WO2006031280A3 - Probe arrays and method for making - Google Patents
Probe arrays and method for making Download PDFInfo
- Publication number
- WO2006031280A3 WO2006031280A3 PCT/US2005/023706 US2005023706W WO2006031280A3 WO 2006031280 A3 WO2006031280 A3 WO 2006031280A3 US 2005023706 W US2005023706 W US 2005023706W WO 2006031280 A3 WO2006031280 A3 WO 2006031280A3
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- WO
- WIPO (PCT)
- Prior art keywords
- probes
- transfer
- directed
- prior
- temporary substrate
- Prior art date
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
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- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
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- G01R1/067—Measuring probes
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8112—Aligning
- H01L2224/81136—Aligning involving guiding structures, e.g. spacers or supporting members
- H01L2224/81138—Aligning involving guiding structures, e.g. spacers or supporting members the guiding structures being at least partially left in the finished device
- H01L2224/8114—Guiding structures outside the body
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
- H01L2224/81815—Reflow soldering
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18165—Exposing the passive side of the semiconductor or solid-state body of a wire bonded chip
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Abstract
Applications Claiming Priority (16)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US60971904P | 2004-09-13 | 2004-09-13 | |
US60/609,719 | 2004-09-13 | ||
US61178904P | 2004-09-20 | 2004-09-20 | |
US60/611,789 | 2004-09-20 | ||
US10/949,738 | 2004-09-24 | ||
US10/949,738 US20060006888A1 (en) | 2003-02-04 | 2004-09-24 | Electrochemically fabricated microprobes |
US11/028,945 US7640651B2 (en) | 2003-12-31 | 2005-01-03 | Fabrication process for co-fabricating multilayer probe array and a space transformer |
US11/028,960 US7265565B2 (en) | 2003-02-04 | 2005-01-03 | Cantilever microprobes for contacting electronic components and methods for making such probes |
US11/029,221 | 2005-01-03 | ||
US11/029,221 US7531077B2 (en) | 2003-02-04 | 2005-01-03 | Electrochemical fabrication process for forming multilayer multimaterial microprobe structures |
US11/029,217 | 2005-01-03 | ||
US11/029,217 US7412767B2 (en) | 2003-02-04 | 2005-01-03 | Microprobe tips and methods for making |
US11/028,945 | 2005-01-03 | ||
US11/028,958 US20050142739A1 (en) | 2002-05-07 | 2005-01-03 | Probe arrays and method for making |
US11/028,960 | 2005-01-03 | ||
US11/028,958 | 2005-01-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006031280A2 WO2006031280A2 (en) | 2006-03-23 |
WO2006031280A3 true WO2006031280A3 (en) | 2007-03-01 |
Family
ID=36060464
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/023706 WO2006031280A2 (en) | 2004-09-13 | 2005-06-30 | Probe arrays and method for making |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO2006031280A2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200921109A (en) * | 2007-11-09 | 2009-05-16 | Univ Nat Chiao Tung | Assembly structure of 3D probe array |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6332270B2 (en) * | 1998-11-23 | 2001-12-25 | International Business Machines Corporation | Method of making high density integral test probe |
US6426638B1 (en) * | 2000-05-02 | 2002-07-30 | Decision Track Llc | Compliant probe apparatus |
US6452406B1 (en) * | 1996-09-13 | 2002-09-17 | International Business Machines Corporation | Probe structure having a plurality of discrete insulated probe tips |
US6491968B1 (en) * | 1998-12-02 | 2002-12-10 | Formfactor, Inc. | Methods for making spring interconnect structures |
-
2005
- 2005-06-30 WO PCT/US2005/023706 patent/WO2006031280A2/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6452406B1 (en) * | 1996-09-13 | 2002-09-17 | International Business Machines Corporation | Probe structure having a plurality of discrete insulated probe tips |
US6332270B2 (en) * | 1998-11-23 | 2001-12-25 | International Business Machines Corporation | Method of making high density integral test probe |
US6491968B1 (en) * | 1998-12-02 | 2002-12-10 | Formfactor, Inc. | Methods for making spring interconnect structures |
US6426638B1 (en) * | 2000-05-02 | 2002-07-30 | Decision Track Llc | Compliant probe apparatus |
Also Published As
Publication number | Publication date |
---|---|
WO2006031280A2 (en) | 2006-03-23 |
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