WO2006047028A3 - Packaged device and method of forming same - Google Patents

Packaged device and method of forming same Download PDF

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Publication number
WO2006047028A3
WO2006047028A3 PCT/US2005/034261 US2005034261W WO2006047028A3 WO 2006047028 A3 WO2006047028 A3 WO 2006047028A3 US 2005034261 W US2005034261 W US 2005034261W WO 2006047028 A3 WO2006047028 A3 WO 2006047028A3
Authority
WO
WIPO (PCT)
Prior art keywords
balls
die
mold
platen
mold compound
Prior art date
Application number
PCT/US2005/034261
Other languages
French (fr)
Other versions
WO2006047028A2 (en
Inventor
Chee Seng Foong
Original Assignee
Freescale Semiconductor Inc
Chee Seng Foong
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from MYPI20044381A external-priority patent/MY136179A/en
Application filed by Freescale Semiconductor Inc, Chee Seng Foong filed Critical Freescale Semiconductor Inc
Publication of WO2006047028A2 publication Critical patent/WO2006047028A2/en
Publication of WO2006047028A3 publication Critical patent/WO2006047028A3/en

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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
    • H01L2924/18165—Exposing the passive side of the semiconductor or solid-state body of a wire bonded chip

Abstract

A method of packaging an integrated circuit die (12) includes the steps of loading an array of soft conductive balls (12) into recesses formed in a platen (50) and locating the platen (50) in a first part of a mold cavity. A second part of the mold is pressed against the balls (12) to flatten a surface of the balls. A first mold compound (18) then is injected into the mold cavity such that the mold compound (18) surrounds exposed portions of the balls (12). The balls are removed from the platen and a first side of an integrated circuit die (20) is attached to the balls (12). Die bonding pads (28) on a second side of the die are electrically connected to respective ones of the balls (12) surrounding the die (20), and then the die (20), the electrical connections (30), and a top portion of the conductive balls (12) is encapsulated with a second mold compound (24).
PCT/US2005/034261 2004-10-23 2005-09-27 Packaged device and method of forming same WO2006047028A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
MYPI20044381A MY136179A (en) 2004-10-23 2004-10-23 Packaged device and method of forming same
MYPI20044381 2004-10-23
US11/191,132 2005-07-27
US11/191,132 US7179682B2 (en) 2004-10-23 2005-07-27 Packaged device and method of forming same

Publications (2)

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WO2006047028A2 WO2006047028A2 (en) 2006-05-04
WO2006047028A3 true WO2006047028A3 (en) 2007-04-05

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WO2006047028A2 (en) 2006-05-04
US7285855B2 (en) 2007-10-23

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