WO2006002615A3 - Elektrisches mehrschichtbauelement mit zuverlässigem lötkontakt - Google Patents

Elektrisches mehrschichtbauelement mit zuverlässigem lötkontakt Download PDF

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Publication number
WO2006002615A3
WO2006002615A3 PCT/DE2005/001155 DE2005001155W WO2006002615A3 WO 2006002615 A3 WO2006002615 A3 WO 2006002615A3 DE 2005001155 W DE2005001155 W DE 2005001155W WO 2006002615 A3 WO2006002615 A3 WO 2006002615A3
Authority
WO
WIPO (PCT)
Prior art keywords
component
soldering contact
transversal
layered component
electrical multi
Prior art date
Application number
PCT/DE2005/001155
Other languages
English (en)
French (fr)
Other versions
WO2006002615A2 (de
Inventor
Christian Block
Sebastian Brunner
Thomas Feichtinger
Guenter Pudmich
Original Assignee
Epcos Ag
Christian Block
Sebastian Brunner
Thomas Feichtinger
Guenter Pudmich
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos Ag, Christian Block, Sebastian Brunner, Thomas Feichtinger, Guenter Pudmich filed Critical Epcos Ag
Priority to US11/630,524 priority Critical patent/US20070271782A1/en
Priority to JP2007518446A priority patent/JP4838795B2/ja
Priority to EP05782178.7A priority patent/EP1761936B1/de
Publication of WO2006002615A2 publication Critical patent/WO2006002615A2/de
Publication of WO2006002615A3 publication Critical patent/WO2006002615A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/144—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being welded or soldered
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/18—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material comprising a plurality of layers stacked between terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Abstract

Für ein elektrisches Mehrschichtbauelement, das übereinandergestapelte keramische Dielektrikumsschichten mit dazwischen angeordneten Bauelementstrukturen aufweist, wird zur Erhöhung der mechanischen Stabilität insbesondere des Lötkontakts am Bauelement eine verbesserte Querschnittsform für die Durchkontaktierungen vorgeschlagen. Diese weisen einen Querschnitt auf, der sich zumindest abschnittsweise vom Lötkontakt auf der Unterseite des Bauelements hin nach oben erweitert.
PCT/DE2005/001155 2004-07-01 2005-06-30 Elektrisches mehrschichtbauelement mit zuverlässigem lötkontakt WO2006002615A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US11/630,524 US20070271782A1 (en) 2004-07-01 2005-06-30 Electrical Multilayer Component with Solder Contact
JP2007518446A JP4838795B2 (ja) 2004-07-01 2005-06-30 高信頼性のはんだ付けコンタクトを備えた電気的な多層構成素子
EP05782178.7A EP1761936B1 (de) 2004-07-01 2005-06-30 Elektrisches mehrschichtbauelement mit zuverlässigem lötkontakt

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004031878A DE102004031878B3 (de) 2004-07-01 2004-07-01 Elektrisches Mehrschichtbauelement mit zuverlässigem Lötkontakt
DE102004031878.6 2004-07-01

Publications (2)

Publication Number Publication Date
WO2006002615A2 WO2006002615A2 (de) 2006-01-12
WO2006002615A3 true WO2006002615A3 (de) 2006-06-01

Family

ID=34980845

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2005/001155 WO2006002615A2 (de) 2004-07-01 2005-06-30 Elektrisches mehrschichtbauelement mit zuverlässigem lötkontakt

Country Status (5)

Country Link
US (1) US20070271782A1 (de)
EP (1) EP1761936B1 (de)
JP (1) JP4838795B2 (de)
DE (1) DE102004031878B3 (de)
WO (1) WO2006002615A2 (de)

Families Citing this family (11)

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DE102004032706A1 (de) * 2004-07-06 2006-02-02 Epcos Ag Verfahren zur Herstellung eines elektrischen Bauelements und das Bauelement
DE102004058410B4 (de) * 2004-12-03 2021-02-18 Tdk Electronics Ag Vielschichtbauelement mit ESD-Schutzelementen
JP5078500B2 (ja) * 2006-08-30 2012-11-21 三洋電機株式会社 素子搭載用基板、半導体モジュールおよび携帯機器
DE102007044604A1 (de) * 2007-09-19 2009-04-09 Epcos Ag Elektrisches Vielschichtbauelement
DE102008009817A1 (de) * 2008-02-19 2009-08-27 Epcos Ag Verbundwerkstoff zur Temperaturmessung, Temperatursensor aufweisend den Verbundwerkstoff und Verfahren zur Herstellung des Verbundwerkstoffs und des Temperatursensors
DE102008019127B4 (de) 2008-04-16 2010-12-09 Epcos Ag Vielschichtbauelement
DE102008035102A1 (de) * 2008-07-28 2010-02-11 Epcos Ag Vielschichtbauelement
DE102010036270B4 (de) * 2010-09-03 2018-10-11 Epcos Ag Keramisches Bauelement und Verfahren zur Herstellung eines keramischen Bauelements
CH708584A1 (de) 2013-09-16 2015-03-31 Micro Motor Ag Anordnung elektrischer Bauteile und elektrischer Antriebsmotor mit einer Bauteileanordnung
DE102016100352A1 (de) * 2016-01-11 2017-07-13 Epcos Ag Bauelementträger mit ESD Schutzfunktion und Verfahren zur Herstellung
WO2020018651A1 (en) 2018-07-18 2020-01-23 Avx Corporation Varistor passivation layer and method of making the same

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JP4838795B2 (ja) 2011-12-14
WO2006002615A2 (de) 2006-01-12
EP1761936A2 (de) 2007-03-14
EP1761936B1 (de) 2017-05-10
JP2008504700A (ja) 2008-02-14
DE102004031878B3 (de) 2005-10-06

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