WO2006036601A3 - Process control monitors for the fabrication interferometric modulators - Google Patents

Process control monitors for the fabrication interferometric modulators Download PDF

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Publication number
WO2006036601A3
WO2006036601A3 PCT/US2005/033221 US2005033221W WO2006036601A3 WO 2006036601 A3 WO2006036601 A3 WO 2006036601A3 US 2005033221 W US2005033221 W US 2005033221W WO 2006036601 A3 WO2006036601 A3 WO 2006036601A3
Authority
WO
WIPO (PCT)
Prior art keywords
process control
control monitors
fabrication
interferometric modulators
mems device
Prior art date
Application number
PCT/US2005/033221
Other languages
French (fr)
Other versions
WO2006036601A2 (en
Inventor
William J Cummings
Brian J Gally
Original Assignee
Idc Llc
William J Cummings
Brian J Gally
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Idc Llc, William J Cummings, Brian J Gally filed Critical Idc Llc
Priority to KR1020077009676A priority Critical patent/KR101236291B1/en
Priority to JP2007533554A priority patent/JP2008516267A/en
Priority to KR1020077010602A priority patent/KR101232091B1/en
Priority to KR1020127028632A priority patent/KR20120125673A/en
Publication of WO2006036601A2 publication Critical patent/WO2006036601A2/en
Publication of WO2006036601A3 publication Critical patent/WO2006036601A3/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0035—Testing
    • B81C99/004—Testing during manufacturing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/55—Specular reflectivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/001—Optical devices or arrangements for the control of light using movable or deformable optical elements based on interference in an adjustable optical cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches

Abstract

Process control monitors 100, 102, and 104 are disclosed that are produced using at least some of the same process steps used to manufacture a MEMS device 108. Analysis of the process control monitors 100, 102, and 104 can provide information regarding properties of the MEMS device 108 and components or sub-components in the device. This information can be used to identify errors in processing or to optimize the MEMS device 108. In some embodiments, analysis of the process control monitors 100, 102, and 104 may utilize optical measurements.
PCT/US2005/033221 2004-09-27 2005-09-16 Process control monitors for the fabrication interferometric modulators WO2006036601A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020077009676A KR101236291B1 (en) 2004-09-27 2005-09-16 Process control monitors for interferometric modulators
JP2007533554A JP2008516267A (en) 2004-09-27 2005-09-16 Process control monitor for interferometric modulators
KR1020077010602A KR101232091B1 (en) 2004-09-27 2005-09-16 Process control monitors for interferometric modulators
KR1020127028632A KR20120125673A (en) 2004-09-27 2005-09-16 Process control monitors for interferometric modulators

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US61353704P 2004-09-27 2004-09-27
US60/613,537 2004-09-27
US11/198,888 US20060176487A1 (en) 2004-09-27 2005-08-05 Process control monitors for interferometric modulators
US11/198,888 2005-08-05

Publications (2)

Publication Number Publication Date
WO2006036601A2 WO2006036601A2 (en) 2006-04-06
WO2006036601A3 true WO2006036601A3 (en) 2006-05-26

Family

ID=35520641

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/033221 WO2006036601A2 (en) 2004-09-27 2005-09-16 Process control monitors for the fabrication interferometric modulators

Country Status (5)

Country Link
US (7) US20060176487A1 (en)
JP (5) JP2008516267A (en)
KR (6) KR20070067709A (en)
TW (6) TW200628395A (en)
WO (1) WO2006036601A2 (en)

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