WO2006026580A3 - Laser package with digital electronic interface - Google Patents

Laser package with digital electronic interface Download PDF

Info

Publication number
WO2006026580A3
WO2006026580A3 PCT/US2005/030735 US2005030735W WO2006026580A3 WO 2006026580 A3 WO2006026580 A3 WO 2006026580A3 US 2005030735 W US2005030735 W US 2005030735W WO 2006026580 A3 WO2006026580 A3 WO 2006026580A3
Authority
WO
WIPO (PCT)
Prior art keywords
laser
package
driver
optical
transmission
Prior art date
Application number
PCT/US2005/030735
Other languages
French (fr)
Other versions
WO2006026580A2 (en
Inventor
Jim Tatum
James K Guenter
Original Assignee
Finisar Corp
Jim Tatum
James K Guenter
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Finisar Corp, Jim Tatum, James K Guenter filed Critical Finisar Corp
Publication of WO2006026580A2 publication Critical patent/WO2006026580A2/en
Publication of WO2006026580A3 publication Critical patent/WO2006026580A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters

Abstract

Optical transmission components, systems and packages where the package includes a common housing containing a laser for transmission of an optical signal, a photodetector optically coupled to the laser for monitoring the laser transmission, and a laser driver electrically coupled to the laser for providing a drive current to the laser. The optical package may be a TO-Can package (402), the laser (403) may be a vertical cavity surface emitting laser ('VCSEL'), and the laser driver (405) may be an AC modulation laser driver, where a bias current (411) is supplied to the laser from external to the optical transmission component package. An external bias source may be used for providing a bias current to the laser. A temperature sensor located in the laser driver may be used to control operational parameters of the laser.
PCT/US2005/030735 2004-08-31 2005-08-31 Laser package with digital electronic interface WO2006026580A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US60578104P 2004-08-31 2004-08-31
US60/605,781 2004-08-31
US11/082,521 2005-03-17
US11/082,521 US7270490B2 (en) 2004-08-31 2005-03-17 Laser package with digital electronic interface

Publications (2)

Publication Number Publication Date
WO2006026580A2 WO2006026580A2 (en) 2006-03-09
WO2006026580A3 true WO2006026580A3 (en) 2006-12-21

Family

ID=35943197

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/030735 WO2006026580A2 (en) 2004-08-31 2005-08-31 Laser package with digital electronic interface

Country Status (2)

Country Link
US (1) US7270490B2 (en)
WO (1) WO2006026580A2 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7347632B2 (en) 2003-12-12 2008-03-25 Mina Farr Optical connectors for electronic devices
US7706692B2 (en) 2004-09-29 2010-04-27 Finisar Corporation Consumer electronics with optical communication interface
US7778551B2 (en) * 2005-04-29 2010-08-17 Finisar Corporation Temperature compensation circuits
US7331819B2 (en) * 2005-07-11 2008-02-19 Finisar Corporation Media converter
US7729618B2 (en) * 2005-08-30 2010-06-01 Finisar Corporation Optical networks for consumer electronics
US7860398B2 (en) * 2005-09-15 2010-12-28 Finisar Corporation Laser drivers for closed path optical cables
US8083417B2 (en) * 2006-04-10 2011-12-27 Finisar Corporation Active optical cable electrical adaptor
US7778510B2 (en) * 2006-04-10 2010-08-17 Finisar Corporation Active optical cable electrical connector
US7712976B2 (en) * 2006-04-10 2010-05-11 Finisar Corporation Active optical cable with integrated retiming
US7876989B2 (en) * 2006-04-10 2011-01-25 Finisar Corporation Active optical cable with integrated power
US7445389B2 (en) * 2006-04-10 2008-11-04 Finisar Corporation Active optical cable with integrated eye safety
US7401985B2 (en) * 2006-04-10 2008-07-22 Finisar Corporation Electrical-optical active optical cable
US7499616B2 (en) 2006-04-10 2009-03-03 Finisar Corporation Active optical cable with electrical connector
JP2008211072A (en) * 2007-02-27 2008-09-11 Mitsubishi Electric Corp Optical module
US8769171B2 (en) * 2007-04-06 2014-07-01 Finisar Corporation Electrical device with electrical interface that is compatible with integrated optical cable receptacle
US8244124B2 (en) 2007-04-30 2012-08-14 Finisar Corporation Eye safety mechanism for use in optical cable with electrical interfaces
CN103684361A (en) * 2012-09-04 2014-03-26 苏州艾普瑞光电有限公司 Laser pulse differentiating circuit and driving method thereof
US10431955B2 (en) * 2014-04-25 2019-10-01 Lmd Power Of Light Corp Laser core having conductive mass electrical connection
DE102017108050B4 (en) 2017-04-13 2022-01-13 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung semiconductor radiation source
JP6910843B2 (en) * 2017-05-12 2021-07-28 株式会社ジャパンディスプレイ Semiconductor lasers, semiconductor laser sets, and display devices
US10326245B1 (en) * 2018-03-29 2019-06-18 Cosemi Technologies, Inc. Light illuminating data communication cable
CN113985537B (en) * 2021-10-29 2023-03-28 青岛海信宽带多媒体技术有限公司 Optical module

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5542018A (en) * 1990-08-31 1996-07-30 Kuhara; Yoshiki Semiconductor laser device making use of photodiode chip
US6364541B1 (en) * 1999-12-22 2002-04-02 New Focus, Inc. Method and apparatus for optical reception
US6742938B2 (en) * 2000-07-25 2004-06-01 Nippon Sheet Glass Co., Ltd. Optical module for coupling an optical semiconductor element having a sealing cap with an optical fiber
US6856769B1 (en) * 2000-10-24 2005-02-15 Infineon Technologies Ag Optical transceiver module
US7021943B2 (en) * 2003-10-24 2006-04-04 Industrial Technology Research Institute Optical transmission module

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5844928A (en) * 1996-02-27 1998-12-01 Lucent Technologies, Inc. Laser driver with temperature sensor on an integrated circuit
US6097748A (en) * 1998-05-18 2000-08-01 Motorola, Inc. Vertical cavity surface emitting laser semiconductor chip with integrated drivers and photodetectors and method of fabrication

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5542018A (en) * 1990-08-31 1996-07-30 Kuhara; Yoshiki Semiconductor laser device making use of photodiode chip
US6364541B1 (en) * 1999-12-22 2002-04-02 New Focus, Inc. Method and apparatus for optical reception
US6742938B2 (en) * 2000-07-25 2004-06-01 Nippon Sheet Glass Co., Ltd. Optical module for coupling an optical semiconductor element having a sealing cap with an optical fiber
US6856769B1 (en) * 2000-10-24 2005-02-15 Infineon Technologies Ag Optical transceiver module
US7021943B2 (en) * 2003-10-24 2006-04-04 Industrial Technology Research Institute Optical transmission module

Also Published As

Publication number Publication date
WO2006026580A2 (en) 2006-03-09
US20060045437A1 (en) 2006-03-02
US7270490B2 (en) 2007-09-18

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