WO2006053030A3 - Power terminal for lga socket - Google Patents

Power terminal for lga socket Download PDF

Info

Publication number
WO2006053030A3
WO2006053030A3 PCT/US2005/040570 US2005040570W WO2006053030A3 WO 2006053030 A3 WO2006053030 A3 WO 2006053030A3 US 2005040570 W US2005040570 W US 2005040570W WO 2006053030 A3 WO2006053030 A3 WO 2006053030A3
Authority
WO
WIPO (PCT)
Prior art keywords
power
power terminal
lga
socket
lga socket
Prior art date
Application number
PCT/US2005/040570
Other languages
French (fr)
Other versions
WO2006053030A2 (en
Inventor
Kent E Regnier
Samuel C Ramey
Original Assignee
Molex Inc
Kent E Regnier
Samuel C Ramey
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc, Kent E Regnier, Samuel C Ramey filed Critical Molex Inc
Publication of WO2006053030A2 publication Critical patent/WO2006053030A2/en
Publication of WO2006053030A3 publication Critical patent/WO2006053030A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2435—Contacts for co-operating by abutting resilient; resiliently-mounted with opposite contact points, e.g. C beam

Abstract

A land grid array (LGA) socket for delivering power from a printed wiring board to a microprocessor chip, and power terminals for use in the LGA socket. The power terminals are such that they can interface with the standard array of contact pads on both the printed wiring board and the microprocessor chip, by using multiple contact pads per power terminal as compared to signal terminals that only use a single contact pad per signal terminal.
PCT/US2005/040570 2004-11-12 2005-11-10 Power terminal for lga socket WO2006053030A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US62777004P 2004-11-12 2004-11-12
US60/627,770 2004-11-12

Publications (2)

Publication Number Publication Date
WO2006053030A2 WO2006053030A2 (en) 2006-05-18
WO2006053030A3 true WO2006053030A3 (en) 2006-10-19

Family

ID=36060611

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/040570 WO2006053030A2 (en) 2004-11-12 2005-11-10 Power terminal for lga socket

Country Status (2)

Country Link
TW (1) TWI288501B (en)
WO (1) WO2006053030A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4843423B2 (en) * 2006-09-05 2011-12-21 アイティーティー マニュファクチャリング エンタープライジーズ， インコーポレイテッド Connector and contacts used for the connector

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1345240A (en) * 1971-07-14 1974-01-30 Plessey Co Ltd Electrical interconnection device
US5101553A (en) * 1991-04-29 1992-04-07 Microelectronics And Computer Technology Corporation Method of making a metal-on-elastomer pressure contact connector
US5749738A (en) * 1991-01-09 1998-05-12 Johnstech International Corporation Electrical interconnect contact system
US5999414A (en) * 1997-03-14 1999-12-07 California Institute Of Technology Physically separating printed circuit boards with a resilient, conductive contact
US6022248A (en) * 1997-09-04 2000-02-08 Hon Hai Precision Ind. Co., Ltd. Connecting terminal having enhanced biasing force
US20030207598A1 (en) * 2002-03-26 2003-11-06 Dishongh Terrance J. Ganged land grid array socket contacts for improved power delivery
US20030224663A1 (en) * 1995-02-07 2003-12-04 Johnstech International Corporation Apparatus for providing controlled impedance in an electrical contact
US20040087189A1 (en) * 2002-11-01 2004-05-06 Grant John L. Area array connector having stacked contacts for improved current carrying capacity

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1345240A (en) * 1971-07-14 1974-01-30 Plessey Co Ltd Electrical interconnection device
US5749738A (en) * 1991-01-09 1998-05-12 Johnstech International Corporation Electrical interconnect contact system
US5101553A (en) * 1991-04-29 1992-04-07 Microelectronics And Computer Technology Corporation Method of making a metal-on-elastomer pressure contact connector
US20030224663A1 (en) * 1995-02-07 2003-12-04 Johnstech International Corporation Apparatus for providing controlled impedance in an electrical contact
US5999414A (en) * 1997-03-14 1999-12-07 California Institute Of Technology Physically separating printed circuit boards with a resilient, conductive contact
US6022248A (en) * 1997-09-04 2000-02-08 Hon Hai Precision Ind. Co., Ltd. Connecting terminal having enhanced biasing force
US20030207598A1 (en) * 2002-03-26 2003-11-06 Dishongh Terrance J. Ganged land grid array socket contacts for improved power delivery
US20040087189A1 (en) * 2002-11-01 2004-05-06 Grant John L. Area array connector having stacked contacts for improved current carrying capacity

Also Published As

Publication number Publication date
TWI288501B (en) 2007-10-11
TW200631247A (en) 2006-09-01
WO2006053030A2 (en) 2006-05-18

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