-12-15 | 2005-12-05 | Wafer support apparatus for electroplating and method of using the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/014,527 | 2004-12-15 | ||
US11/014,527 US7566390B2 (en) | 2004-12-15 | 2004-12-15 | Wafer support apparatus for electroplating process and method for using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006065580A2 WO2006065580A2 (en) | 2006-06-22 |
WO2006065580A3 true WO2006065580A3 (en) | 2008-11-13 |
Family
ID=36582511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/044047 WO2006065580A2 (en) | 2004-12-15 | 2005-12-05 | Wafer support apparatus for electroplating process and method for using the same |
Country Status (9)
Country | Link |
---|---|
US (2) | US7566390B2 (en) |
EP (1) | EP1838905A2 (en) |
JP (1) | JP5238261B2 (en) |
KR (1) | KR100964132B1 (en) |
CN (1) | CN101443485B (en) |
MY (1) | MY147737A (en) |
SG (1) | SG158117A1 (en) |
TW (1) | TWI285928B (en) |
WO (1) | WO2006065580A2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007022016B3 (en) * | 2007-04-26 | 2008-09-11 | Ramgraber Gmbh | Galvanizing assembly holds flat wafers or other substrate by Bernoulli chuck during treatment |
CN101348928B (en) | 2007-07-20 | 2012-07-04 | 罗门哈斯电子材料有限公司 | High speed method for plating palladium and palladium alloys |
US8188575B2 (en) * | 2010-10-05 | 2012-05-29 | Skyworks Solutions, Inc. | Apparatus and method for uniform metal plating |
US20130306465A1 (en) * | 2012-05-17 | 2013-11-21 | Applied Materials, Inc. | Seal rings in electrochemical processors |
US9689084B2 (en) | 2014-05-22 | 2017-06-27 | Globalfounries Inc. | Electrodeposition systems and methods that minimize anode and/or plating solution degradation |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5522975A (en) * | 1995-05-16 | 1996-06-04 | International Business Machines Corporation | Electroplating workpiece fixture |
US6090711A (en) * | 1997-09-30 | 2000-07-18 | Semitool, Inc. | Methods for controlling semiconductor workpiece surface exposure to processing liquids |
US6143155A (en) * | 1998-06-11 | 2000-11-07 | Speedfam Ipec Corp. | Method for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipiolar electrode assembly |
US6375823B1 (en) * | 1999-02-10 | 2002-04-23 | Kabushiki Kaisha Toshiba | Plating method and plating apparatus |
US6495005B1 (en) * | 2000-05-01 | 2002-12-17 | International Business Machines Corporation | Electroplating apparatus |
US6527925B1 (en) * | 1998-07-10 | 2003-03-04 | Semitool, Inc. | Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
US20040020781A1 (en) * | 1998-04-21 | 2004-02-05 | Applied Materials, Inc. | Electro-chemical deposition cell for face-up processing of single semiconductor substrates |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02101189A (en) * | 1988-10-05 | 1990-04-12 | L Daburu Ii:Kk | Method and device for precise electroplating |
JPH02153089A (en) * | 1988-12-02 | 1990-06-12 | Hitachi Cable Ltd | Method and device for producing stripe-plated strip |
JPH0536698A (en) * | 1991-07-31 | 1993-02-12 | Matsushita Electron Corp | Jig for plating wafer |
JPH10251895A (en) * | 1997-03-11 | 1998-09-22 | Dainippon Printing Co Ltd | Device for partially plating lead frame and partial plating method |
CN1272956A (en) * | 1997-09-30 | 2000-11-08 | 塞米图尔公司 | Apparatus and methods for controlling workpiece surface exposure to processing liquids during fabrication of microelectronic components |
US6488040B1 (en) * | 2000-06-30 | 2002-12-03 | Lam Research Corporation | Capillary proximity heads for single wafer cleaning and drying |
US7153400B2 (en) * | 2002-09-30 | 2006-12-26 | Lam Research Corporation | Apparatus and method for depositing and planarizing thin films of semiconductor wafers |
US7093375B2 (en) * | 2002-09-30 | 2006-08-22 | Lam Research Corporation | Apparatus and method for utilizing a meniscus in substrate processing |
US7704367B2 (en) * | 2004-06-28 | 2010-04-27 | Lam Research Corporation | Method and apparatus for plating semiconductor wafers |
US20070082299A1 (en) * | 2005-10-11 | 2007-04-12 | Lam Research Corp. | Methods and apparatus for fabricating conductive features on glass substrates used in liquid crystal displays |
-
2004
- 2004-12-15 US US11/014,527 patent/US7566390B2/en active Active
-
2005
- 2005-12-05 SG SG200908144-9A patent/SG158117A1/en unknown
- 2005-12-05 EP EP05848890A patent/EP1838905A2/en not_active Withdrawn
- 2005-12-05 WO PCT/US2005/044047 patent/WO2006065580A2/en active Search and Examination
- 2005-12-05 JP JP2007546741A patent/JP5238261B2/en not_active Expired - Fee Related
- 2005-12-05 KR KR1020077015993A patent/KR100964132B1/en not_active IP Right Cessation
- 2005-12-05 CN CN2005800483326A patent/CN101443485B/en not_active Expired - Fee Related
- 2005-12-12 MY MYPI20055818A patent/MY147737A/en unknown
- 2005-12-15 TW TW094144451A patent/TWI285928B/en not_active IP Right Cessation
-
2009
- 2009-06-23 US US12/490,239 patent/US7828951B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5522975A (en) * | 1995-05-16 | 1996-06-04 | International Business Machines Corporation | Electroplating workpiece fixture |
US6090711A (en) * | 1997-09-30 | 2000-07-18 | Semitool, Inc. | Methods for controlling semiconductor workpiece surface exposure to processing liquids |
US20040020781A1 (en) * | 1998-04-21 | 2004-02-05 | Applied Materials, Inc. | Electro-chemical deposition cell for face-up processing of single semiconductor substrates |
US6143155A (en) * | 1998-06-11 | 2000-11-07 | Speedfam Ipec Corp. | Method for simultaneous non-contact electrochemical plating and planarizing of semiconductor wafers using a bipiolar electrode assembly |
US6527925B1 (en) * | 1998-07-10 | 2003-03-04 | Semitool, Inc. | Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces |
US6375823B1 (en) * | 1999-02-10 | 2002-04-23 | Kabushiki Kaisha Toshiba | Plating method and plating apparatus |
US6495005B1 (en) * | 2000-05-01 | 2002-12-17 | International Business Machines Corporation | Electroplating apparatus |
Also Published As
Publication number | Publication date |
---|---|
WO2006065580A2 (en) | 2006-06-22 |
US20090260992A1 (en) | 2009-10-22 |
SG158117A1 (en) | 2010-01-29 |
KR100964132B1 (en) | 2010-06-16 |
TW200633068A (en) | 2006-09-16 |
JP5238261B2 (en) | 2013-07-17 |
KR20070088787A (en) | 2007-08-29 |
US7828951B2 (en) | 2010-11-09 |
CN101443485A (en) | 2009-05-27 |
TWI285928B (en) | 2007-08-21 |
MY147737A (en) | 2013-01-15 |
EP1838905A2 (en) | 2007-10-03 |
JP2008524847A (en) | 2008-07-10 |
US20060124451A1 (en) | 2006-06-15 |
US7566390B2 (en) | 2009-07-28 |
CN101443485B (en) | 2011-03-30 |
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