WO2006056473A3 - Improved matched-impedance surface-mount technology footprints - Google Patents

Improved matched-impedance surface-mount technology footprints Download PDF

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Publication number
WO2006056473A3
WO2006056473A3 PCT/EP2005/012691 EP2005012691W WO2006056473A3 WO 2006056473 A3 WO2006056473 A3 WO 2006056473A3 EP 2005012691 W EP2005012691 W EP 2005012691W WO 2006056473 A3 WO2006056473 A3 WO 2006056473A3
Authority
WO
WIPO (PCT)
Prior art keywords
impedance
arrangement
vias
routing density
talk
Prior art date
Application number
PCT/EP2005/012691
Other languages
French (fr)
Other versions
WO2006056473A2 (en
Inventor
Danny Morlion
Stefaan Hendrik Jozef Sercu
Winnie Heyvaert
Geest Jan De
Original Assignee
Framatome Connectors Int
Danny Morlion
Stefaan Hendrik Jozef Sercu
Winnie Heyvaert
Geest Jan De
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Framatome Connectors Int, Danny Morlion, Stefaan Hendrik Jozef Sercu, Winnie Heyvaert, Geest Jan De filed Critical Framatome Connectors Int
Priority to EP05823915A priority Critical patent/EP1839466A2/en
Priority to CN2005800473019A priority patent/CN101112135B/en
Publication of WO2006056473A2 publication Critical patent/WO2006056473A2/en
Publication of WO2006056473A3 publication Critical patent/WO2006056473A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6461—Means for preventing cross-talk
    • H01R13/6471—Means for preventing cross-talk by special arrangement of ground and signal conductors, e.g. GSGS [Ground-Signal-Ground-Signal]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/646—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00 specially adapted for high-frequency, e.g. structures providing an impedance match or phase match
    • H01R13/6473—Impedance matching
    • H01R13/6477—Impedance matching by variation of dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09163—Slotted edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/0919—Exposing inner circuit layers or metal planes at the side edge of the PCB or at the walls of large holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB

Abstract

Disclosed are methodologies for defining matched-impedance surface-mount technology footprints on a substrate such as a printed circuit board, for example, that is adapted to receive an electrical component having an arrangement of terminal leads. Such a footprint may include an arrangement of electrically-conductive pads (P) and an arrangement of electrically-conductive vias (V). The via arrangement may differ from the pad arrangement. The vias (V) may be arranged to increase routing density, while limiting cross-talk and providing for matched impedance between the component and the substrate. The via arrangement may be altered to achieve a desired routing density on a layer of the board. Increasing the routing density may decrease the number of board layers, which tends to decrease capacitance and thereby increase impedance. Ground vias (G) and signal vias (S) may be arranged with respect to one another in such a manner as to affect impedance. Thus, the via arrangement may be altered to achieve an impedance that matches the impedance of the component. The via arrangement may be also be altered to limit cross-talk among neighboring signal conductors. Thus, the via arrangement may be defined to balance the impedance, cross-talk, and routing density requirements of the system.
PCT/EP2005/012691 2004-11-29 2005-11-28 Improved matched-impedance surface-mount technology footprints WO2006056473A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP05823915A EP1839466A2 (en) 2004-11-29 2005-11-28 Improved matched-impedance surface-mount technology footprints
CN2005800473019A CN101112135B (en) 2004-11-29 2005-11-28 Improved matched-impedance surface-mount technology footprints

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US63149904P 2004-11-29 2004-11-29
US63154504P 2004-11-29 2004-11-29
US60/631,545 2004-11-29
US60/631,499 2004-11-29
US68651405P 2005-06-01 2005-06-01
US60/686,514 2005-06-01

Publications (2)

Publication Number Publication Date
WO2006056473A2 WO2006056473A2 (en) 2006-06-01
WO2006056473A3 true WO2006056473A3 (en) 2006-09-08

Family

ID=36217936

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2005/012691 WO2006056473A2 (en) 2004-11-29 2005-11-28 Improved matched-impedance surface-mount technology footprints

Country Status (3)

Country Link
EP (1) EP1839466A2 (en)
CN (5) CN101673885B (en)
WO (1) WO2006056473A2 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1916915A (en) * 2005-08-19 2007-02-21 鸿富锦精密工业（深圳）有限公司 Method for improving resistance of via hole
GB0709792D0 (en) * 2007-05-22 2007-06-27 Texas Instruments Ltd Optimization of organic packaging interconnect for gigabit signalling
CN101728351B (en) * 2008-10-16 2011-07-20 英业达股份有限公司 Layout of bonding pads
US8591257B2 (en) * 2011-11-17 2013-11-26 Amphenol Corporation Electrical connector having impedance matched intermediate connection points
EP2739125A1 (en) * 2012-11-28 2014-06-04 Tyco Electronics Svenska Holdings AB Electrical connection interface for connecting electrical leads for high speed data transmission
CN103857179A (en) * 2012-12-03 2014-06-11 泰科电子日本合同会社 PWB footprint section, PWB provided with PWB footprint section, and assembly of PWB and board to board connector
EP3084894B1 (en) * 2013-12-18 2021-02-17 Intel Corporation Ground routing device and method
EP3123619A4 (en) * 2014-03-24 2018-03-14 Sentinel Connector Systems Inc. Testing apparatus for a high speed cross over communications jack and methods of operating the same
CN105764232A (en) * 2014-12-17 2016-07-13 鸿富锦精密工业(武汉)有限公司 Printed circuit board and electronic device with application of printed circuit board
CN104822225B (en) * 2015-04-30 2018-03-13 华为技术有限公司 A kind of circuit board and printed circuit-board assembly
JP6594361B2 (en) * 2017-02-16 2019-10-23 株式会社ソニー・インタラクティブエンタテインメント Communication equipment
WO2019094549A1 (en) * 2017-11-08 2019-05-16 Amphenol Corporation Backplane footprint for high speed, high density electrical connectors
CN110474183B (en) * 2018-05-09 2020-11-20 陈松佑 Card edge connector and circuit board combination for memory module card
CN109587943A (en) * 2018-11-09 2019-04-05 加弘科技咨询(上海)有限公司 Zero anchoring wire of differential lines spreads cabling circuit board and electronic device altogether
CN109600933B (en) * 2018-11-28 2020-09-18 北京遥测技术研究所 Method for coating three-dimensional solder paste on inner conductor of coaxial electric connector and printed board pad
US11658080B2 (en) * 2020-10-29 2023-05-23 Hewlett Packard Enterprise Development Lp Methods and systems for transposition channel routing
CN117440595A (en) * 2022-09-27 2024-01-23 中兴智能科技南京有限公司 Differential arrangement structure and printed circuit board
CN115696737A (en) * 2022-11-01 2023-02-03 超聚变数字技术有限公司 Circuit board and computing device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4636919A (en) * 1985-03-20 1987-01-13 Hitachi, Ltd. Multilayer printed circuit board
US6150729A (en) * 1999-07-01 2000-11-21 Lsi Logic Corporation Routing density enhancement for semiconductor BGA packages and printed wiring boards
US6198635B1 (en) * 1999-05-18 2001-03-06 Vsli Technology, Inc. Interconnect layout pattern for integrated circuit packages and the like
US6232564B1 (en) * 1998-10-09 2001-05-15 International Business Machines Corporation Printed wiring board wireability enhancement
US6538213B1 (en) * 2000-02-18 2003-03-25 International Business Machines Corporation High density design for organic chip carriers
US20040216071A1 (en) * 2003-04-22 2004-10-28 Miller Leah M. Routing structure for transceiver core
WO2006053891A1 (en) * 2004-11-19 2006-05-26 Alcatel Lucent Off-width pitch for improved circuit card routing

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5784262A (en) * 1995-11-06 1998-07-21 Symbios, Inc. Arrangement of pads and through-holes for semiconductor packages
US6717825B2 (en) * 2002-01-18 2004-04-06 Fci Americas Technology, Inc. Electrical connection system for two printed circuit boards mounted on opposite sides of a mid-plane printed circuit board at angles to each other

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4636919A (en) * 1985-03-20 1987-01-13 Hitachi, Ltd. Multilayer printed circuit board
US6232564B1 (en) * 1998-10-09 2001-05-15 International Business Machines Corporation Printed wiring board wireability enhancement
US6198635B1 (en) * 1999-05-18 2001-03-06 Vsli Technology, Inc. Interconnect layout pattern for integrated circuit packages and the like
US6150729A (en) * 1999-07-01 2000-11-21 Lsi Logic Corporation Routing density enhancement for semiconductor BGA packages and printed wiring boards
US6538213B1 (en) * 2000-02-18 2003-03-25 International Business Machines Corporation High density design for organic chip carriers
US20040216071A1 (en) * 2003-04-22 2004-10-28 Miller Leah M. Routing structure for transceiver core
WO2006053891A1 (en) * 2004-11-19 2006-05-26 Alcatel Lucent Off-width pitch for improved circuit card routing

Also Published As

Publication number Publication date
WO2006056473A2 (en) 2006-06-01
CN101673887A (en) 2010-03-17
CN101112135B (en) 2010-12-29
CN101673885A (en) 2010-03-17
EP1839466A2 (en) 2007-10-03
CN101674707A (en) 2010-03-17
CN101673885B (en) 2012-07-18
CN101673886A (en) 2010-03-17
CN101673886B (en) 2012-07-25
CN101674707B (en) 2012-02-22
CN101112135A (en) 2008-01-23
CN101673887B (en) 2013-04-10

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