WO2006039446A3 - Heat transfer device and system and method incorporating same - Google Patents

Heat transfer device and system and method incorporating same Download PDF

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Publication number
WO2006039446A3
WO2006039446A3 PCT/US2005/035100 US2005035100W WO2006039446A3 WO 2006039446 A3 WO2006039446 A3 WO 2006039446A3 US 2005035100 W US2005035100 W US 2005035100W WO 2006039446 A3 WO2006039446 A3 WO 2006039446A3
Authority
WO
WIPO (PCT)
Prior art keywords
thermally conductive
conductive substrates
heat transfer
transfer device
electrical barrier
Prior art date
Application number
PCT/US2005/035100
Other languages
French (fr)
Other versions
WO2006039446A2 (en
Inventor
Stanton Earl Weaver Jr
James William Bray
Ahmed Elasser
Seth Thomas Taylor
Original Assignee
Gen Electric
Stanton Earl Weaver Jr
James William Bray
Ahmed Elasser
Seth Thomas Taylor
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric, Stanton Earl Weaver Jr, James William Bray, Ahmed Elasser, Seth Thomas Taylor filed Critical Gen Electric
Publication of WO2006039446A2 publication Critical patent/WO2006039446A2/en
Publication of WO2006039446A3 publication Critical patent/WO2006039446A3/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J45/00Discharge tubes functioning as thermionic generators
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00Treatment by energy or chemical effects
    • B32B2310/021Treatment by energy or chemical effects using electrical effects
    • B32B2310/024Peltier effect
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making

Abstract

A method of manufacturing a heat transfer device including providing first and second thermally conductive substrates that are substantially atomically flat, providing a patterned electrical barrier on the first or second thermally conductive substrates and disposing a low work function material on the first or second thermally conductive substrates in an area oriented between the patterned electrical barrier in a configuration in which the first and second thermally conductive substrates are positioned opposite from one another. The method also includes bonding the first and second thermally conductive substrates in the configuration and extracting a plurality of units having opposite sections of the first and second thermally conductive substrates, each unit having a portion of the patterned electrical barrier disposed about the low work function material.
PCT/US2005/035100 2004-09-30 2005-09-29 Heat transfer device and system and method incorporating same WO2006039446A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/955,639 US20060068611A1 (en) 2004-09-30 2004-09-30 Heat transfer device and system and method incorporating same
US10/955,639 2004-09-30

Publications (2)

Publication Number Publication Date
WO2006039446A2 WO2006039446A2 (en) 2006-04-13
WO2006039446A3 true WO2006039446A3 (en) 2006-11-30

Family

ID=35788301

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/035100 WO2006039446A2 (en) 2004-09-30 2005-09-29 Heat transfer device and system and method incorporating same

Country Status (2)

Country Link
US (1) US20060068611A1 (en)
WO (1) WO2006039446A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7928561B2 (en) * 2005-09-09 2011-04-19 General Electric Company Device for thermal transfer and power generation
US7480142B2 (en) * 2006-12-12 2009-01-20 Cummins Power Generation Ip, Inc. Boost spring holder for securing a power device to a heatsink
US20090031733A1 (en) * 2007-07-31 2009-02-05 General Electric Company Thermotunneling refrigeration system
US8506105B2 (en) 2010-08-25 2013-08-13 Generla Electric Company Thermal management systems for solid state lighting and other electronic systems
US9123780B2 (en) * 2012-12-19 2015-09-01 Invensas Corporation Method and structures for heat dissipating interposers
US10559864B2 (en) 2014-02-13 2020-02-11 Birmingham Technologies, Inc. Nanofluid contact potential difference battery
GB2583565B (en) * 2019-02-14 2023-05-03 Borealis Tech Ltd Low work function materials
US11649525B2 (en) 2020-05-01 2023-05-16 Birmingham Technologies, Inc. Single electron transistor (SET), circuit containing set and energy harvesting device, and fabrication method
US11616186B1 (en) 2021-06-28 2023-03-28 Birmingham Technologies, Inc. Thermal-transfer apparatus including thermionic devices, and related methods

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3174063A (en) * 1960-04-27 1965-03-16 Gen Electric Compatible electrode system in vacuum thermionic apparatus
US3267308A (en) * 1963-07-09 1966-08-16 Rca Corp Thermionic energy converter
WO1999013562A1 (en) * 1997-09-08 1999-03-18 Borealis Technical Limited Diode device
WO2003021758A2 (en) * 2001-08-28 2003-03-13 Borealis Technical Limited Thermotunnel converter
US20040050415A1 (en) * 2002-09-13 2004-03-18 Eneco Inc. Tunneling-effect energy converters
WO2004091157A2 (en) * 2003-04-02 2004-10-21 The Boeing Company Solid state thermal-to-electric energy conversion power generating device
US20050104185A1 (en) * 2003-11-12 2005-05-19 Sharp Kabushiki Kaisha Electronic heat pump device, electronic equipment using electronic heat pump device and method of manufacturing electronic heat pump device

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3169200A (en) * 1962-06-22 1965-02-09 Fred N Huffman Thermotunnel converter
US3702408A (en) * 1970-11-03 1972-11-07 Atomic Energy Commission Multi-converter thermionic energy module
US4039352A (en) * 1971-09-13 1977-08-02 Institutul De Cercetaro Energetice Industriale Si Proictari Utilaje Energetice High efficiency thermoelectric generator for the direct conversion of heat into electrical energy
DE2547262C3 (en) * 1975-10-22 1981-07-16 Reinhard Dr. 7101 Flein Dahlberg Thermoelectric arrangement with large temperature gradients and use
US4667126A (en) * 1982-11-26 1987-05-19 Rasor Associates, Inc. Thermionic converter
US4755350A (en) * 1987-03-11 1988-07-05 The United States Of America As Represented By The Secretary Of The Air Force Thermionic reactor module with thermal storage reservoir
US5028835A (en) * 1989-10-11 1991-07-02 Fitzpatrick Gary O Thermionic energy production
US5219516A (en) * 1992-06-16 1993-06-15 Thermacore, Inc. Thermionic generator module with heat pipes
US5637946A (en) * 1993-10-28 1997-06-10 Lockheed Corporation Thermally energized electrical power source
US5541464A (en) * 1994-03-30 1996-07-30 Johnson; Lonnie G. Thermionic generator
US5492570A (en) * 1994-07-05 1996-02-20 Thermacore, Inc. Hybrid thermal electric generator
US6064137A (en) * 1996-03-06 2000-05-16 Borealis Technical Limited Method and apparatus for a vacuum thermionic converter with thin film carbonaceous field emission
US5874039A (en) * 1997-09-22 1999-02-23 Borealis Technical Limited Low work function electrode
US5675972A (en) * 1996-09-25 1997-10-14 Borealis Technical Limited Method and apparatus for vacuum diode-based devices with electride-coated electrodes
US5994638A (en) * 1996-12-19 1999-11-30 Borealis Technical Limited Method and apparatus for thermionic generator
US5973259A (en) * 1997-05-12 1999-10-26 Borealis Tech Ltd Method and apparatus for photoelectric generation of electricity
US6084173A (en) * 1997-07-30 2000-07-04 Dimatteo; Robert Stephen Method and apparatus for the generation of charged carriers in semiconductor devices
US7140102B2 (en) * 2001-09-02 2006-11-28 Borealis Technical Limited Electrode sandwich separation
US6720704B1 (en) * 1997-09-08 2004-04-13 Boreaiis Technical Limited Thermionic vacuum diode device with adjustable electrodes
US6495843B1 (en) * 1998-02-09 2002-12-17 Borealis Technical Limited Method for increasing emission through a potential barrier
US6281514B1 (en) * 1998-02-09 2001-08-28 Borealis Technical Limited Method for increasing of tunneling through a potential barrier
US6509669B1 (en) * 1998-02-26 2003-01-21 Sandia Corporation Microminiature thermionic converters
US6294858B1 (en) * 1998-02-26 2001-09-25 Sandia Corporation Microminiature thermionic converters
US6100621A (en) * 1998-03-26 2000-08-08 The United States Of America As Represented By The United States Department Of Energy Thermionic converter with differentially heated cesium-oxygen source and method of operation
US6037697A (en) * 1999-01-18 2000-03-14 General Atomics Thermionic converter and method of making same
EP1166369A4 (en) * 1999-03-11 2006-12-27 Eneco Inc Hybrid thermionic energy converter and method
US6396191B1 (en) * 1999-03-11 2002-05-28 Eneco, Inc. Thermal diode for energy conversion
US6326541B1 (en) * 1999-12-28 2001-12-04 Byron R. Goheen Solar/thermal radiation cell device
US6417060B2 (en) * 2000-02-25 2002-07-09 Borealis Technical Limited Method for making a diode device
US6651760B2 (en) * 2000-04-05 2003-11-25 Borealis Technical Limited Thermionic automobile
US6403876B1 (en) * 2000-12-07 2002-06-11 International Business Machines Corporation Enhanced interface thermoelectric coolers with all-metal tips
US6467275B1 (en) * 2000-12-07 2002-10-22 International Business Machines Corporation Cold point design for efficient thermoelectric coolers
US6384312B1 (en) * 2000-12-07 2002-05-07 International Business Machines Corporation Thermoelectric coolers with enhanced structured interfaces
US6608250B2 (en) * 2000-12-07 2003-08-19 International Business Machines Corporation Enhanced interface thermoelectric coolers using etched thermoelectric material tips
US6625990B2 (en) * 2001-02-09 2003-09-30 Bsst Llc Thermoelectric power generation systems
US7273981B2 (en) * 2001-02-09 2007-09-25 Bsst, Llc. Thermoelectric power generation systems
US6774003B2 (en) * 2001-02-23 2004-08-10 Borealis Technical Limited Method for making a diode device
US6779347B2 (en) * 2001-05-21 2004-08-24 C.P. Baker Securities, Inc. Solid-state thermionic refrigeration
US6605339B1 (en) * 2001-12-19 2003-08-12 Sandia Corporation Micro heat barrier
US6494048B1 (en) * 2002-04-11 2002-12-17 International Business Machines Corporation Assembly of quantum cold point thermoelectric coolers using magnets
US20040029341A1 (en) * 2002-08-01 2004-02-12 Cox Isaiah Watas Gap diode device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3174063A (en) * 1960-04-27 1965-03-16 Gen Electric Compatible electrode system in vacuum thermionic apparatus
US3267308A (en) * 1963-07-09 1966-08-16 Rca Corp Thermionic energy converter
WO1999013562A1 (en) * 1997-09-08 1999-03-18 Borealis Technical Limited Diode device
WO2003021758A2 (en) * 2001-08-28 2003-03-13 Borealis Technical Limited Thermotunnel converter
US20040050415A1 (en) * 2002-09-13 2004-03-18 Eneco Inc. Tunneling-effect energy converters
WO2004091157A2 (en) * 2003-04-02 2004-10-21 The Boeing Company Solid state thermal-to-electric energy conversion power generating device
US20050104185A1 (en) * 2003-11-12 2005-05-19 Sharp Kabushiki Kaisha Electronic heat pump device, electronic equipment using electronic heat pump device and method of manufacturing electronic heat pump device

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
DATABASE INSPEC [online] THE INSTITUTION OF ELECTRICAL ENGINEERS, STEVENAGE, GB; 2004, MAGDYCH J ET AL: "Thermal management solutions using electron tunneling through a nano-scale vacuum gap", Database accession no. 8200432 *
SPACE TECHNOLOGY AND APPLICATIONS INTERNATIONAL FORUM - STAIF 2004, no. 699, 8 February 2004 (2004-02-08) - 11 February 2004 (2004-02-11), AIP Conference Proceedings AIP USA, pages 45 - 50, ISSN: 0094-243X, Retrieved from the Internet <URL:http://scitation.aip.org/getpdf/servlet/GetPDFServlet?filetype=pdf&id=APCPCS000699000001000045000001&idtype=cvips&prog=normal> [retrieved on 20060731] *
TAVKHELIDZE A ET AL: "Electron tunneling through large area vacuum gap -- preliminary results", THERMOELECTRICS, 2002. PROCEEDINGS ICT '02. TWENTY-FIRST INTERNATIONAL CONFERENCE ON AUG. 25-29, 2002, PISCATAWAY, NJ, USA,IEEE, 25 August 2002 (2002-08-25), pages 435 - 438, XP010637519, ISBN: 0-7803-7683-8 *

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US20060068611A1 (en) 2006-03-30
WO2006039446A2 (en) 2006-04-13

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