WO2006039457A1 - Contoured cmp pad dresser and associated methods - Google Patents
Contoured cmp pad dresser and associated methods Download PDFInfo
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- WO2006039457A1 WO2006039457A1 PCT/US2005/035132 US2005035132W WO2006039457A1 WO 2006039457 A1 WO2006039457 A1 WO 2006039457A1 US 2005035132 W US2005035132 W US 2005035132W WO 2006039457 A1 WO2006039457 A1 WO 2006039457A1
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- WIPO (PCT)
- Prior art keywords
- particles
- cmp pad
- centrally located
- dresser
- located particles
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/02—Wheels in one piece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D2203/00—Tool surfaces formed with a pattern
Definitions
- the present invention relates generally to a device and methods for dressing or conditioning a chemical mechanical polishing (CMP) pad. Accordingly, the present invention involves the chemical and material science fields.
- CMP chemical mechanical polishing
- CMP chemical mechanical process
- the top of the pad holds the particles, usually by a mechanism such as fibers, or small pores, which provide a friction force sufficient to prevent the particles from being thrown off of the pad due to the centrifugal force exerted by the pad's spinning motion. Therefore, it is important to keep the top of the pad as flexible as possible, and to keep the fibers as erect as possible, or to assure that there are an abundance of openings and pores available to receive new abrasive particles.
- a problem with maintaining the top of the pad is caused by an accumulation of polishing debris coming from the work piece, abrasive slurry, and dressing disk.
- This accumulation causes a "glazing” or hardening of the top of the pad, and mats the fibers down, thus making the pad less able to hold the abrasive particles of the slurry, and significantly decreasing the pad's overall polishing performance.
- the pores used to hold the slurry become clogged, and the overall asperity of the pad's polishing surface becomes depressed and matted. Therefore, attempts have been made to revive the top of the pad by "combing” or "cutting” it with various devices. This process has come to be known as “dressing” or “conditioning" the CMP pad. Many types of devices and processes have been used for this purpose.
- One such device is a disk with a plurality of super hard crystalline particles, such as diamond particles attached to a surface, or substrate thereof.
- abrasive disks made by conventional methods exhibit several problems.
- Second, the production methods of the past tend to produce disks having abrasive particles that are clustered in unevenly spaced groups on the surface of the substrate. The resultant non-uniform spacing between particles causes some portions of the CMP pad to be overdressed which creates wear marks, while others are underdressed which creates glazing layers.
- Third, the abrasive particles of these disks are not configured to penetrate the pad to a uniform depth. This non-uniformity creates additional uneven dressing of the CMP pad.
- the CMP pad may tend to bulge or bubble in front of the initial leading edge of the dresser due to the downward force exerted by the dresser.
- Such bulging may cause a depression of the pad to occur as it passes under the remaining portion of the dresser, which may in turn, cause the remaining abrasive particles, especially those that are centrally located on the pad dresser to penetrate the pad less deeply or even skip over the pad entirely.
- This uneven work load on the dresser particles may cause the pad to be unevenly dressed, and may also cause the dresser to wear unevenly and become worn out prematurely.
- Yet another disadvantage with modern CMP pad dressers is reduced service life of the pad conditioner.
- the effectiveness and efficiency of the service of a CMP pad conditioner is determined by its number of working abrasive particles and the amount of work that is experienced by each particle. As noted above, the service life of a pad conditioner can be reduced by an uneven distribution of work load on the superabrasive particles. When a flexible CMP pad depresses under the pressure of a dresser excessive wear may occur on the leading edge crystals of the pad conditioner as they will bear the majority of the work load. Further, the centrally located abrasive particles are prevented from receiving an equal work load. This work load mismatch increases the wear rate on the leading edge particles and can cause the dresser to become unusable long before the exhaustion of the centrally located particles.
- the acids of the chemical slurry can quickly weaken the braze-particle bonds and dislodge the abrasive particles under the friction of pad dressing. Therefore, to minimize the exposure of the braze to the chemicals and extend the useful life of the pad dresser, the polishing processes must be halted while dressing occurs. The resultant sequence of alternating polishing and then dressing wastes time, and is inefficient.
- Warping of the pad dresser working surface during the brazing process also often causes abrasive particles to dislodge.
- the pad dresser must be exposed to very high temperatures. Exposure to this extreme heat can cause the working surface of the pad dresser to warp, thus compromising the smoothness and planarity of the pad dresser's working surface.
- the braze portion of the working surface will be rough, having high and low spots. Such spots are undesirable, as they may cause the braze to begin flaking off, and making micro-scratches on the polished surface of the work piece. Further, such unevenness may cause issues with further processing of the dresser, and abrasive particle retention.
- CMP pad dresser that is constructed and configured to achieve optimal dressing results, with maximized efficiency and lifespan continues to be sought.
- the present invention provides methods and CMP pad dresser configurations for increasing the work load on centrally located superabrasive particles in a CMP pad dresser during dressing of a CMP pad.
- a CMP pad dresser which has a plurality of superabrasive particles each coupled to a substrate member and held at specific locations in accordance with a predetermined pattern.
- the superabrasive particles can be configured in a pattern that reduces the penetration of peripherally located particles into the CMP pad and increases penetration of centrally located particles into the CMP pad, thus optimizing the work load placed on the centrally located superabrasive particles.
- the particles are of a super hard substance such as diamond, or cubic boron nitride (cBN), in either the single crystal or polycrystalline form.
- the method for increasing the work load on centrally located superabrasive particles includes the utilization of a CMP pad dresser having a substrate with superabrasive particles configured in a pattern that provides a slope from the working ends of the peripherally located particles upwardly to the working ends of the centrally located particles.
- the exact degree of slope employed can be configured to control the work load experienced by the centrally located particles.
- Such a slope can be created in various ways. For example, in one aspect, a slope can be created by disposing superabrasive particles on or in a substantially flat substrate, where the superabrasive particles increase in height above a working surface of the substrate from the peripherally located particles to the centrally located particles.
- the preferred degree of slope can be determined as a measure of pad velocity and pad flexibility.
- a method for increasing the work load on the centrally located particles may include providing a CMP pad dresser having a plurality of superabrasive particles coupled to a substrate in a pattern that places the peripherally located superabrasive particles at a higher density than the centrally located particles. It has been found that particles clustered in a higher density are unable to penetrate into the pad as deeply as those spaced farther apart from one another. Therefore, by varying densities of particles on the substrate work load can be transferred from one area to another.
- a method of increasing the work load on centrally located particles may be achieved by orienting the centrally located particles with an attitude that causes higher particle penetration into the CMP pad than penetration provided by an attitude of the peripherally located particles.
- the attitude of the centrally located particles can present an apex at the working end thereof, and the attitude of the peripherally located particles can present either a face or an edge at the working end thereof.
- the attitude of the centrally located particles can present an edge at the working end thereof, and the attitude of the peripherally located particles can present a face at the working end thereof.
- the present invention also includes methods for producing a CMP pad dresser that displays an increased work load on the centrally located superabrasive particles.
- a method includes the steps of: 1) providing a substrate; and 2) attaching a plurality of superabrasive particles on to the substrate in a pattern that reduces the penetration of peripherally located particles into the CMP pad and increases the penetration of the centrally located particles into the CMP pad.
- CMP pad dressers exhibiting considerable advantages may be created.
- the working surface of the CMP pad dresser may be configured to increase the contact of the CMP pad under a central portion of the dresser, rather than overly contacting an outside or "leading edge" thereof.
- Such increased central contact transfers a portion of the work load from the peripheral area of the dresser to the central area of the dresser, thus lengthening the service life of the dresser and allowing the dresser to more effectively cut into and groom the pad.
- CMP pad dressers that incorporate such configurations are encompassed by the present invention, including those with specific configurations made to support the methods recited above.
- FIG. 1 is a side view of a prior art CMP pad dresser employing an electroplating method for fixing the abrasive particles to the disk substrate in accordance with one embodiment of the present invention.
- FIG. 2 is a side view of a prior art CMP pad dresser made by using a traditional brazing method for fixing the abrasive particles to the disk substrate.
- FIG. 3 is a side view of a CMP pad dresser made in accordance with one embodiment of the present invention.
- FIG. 4 is a side view of a sheet of brazing alloy with a template for placing abrasive particles on the surface thereof in accordance with one embodiment of the present invention.
- FIG. 5 is a side view of a sheet of brazing alloy with a template on its surface, and abrasive particles filling the apertures of the template. A flat surface is shown for use in pressing the abrasive particles into the sheet of brazing alloy in accordance with one embodiment of the present invention.
- FIG. 6 is a side view of a sheet of brazing alloy having abrasive particles pressed into it in accordance with one embodiment of the present invention.
- FIG. 7 is a top view of the working surface of a CMP pad dresser having abrasive particles coupled to the substrate such that abrasive particles present substantially only along the leading edge of the dresser, in accordance with one embodiment of the present invention.
- FIG. 8 is a top view of the working surface of a CMP pad dresser having abrasive particles coupled to the substrate such that more of the particles are at the leading edge than at the center, in accordance with one embodiment of the present invention.
- FIG. 9 is a top view of the working surface of a CMP pad dresser having abrasive particles coupled to the substrate such that the particles are uniformly distributed throughout, in accordance with one embodiment of the present invention.
- FIG. 10 is a side view of a CMP pad dresser made in accordance with one embodiment of the present invention.
- FIG. 11 is a side view of a CMP pad dresser made in accordance with one embodiment of the present invention.
- abrasive particle or “grit,” or similar phrases mean any super hard crystalline, or polycrystalline substance, or mixture of substances and include but is not limited to diamond, polycrystalline diamond (PCD), cubic boron nitride, and polycrystalline cubic boron nitride (PCBN). Further, the terms “abrasive particle,” “grit,” “diamond,” “polycrystalline diamond (PCD),” “cubic boron nitride,” and “polycrystalline cubic boron nitride, (PCBN),” may be used interchangeably.
- substrate means a portion of a CMP dresser which supports abrasive particles, and to which abrasive particles may be affixed.
- Substrates useful in the present invention may be any shape, thickness, or material, that is capable of supporting abrasive particles in a manner that is sufficient provide a tool useful for its intended purpose.
- Substrates may be of a solid material, a powdered material that becomes solid when processed, or a flexible material. Examples of typical substrate materials include without limitation, metals, metal alloys, ceramics, and mixtures thereof. Further the substrate may include brazing alloy material.
- working surface means the surface of a CMP pad dresser that, during operation, faces toward, or comes in contact with a CMP pad.
- leading edge means the edge of a CMP pad dresser that is a frontal edge based on the direction that the CMP pad is moving, or the direction that the pad is moving, or both.
- the leading edge may be considered to encompass not only the area specifically at the edge of a dresser, but may also include portions of the dresser which extend slightly inward from the actual edge.
- the leading edge may be located along an outer edge of the CMP pad dresser.
- the CMP pad dresser may be configured with a pattern of abrasive particles that provides at least one effective leading edge on a central or inner portion of the CMP pad dresser working surface.
- a central or inner portion of the dresser may be configured to provide a functional effect similar to that of a leading edge on the outer edge of the dresser.
- “sharp portion” means any narrow portion to which a crystal may come, including but not limited to corners, ridges, edges, obelisks, and other protrusions.
- “centrally located particle” means any particle of a dresser that under normal dressing circumstances receives a reduced work load as compared to a peripherally located particle.
- “central” or “centrally located” refers to an area of a dresser that originates at a center point of the dresser and extends outwardly towards the dresser's edge for up to about 90% of the radius of the dresser. In some aspects, the area may extend outwardly from about 20% to about 90% of the radius. In other aspects, the area may extend out to about 50% of the radius. In yet another aspect, the area may extend out to about 33% of the radius of a dresser.
- peripheral means any particle of a dresser that under normal dressing circumstances that receives an excess work load as compared to the centrally located particles.
- “periphery” or “peripheral” or “peripherally located” may refer to an area that originates at the leading edge or outer rim of a dresser and extends inwardly towards the center for up to about 90% of the radius of the dresser. In some aspects, the area may extend inwardly from about 20% to 90% of the radius. In other aspects, the area may extend in to about 50% of the radius. In yet another aspect, the area may extend in to about 33% of the radius of a dresser (i.e. 66% away from the center).
- work load means the amount of work or force exerted on a particle in a dresser during use of the dresser.
- working end refers to an end of a particle which is oriented towards the CMP pad and during a dressing operation makes contact with the pad. Most often the working end of a particle will be distal from a substrate to which the particle is attached.
- amorphous braze refers to a homogenous braze composition having a non-crystalline structure. Such alloys contain substantially no eutectic phases that melt incongruently when heated. Although precise alloy composition is difficult to ensure, the amorphous brazing alloy as used herein should exhibit a substantially congruent melting behavior over a narrow temperature range.
- alloy refers to a solid or liquid mixture of a metal with a second material, said second material may be a non-metal, such as carbon, a metal, or an alloy which enhances or improves the properties of the metal.
- metal brazing alloy may be used interchangeably, and refer to a metal alloy which is capable of chemically bonding to superabrasive particles, and to a matrix support material, or substrate, so as to substantially bind the two together.
- the particular braze alloy components and compositions disclosed herein are not limited to the particular embodiment disclosed in conjunction therewith, but may be used in any of the embodiments of the present invention disclosed herein.
- brazing is intended to refer to the creation of chemical bonds between the carbon atoms of the superabrasive particles and the braze material.
- chemical bond means a covalent bond, such as a carbide or boride bond, rather than mechanical or weaker inter-atom attractive forces.
- “superabrasive particles” and “superabrasive grits” may be used interchangeably, and refer to particles of either natural or synthetic diamond, super hard crystalline, or polycrystalline substance, or mixture of substances and include but are not limited to diamond, polycrystalline diamond (PCD), cubic boron nitride (CBN), and polycrystalline cubic boron nitride (PCBN). Further, the terms “abrasive particle,” “grit,” “diamond,” “PCD,” “CBN,” and “PCBN,” may be used interchangeably.
- asperity refers to the roughness of a surface as assessed by various characteristics of the surface anatomy. Various measurements may be used as an indicator of surface asperity, such as height of peaks or projections thereon, and the depth of valleys or concavities depressing therein. Further, measures of asperity include the number of peaks or valleys within a given area of the surface (i.e. peak or valley density), and the distance between such peaks or valleys.
- ceramic refers to a hard, often crystalline, substantially heat and corrosion resistant material which may be made by firing a non-metallic material, sometimes with a metallic material.
- oxide, nitride, and carbide materials considered to be ceramic are well known in the art, including without limitation, aluminum oxides, silicon oxides, boron nitrides, silicon nitrides, and silicon carbides, tungsten carbides, etc.
- metal means any type of metal, metal alloy, or mixture thereof, and specifically includes but is not limited to steel, iron, and stainless steel.
- grid means a pattern of lines forming multiple squares.
- uniform refers to dimensions that differ by less than about 75 total micrometers.
- Ra refers to a measure of the roughness of a surface as determined by the difference in height between a peak and a neighboring valley.
- Rmax is a measure of surface roughness as determined by the difference in height between the highest peak on the surface and the lowest valley on the surface.
- a numerical range of "about 1 micrometer to about 5 micrometers” should be interpreted to include not only the explicitly recited values of about 1 micrometer to about 5 micrometers, but also include individual values and sub-ranges within the indicated range. Thus, included in this numerical range are individual values such as 2, 3, and 4 and sub-ranges such as from 1-3, from 2-4, and from 3-5, etc. This same principle applies to ranges reciting only one numerical value. Furthermore, such an interpretation should apply regardless of the breadth of the range or the characteristics being described.
- a prior art CMP pad dresser 10 which has a plurality of abrasive particles 50 electroplated to a substrate 40.
- the electroplating material 60 is generally nickel precipitated out of an acid solution.
- CMP pad dressers 10 using only the electroplating material 60 to attach the abrasive particles 50 to a substrate have many disadvantages that are apparent as shown in Fig. 1.
- the electroplating material is incapable of forming chemical bonds with the abrasive particles. Therefore, only weak mechanical forces hold the abrasive particles onto the substrate 40.
- the pad dresser is rotated against a CMP pad, such mechanical forces are quickly overcome by the friction force acting on the abrasive particles.
- the abrasive particles are easily loosened from the electroplating material, leaving voids in the electroplating material, such as spaces 70.
- Such voids are quickly filled with residue polished off of the work piece, as well as chemicals and abrasive particles from the slurry. These substances chemically attack and further weaken the electroplating material.
- the mechanical forces created by the electroplating material 60 are the only means holding the abrasive particles 50 onto the substrate 40, exposure of the abrasive particles above the electroplating material must be kept to a minimum. Nevertheless, contact between electroplating material and the CMP pad is inevitable. Such contact wears the electroplating material and further facilitates the release of the abrasive particles. Additionally, during manufacture, the electroplating material tends to bubble up around the abrasive particles, in places such as convex portion 80. These convex portions, in addition to - l i ⁇ the already low exposure and tight spacing of the abrasive particles, make significant penetration of the abrasive particles into the CMP pad fibers difficult, if not impossible. Without such penetration, the effectiveness of the dressing process is handicapped.
- Brazing materials 90 generally comprise a metal alloy mixed with carbide formers. Such carbide formers allow the abrasive particles to chemically bond to the brazing material which in turn bonds with the substrate. This bonding arrangement significantly increases the overall strength of the CMP dresser, but is accompanied by some undesirable side effects.
- Brazing material 90 must be kept to a minimum in order to avoid completely covering the abrasive particles 50. Therefore, the abrasive particles are wrapped in only a thin coating of brazing material. This problem is compounded by the fact that typical brazing materials are mechanically very weak. This mechanical weakness offsets the strength of the chemical bonds created between the abrasive particles and the brazing material. In fact, when dislodgment occurs, the chemical bonds between the abrasive particles and the brazing material are strong enough that the brazing material itself will often shear off along with detached abrasive particles.
- the brazing material 90 is also very susceptible to chemical attack by the abrasive slurry. This contributes to the detachment of abrasive particles 50, as it further weakens the brazing material, which is already mechanically weak. Therefore, in order to reduce exposure of the CMP pad dresser 20 to the chemical slurry, polishing of the work piece must be paused, and the chemical slurry allowed to leave the pad before the pad dresser is applied. Such pauses in the polishing process greatly reduce the constancy with which the pad may be used, increase the time required to produce a finished product, and are therefore inefficient.
- Another drawback to coupling the abrasive particles 50 to a substrate 40 by conventional brazing alone is that the surface tension of the molten metal alloy tends to cause the abrasive particles to "cluster" when applied to the substrate. Such clustering is illustrated at 100, leaving unintended gaps 110.
- the overall effect is a non-uniform distribution of abrasive particles, which makes grooming inefficient.
- the gaps cause uneven conditioning of the pad, which ultimately wears out certain areas of the CMP pad faster than others, with the overall result that the work piece will receive an uneven polish because the worn out areas polish less effectively than the properly conditioned areas.
- the clustering of abrasive particles creates another disadvantage by forming mounds in the brazing material 90.
- Mound formation raises some abrasive particles to a height above the substrate 40, which is greater than that of other abrasive particles. Therefore, the highest protruding abrasive particles may penetrate so deeply into the fibers of the CMP pad, that they will prevent lesser protruding abrasive particles from contacting the CMP pad or having a useful grooming effect.
- a CMP pad dresser 30 made in accordance with the principles of the present invention.
- the CMP pad dresser has a plurality of abrasive particles 50 coupled to a substrate 40 with a brazing material 90.
- Abrasive particles 50 may be of a variety of super hard materials. Examples of such materials include without limitation, diamond, polycrystalline diamond (PCD), cubic boron nitride (CBN) and polycrystalline cubic born nitride (PCBN).
- PCD polycrystalline diamond
- CBN cubic boron nitride
- PCBN polycrystalline cubic born nitride
- a layer of an overlay material 120 which is applied after the final brazing process.
- the overlay provides a working surface that is substantially smoother than the working surface of the brazing alloy.
- Such smoothness and planarity provides a number of benefits, including reduced incidence of micro-scratching from flaking braze, and better bonding with the anti-corrosive layer when included.
- the working surface of the overlay material may have an Ra value of less than about 1 micrometer.
- the overlay materials include, without limitation, tin, nickel, tungsten, cobalt, chromium, and alloys thereof, such as a zirconium nickel alloy.
- the overlay material may be applied by a wide variety of methods. Examples of methods for applying the overlay material include without limitation, electroplating and physical vapor deposition (PVD).
- the layer of overlay material may be of any thickness required to achieve a specific result, but in one aspect of the invention the layer may have a thickness of from about 0.1 to 50 micrometers thick. In another aspect, the thickness of the overlay may be from about 0.1 to about 5 micrometers.
- an anti-corrosive layer 130 is formed over the surface of the CMP pad dresser after the abrasive particles 50 have been affixed to the substrate 40.
- the anti-corrosive layer may be a super abrasive material such as diamond-like carbon (DLC), or amorphous diamond.
- the anti-corrosive layer has an atomic carbon content of at least about 80%.
- the anti-corrosive layer may have a variety of thicknesses as required to achieve a specific result, generally the thickness is in the range of 0.5 to 5 micrometers. In one aspect, the anti-corrosive layer has a thickness less than 3 micrometers.
- Such a thin anti- corrosive layer ensures that the working surface of the CMP pad dresser is protected without reducing the ability of the abrasive particles to dress the CMP pad.
- the anti-corrosive layer is generally produced by use of a physical vapor deposition (PVD) method. PVD methods such as the use of a cathodic arc with a graphite cathode, which is generally known in the art.
- PVD physical vapor deposition
- One advantage provided by the anti-corrosive layer 130 is that it effectively "seals" the working surface, and may also seal any other desired surfaces of the CMP pad dresser 30 that may be vulnerable to chemical attack.
- the anti-corrosive layer protects the brazing material 90 from chemical attack by the abrasive chemical slurry held within the CMP pad. This protection allows CMP pad dresser to dress a CMP pad in situ, and eliminates the production pauses used to prolong the useful life of prior art CMP pad dressers. The continual and even dressing of the CMP pad allows for greater production output, and prolongs the life and efficiency of the CMP pad. While the anti-corrosive layer 130 may be used in some embodiments of the present invention, it is notable that the overlay material 120 has significant anti-corrosive characteristics in and of itself. As such, many of the production advantages may be obtained to a substantial degree, only when the overlay material is used, and without the use of the anti-corrosive layer.
- One method of affixing abrasive particles 180 to a substrate is shown in Figs. 4-6.
- a template 140 having apertures 150 is placed upon a sheet of brazing alloy 190.
- the sheet may be a rolled sheet of continuous amorphous brazing alloy.
- the sheet may be a brazing alloy powder that is held together with a binder material.
- the brazing alloy powder may include other metallic powders, and such other powders may constitute a majority of the material in the brazing sheet.
- the sheet may be sufficient to act as a substrate.
- the apertures 150 are filled with abrasive particles 180.
- the apertures have a predetermined size, so that only one abrasive particle will fit in each. Any size of abrasive particle or grit is acceptable, however in one aspect of the invention, the particle sizes may be from about 100 to about 350 micrometers in diameter. In another aspect of the invention, the size of the apertures in the template may be customized in order to obtain a pattern of abrasive particles having a size within a uniform in size range. In one embodiment, the apertures of the template are sufficient to select only grits within a size range having a variance no greater than 50 micrometers.
- This uniformity of grit size contributes to the uniformity of CMP pad grooming, as the work load of each abrasive particle is evenly distributed. In turn, the even work load distribution reduces the stress on individual abrasive particles, and extends the effective life of the CMP pad dresser.
- any excess abrasive particles are removed, and a flat surface 160 is applied to abrasive particles.
- the flat surface 160 must be of an extremely strong, rigid material, so that it is capable of pushing abrasive particles down into the brazing alloy sheet 190.
- Such materials typically include, but are not limited to steel, iron, alloys thereof, etc.
- Abrasive particles 180 are shown to be embedded in brazing alloy sheet 190 in Fig. 6. Because surface 160 was flat, the abrasive particles will extend away from the substrate to a predetermined, uniform height. This uniform height will be determined by the thickness of template 140, and in a preferred embodiment, each abrasive particle will extend to within 50 micrometers of this distance. As such, each abrasive particle grooms to substantially the same depth on the CMP pad. However, it is to be understood that in certain applications, grit height may not be desired to be uniform. As such, those of ordinary skill in the art will recognize that grit patterns of varied height may be provided by so configuring the template, 140 and the surface 160 to provide such a design.
- the surface 160 may have a concave shape so as to press the peripherally located particles further down than the centrally located particles.
- a concave shape will provide a slope for the abrasive particles which begins at a low point with the working ends of the peripherally particles and slopes up to a high point at the working ends of the centrally located particles.
- Abrasive particles 180 as shown in Figs. 4-6 are rounded. However, in Fig. 3, they are pointed.
- the scope of the present invention encompasses abrasive particles of any shape, including euhedral, octahedral, cubo-octaheral, or naturally shaped particles.
- the abrasive particles have a predetermined shape with a sharp point or apex extending in a direction away from the substrate 40.
- the abrasive particles 180 into the brazing alloy sheet 190 may be fixed in the templated position by disposing an adhesive on the surface of the brazing alloy sheet. In this manner, the particles remain fixed in place when the template is removed, and during heat processing.
- the template 140 may be laid upon a transfer sheet (not shown) having a thin adhesive film thereon. In this case, the particles become adhered to the transfer sheet using the template procedure specified above. The template is then removed, and the transfer sheet is laid onto the brazing sheet 190 with abrasive particles facing the sheet. Disposed upon the brazing sheet is the afore-mentioned adhesive layer, which is more strongly adhesive than the adhesive on the transfer sheet. Therefore, the abrasive particles are transferred to the sheet of brazing alloy in the pattern dictated by the template.
- the sheet of brazing alloy may be first affixed to the substrate, and the abrasive particles subsequently added thereto using the template procedure described herein.
- the brazing alloy used may be any brazing material known in the art, but in one aspect, may be a nickel alloy that has a chromium content of at least 2% by weight. A brazing alloy of such a composition will be nearly super hard in and of itself, and less susceptible to chemical attack from the abrasive containing slurry. Therefore, the anti- corrosive layer 130, and the overlay material 120 are optional.
- the abrasive particles 50 are firmly held in, or on the brazing alloy sheet 90, the surface tension of the liquid brazing alloy is insufficient to cause particle clustering as shown in FIG. 2. Additionally, braze thickening occurs to a much lesser degree and few or no "mounds" are formed. Rather, the braze forms a slightly concave surface between each abrasive particle, which provides additional structural support.
- the thickness of the brazing alloy sheet 90 is predetermined to allow at least about 10 to 90% of each abrasive particle to protrude above the outer, or working, surface of brazing material 90.
- the abrasive particles may be selected or placed, so that at least about 10 to about 90% of each abrasive particle protrudes above the outer, or working, surface of the overlay material 120.
- the abrasive grits may extend to a uniform height or distance above the substrate 40, which means when applied to a CMP pad, they will protrude to a uniform depth within the pad fibers.
- the even spacing and uniform protrusion causes the CMP to be dressed or groomed evenly, which in turn increases the polishing efficiency of the CMP pad and extends its useful life.
- the particles may be positioned on the substrate using the template method recited above, and held in place by a glue, or other suitable binder.
- the braze material is then showered, or placed on the substrate around the abrasive particles, and the overlay material may be added.
- one aspect of the present invention is the recognition of specific predetermined patterns that more adequately meet the particular needs and conditions for which CMP pad dressers are used.
- each grit is positioned and held at a specific location in accordance with the design of the pattern.
- Such patterns are indeed useful for achieving specific CMP pad dressing results, and may be varied in order to achieve a specific grooming result as will be seen. For example, the grooming results of many known pads could be improved by placing grits in a certain configuration.
- the downward pressure exerted by the dresser causes the pad to rise or mound as it comes in contact with the leading edge of the dresser that is moving in a given direction. While the rising action may improve the dressing of the pad at the leading edge of the dresser as it allows a fuller contact with the abrasive particles, it may also cause a dipping action in the portion of the pad that has already passed under the leading edge of the dresser. Even if no dipping occurs, generally, the dressing action of the remaining portion of the dresser behind the leading edge is less effective than that of the leading edge (i.e.
- the pattern of abrasive particles may be configured to allow the CMP pad to rise while underneath the dresser at an interior or central location (i.e. a location that follows a leading edge), thus allowing them to be dressed by abrasive particles following those of the leading edge.
- an interior or central location i.e. a location that follows a leading edge
- such a configuration provides a multiplicity of leading edges along the working surface of the dresser.
- the particles on the periphery have a higher density than the density of the centrally located particles.
- the density of the periphery particles can be at least about 1.25, 2, or 5 times greater than the density of the central particles. Further the density can be a gradient of high at the periphery particles and low at the central particles. In this manner, the various densities allow the CMP pad is to rise while under a central portion of the pad dresser, and increase dressing effectiveness. As will be seen, a variety of particle configurations or patterns can provide the required spacing of abrasive particles to achieve such actions and be used to achieve specifically desired dressing results. As illustrated by way of example in Fig. 7, in one aspect of the invention, the abrasive particles may be arranged so as to have abrasive particles located only along the leading edge 200 of the pad dresser 30. Referring now to Fig.
- the abrasive particles may be arranged to be more highly concentrated (i.e. have a higher density) along the leading edge 200 than in the center 210.
- the abrasive particles may be arranged such that the abrasive particles are more concentrated in the center than along the leading edge (not illustrated).
- the particles may be arranged and distributed at a higher concentration in the central portion of the pad dresser than the particles at the periphery. Further, the particles located between the central and peripheral portions are arranged to have a density that is between the densities of the central portion and periphery portion.
- the abrasive particles may be arranged such that the they are uniformly distributed with a space between each particle that is sufficient to allow the afore-discussed pad rising.
- the uniformly distributed particles may form a grid and be evenly spaced at a distance of about 1.5 to about 10 times the size of each individual grit.
- the abrasive particles may also be arranged in various concentration gradients increasing or decreasing in concentration from the leading edge toward the center of the CMP pad dresser (not illustrated).
- the present invention provides a method that increases the work load on centrally located superabrasive particles in a CMP pad dresser during dressing of a CMP pad with the dresser.
- the method configures superabrasive particles to in a pattern that reduces penetration of peripherally located particles into the CMP pad and increases penetration of centrally located particles into the CMP pad dresser.
- the superabrasive particles are each individually located at specific positions on the CMP pad substrate in accordance with the predetermined pattern.
- the work load on the centrally located particles can be increased to within at least about 10% to about 30% of the work load of the peripherally located particles.
- the work load can further be substantially equal with the work load of the peripheral particles or all particles.
- the superabrasive particles can be configured in a pattern that provides an upward slope from working ends of the peripheral particles to the working ends of the central particles, as illustrated in Fig. 10.
- Another alternative for increasing the work load is affixing the superabrasive particles in a pattern which provides a density of peripherally located particles higher than the density of centrally located particles, as described above.
- the pattern can be configured to provide centrally located particles with an attitude that causes higher particle penetration into the CMP pad than the penetration provided by the attitude of the peripherally located particles, as illustrated in Fig. 11.
- the present invention provides a CMP pad dresser which increases the work load on the centrally located superabrasive particles by providing a substrate 300 coupled to superabrasive particles having an upward slope 305 from the peripheral superabrasive particles 320 to the centrally located particles 310.
- the upward slope can be created by increasing the particle height from the particles located on the periphery to the particles located centrally.
- the upward slope transfers the work load from the peripheral particles to the central particles by providing a fuller contact with the central particles and the CMP pad.
- the increased contact improves the dressing of the CMP pad and the total wear of the pad conditioner.
- the slope is determined as a measure of pad velocity and pad flexibility.
- the pad is a deformable medium which depresses when it comes in contact with the leading edge particles. Normally, the depression of the pad will intensify depending on the flexibility of the pad and the rotational speed of the pad.
- the slope is from about 0.1% to 0.5%, preferably the slope is 0.2%.
- the slope may be obtained by the altering the configuration of the substrate.
- the substrate of the CMP pad dresser is substantially flat, however, in some aspects, the substrate may be contoured to conform to the depression of the rotating CMP pad. Such contour may provide the desired slope for the working ends of the abrasive particles 310 and 320. In such a case, the height of the particles above the working surface of the substrate will be substantially uniform.
- the substrate is usually made of a metallic, ceramic, or flexible material. In a one embodiment the substrate can be stainless steel. In some aspects, the substrate can be a powdered material that becomes a solid upon processing.
- the powder may include a brazing alloy of a metal such as nickel in combination with a carbide forming element, such as chromium in an amount of at least about 2 wt%.
- the substrate can consist essentially of a brazing material.
- Fig. 11 is an illustration of a CMP pad dresser which increases the work load on centrally located particles of a CMP pad dresser while dressing a CMP pad. Abrasive particles wear at different rates depending on the attitude of the particle. Generally, the attitude of an apex will provide more penetration into the CMP pad and will groom more aggressively than the other attitudes. A particle which has an attitude of a face provides the least amount of penetration and is the least aggressive in dressing the pad.
- a particle having an edge as an attitude provides intermediate grooming and penetration characteristics.
- a substrate 400 receives a plurality of superabrasive particles 410, 420, 430 in a predetermined pattern.
- the pattern is configured to provide centrally located particles with an attitude that causes higher particle penetration into the CMP pad than penetration provided by an attitude of particles located at the periphery of a pad dresser.
- the centrally located superabrasive particles 410 are oriented in an attitude that provides an apex at the working end 405 of the particles. These particles groom the pad more aggressively and have a higher degree of penetration than the attitude provided by the other particles.
- the peripheral particles 420 can be oriented in an attitude that provides either an edge or a face 430 at the working end 405 thereof.
- any particles 420 therebetween can be oriented in an attitude that provides an edge at the working end thereof.
- any particles located between those of the periphery and those of the center will be the same as the either of the other types.
- the centrally located particles may be oriented in an attitude that provides an edge at the working end thereof and the peripherally located particles may be oriented in an attitude that provides a face at the working end thereof.
- the present invention provides a method of producing a CMP pad dresser as described herein.
- a method includes the steps of providing a substrate and attaching superabrasive particles to the substrate in a pattern that reduces penetration of peripherally located particles into the CMP pad and increases penetration of centrally located particles into the CMP pad.
Abstract
Description
Claims
Priority Applications (2)
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JP2007534787A JP2008515238A (en) | 2004-09-29 | 2005-09-28 | Molded CMP pad dresser and related methods |
CN2005800409845A CN101068654B (en) | 2004-09-29 | 2005-09-28 | Contoured cmp pad dresser and associated methods |
Applications Claiming Priority (2)
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US10/954,956 US7201645B2 (en) | 1999-11-22 | 2004-09-29 | Contoured CMP pad dresser and associated methods |
US10/954,956 | 2004-09-29 |
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WO2006039457A1 true WO2006039457A1 (en) | 2006-04-13 |
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PCT/US2005/035132 WO2006039457A1 (en) | 2004-09-29 | 2005-09-28 | Contoured cmp pad dresser and associated methods |
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US (2) | US7201645B2 (en) |
JP (1) | JP2008515238A (en) |
KR (1) | KR20070063569A (en) |
CN (1) | CN101068654B (en) |
TW (1) | TWI290506B (en) |
WO (1) | WO2006039457A1 (en) |
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2005
- 2005-09-23 TW TW094132965A patent/TWI290506B/en active
- 2005-09-28 CN CN2005800409845A patent/CN101068654B/en active Active
- 2005-09-28 KR KR1020077009784A patent/KR20070063569A/en not_active Application Discontinuation
- 2005-09-28 JP JP2007534787A patent/JP2008515238A/en active Pending
- 2005-09-28 WO PCT/US2005/035132 patent/WO2006039457A1/en active Application Filing
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2007
- 2007-04-10 US US11/786,443 patent/US20070254566A1/en not_active Abandoned
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Cited By (1)
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JP2008161965A (en) * | 2006-12-27 | 2008-07-17 | Nippon Steel Materials Co Ltd | Dresser for abrasive cloth |
Also Published As
Publication number | Publication date |
---|---|
US20070254566A1 (en) | 2007-11-01 |
US7201645B2 (en) | 2007-04-10 |
CN101068654A (en) | 2007-11-07 |
TWI290506B (en) | 2007-12-01 |
CN101068654B (en) | 2010-09-08 |
JP2008515238A (en) | 2008-05-08 |
US20050095959A1 (en) | 2005-05-05 |
KR20070063569A (en) | 2007-06-19 |
TW200618942A (en) | 2006-06-16 |
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