WO2006012172A3 - Method and apparatus for pretreatment of polymeric materials - Google Patents

Method and apparatus for pretreatment of polymeric materials Download PDF

Info

Publication number
WO2006012172A3
WO2006012172A3 PCT/US2005/022169 US2005022169W WO2006012172A3 WO 2006012172 A3 WO2006012172 A3 WO 2006012172A3 US 2005022169 W US2005022169 W US 2005022169W WO 2006012172 A3 WO2006012172 A3 WO 2006012172A3
Authority
WO
WIPO (PCT)
Prior art keywords
treatment chamber
component
carbon dioxide
polymeric material
organic residue
Prior art date
Application number
PCT/US2005/022169
Other languages
French (fr)
Other versions
WO2006012172A2 (en
Inventor
Jerry Michael Mahl
Karen Anne Connery
Thomas John Bergman Jr
Original Assignee
Praxair Technology Inc
Jerry Michael Mahl
Karen Anne Connery
Thomas John Bergman Jr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Praxair Technology Inc, Jerry Michael Mahl, Karen Anne Connery, Thomas John Bergman Jr filed Critical Praxair Technology Inc
Priority to JP2007518255A priority Critical patent/JP2008505474A/en
Priority to KR1020077001619A priority patent/KR101099936B1/en
Priority to EP05762352A priority patent/EP1773730A4/en
Priority to CN2005800285471A priority patent/CN101006022B/en
Publication of WO2006012172A2 publication Critical patent/WO2006012172A2/en
Publication of WO2006012172A3 publication Critical patent/WO2006012172A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J8/00—Chemical or physical processes in general, conducted in the presence of fluids and solid particles; Apparatus for such processes
    • B01J8/02—Chemical or physical processes in general, conducted in the presence of fluids and solid particles; Apparatus for such processes with stationary particles, e.g. in fixed beds
    • B01J8/04—Chemical or physical processes in general, conducted in the presence of fluids and solid particles; Apparatus for such processes with stationary particles, e.g. in fixed beds the fluid passing successively through two or more beds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D11/00—Solvent extraction
    • B01D11/02—Solvent extraction of solids
    • B01D11/0203—Solvent extraction of solids with a supercritical fluid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D11/00—Solvent extraction
    • B01D11/02—Solvent extraction of solids
    • B01D11/0207—Control systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D11/00—Solvent extraction
    • B01D11/02—Solvent extraction of solids
    • B01D11/0292—Treatment of the solvent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J8/00—Chemical or physical processes in general, conducted in the presence of fluids and solid particles; Apparatus for such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0021—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by liquid gases or supercritical fluids

Abstract

The present invention relates to a method and apparatus for pretreating a polymeric material in a treatment chamber (12). The method includes providing a polymeric material component into the treatment chamber (12) and introducing a carbon dioxide fluid in supercritical state therein. The component is exposed to the carbon dioxide fluid to extract non-volatile organic residue contained in the component. The contaminated carbon dioxide fluid containing the extracted non-volatile organic residue is removed from the treatment chamber such that the organic residue does not deposit onto the polymeric material component by depressurizing the treatment chamber. Thereafter, the component is removed from the treatment chamber (12).
PCT/US2005/022169 2004-06-24 2005-06-23 Method and apparatus for pretreatment of polymeric materials WO2006012172A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007518255A JP2008505474A (en) 2004-06-24 2005-06-23 Method and apparatus for pretreatment of polymeric materials
KR1020077001619A KR101099936B1 (en) 2004-06-24 2005-06-23 Method and apparatus for pretreatment of polymeric materials
EP05762352A EP1773730A4 (en) 2004-06-24 2005-06-23 Method and apparatus for pretreatment of polymeric materials
CN2005800285471A CN101006022B (en) 2004-06-24 2005-06-23 Method and apparatus for pretreatment of polymeric materials

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/874,374 2004-06-24
US10/874,374 US20050288485A1 (en) 2004-06-24 2004-06-24 Method and apparatus for pretreatment of polymeric materials utilized in carbon dioxide purification, delivery and storage systems

Publications (2)

Publication Number Publication Date
WO2006012172A2 WO2006012172A2 (en) 2006-02-02
WO2006012172A3 true WO2006012172A3 (en) 2006-10-26

Family

ID=35506887

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/022169 WO2006012172A2 (en) 2004-06-24 2005-06-23 Method and apparatus for pretreatment of polymeric materials

Country Status (7)

Country Link
US (1) US20050288485A1 (en)
EP (1) EP1773730A4 (en)
JP (2) JP2008505474A (en)
KR (1) KR101099936B1 (en)
CN (2) CN101006022B (en)
SG (1) SG153863A1 (en)
WO (1) WO2006012172A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007050483A1 (en) * 2007-10-19 2009-09-10 Meyer Burger Ag Mixture of a thixotropic dispersion medium and abrasive grains as abrasive
CN102233342A (en) * 2010-04-28 2011-11-09 中国科学院微电子研究所 Multifunctional carbon dioxide cleaning machine
CN102345968B (en) * 2010-07-30 2013-07-31 中国科学院微电子研究所 Device and method for drying supercritical carbon dioxide microemulsion
EP2712366B2 (en) * 2011-04-04 2020-11-11 Biopolymer Network Limited Method of impregnating and purifying polylactic acid resin
EP2772290A1 (en) * 2013-02-28 2014-09-03 Sulzer Chemtech AG A devolatilisation apparatus and a process for use thereof
CN113856237B (en) * 2021-08-26 2023-01-03 北京大学深圳研究生院 Supercritical processing method for organic semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003049167A1 (en) * 2001-12-03 2003-06-12 Kabushiki Kaisha Kobe Seiko Sho Method of high pressure treatment

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JPS6425536A (en) * 1987-07-22 1989-01-27 Oki Electric Ind Co Ltd Photoresist applying method
US5013366A (en) * 1988-12-07 1991-05-07 Hughes Aircraft Company Cleaning process using phase shifting of dense phase gases
US5550211A (en) * 1991-12-18 1996-08-27 Schering Corporation Method for removing residual additives from elastomeric articles
US5777726A (en) * 1992-05-12 1998-07-07 Raytheon Company Spectrophotometric supercritical fluid contamination monitor
US5339844A (en) * 1992-08-10 1994-08-23 Hughes Aircraft Company Low cost equipment for cleaning using liquefiable gases
FR2727873B1 (en) * 1994-12-12 1997-01-10 Commissariat Energie Atomique PROCESS AND PLANT FOR SEPARATING HEAVY AND LIGHT COMPOUNDS BY EXTRACTION BY SUPERCRITICAL FLUID AND NANOFILTRATION
JPH08183989A (en) * 1994-12-27 1996-07-16 Sumitomo Seika Chem Co Ltd Method for extracting and separating organic substance
US5783082A (en) * 1995-11-03 1998-07-21 University Of North Carolina Cleaning process using carbon dioxide as a solvent and employing molecularly engineered surfactants
GB2311992A (en) * 1996-04-10 1997-10-15 Bespak Plc A method of cleaning or purifying elastomers and elastomeric articles which are intended for medical or pharmaceutical uses
US5756657A (en) * 1996-06-26 1998-05-26 University Of Massachusetts Lowell Method of cleaning plastics using super and subcritical media
JP3784464B2 (en) * 1996-07-10 2006-06-14 三菱化工機株式会社 Cleaning method using supercritical fluid as cleaning fluid
US5868862A (en) * 1996-08-01 1999-02-09 Texas Instruments Incorporated Method of removing inorganic contamination by chemical alteration and extraction in a supercritical fluid media
TW465053B (en) * 1998-03-25 2001-11-21 Daikin Ind Ltd Method for washing fluorine-containing rubber molded article for semiconductor manufacturing equipment and washed molded article
JP2000106358A (en) * 1998-09-29 2000-04-11 Mitsubishi Electric Corp Semiconductor manufacturing apparatus and method for processing semiconductor substrate
WO2001008204A1 (en) * 1999-07-23 2001-02-01 Nikon Corporation Exposing method and apparatus
US6286231B1 (en) * 2000-01-12 2001-09-11 Semitool, Inc. Method and apparatus for high-pressure wafer processing and drying
JP2004507087A (en) * 2000-08-14 2004-03-04 東京エレクトロン株式会社 Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide method
US6905555B2 (en) * 2001-02-15 2005-06-14 Micell Technologies, Inc. Methods for transferring supercritical fluids in microelectronic and other industrial processes
JP4450521B2 (en) * 2001-02-15 2010-04-14 三菱マテリアル株式会社 Sealing material
US6763840B2 (en) * 2001-09-14 2004-07-20 Micell Technologies, Inc. Method and apparatus for cleaning substrates using liquid carbon dioxide
AU2003235748A1 (en) * 2002-01-07 2003-07-24 Praxair Technology, Inc. Method for cleaning an article
JP4042412B2 (en) * 2002-01-11 2008-02-06 ソニー株式会社 Cleaning and drying method
JP4031440B2 (en) * 2002-03-22 2008-01-09 東京エレクトロン株式会社 Contaminant removal using supercritical processing

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003049167A1 (en) * 2001-12-03 2003-06-12 Kabushiki Kaisha Kobe Seiko Sho Method of high pressure treatment

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP1773730A4 *

Also Published As

Publication number Publication date
SG153863A1 (en) 2009-07-29
KR20070029814A (en) 2007-03-14
CN101006022B (en) 2012-01-04
JP2012212908A (en) 2012-11-01
WO2006012172A2 (en) 2006-02-02
EP1773730A4 (en) 2009-08-26
CN101006022A (en) 2007-07-25
US20050288485A1 (en) 2005-12-29
CN102532574A (en) 2012-07-04
KR101099936B1 (en) 2011-12-28
JP2008505474A (en) 2008-02-21
EP1773730A2 (en) 2007-04-18

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