WO2005120238A2 - Method and apparatus for controlling freezing nucleation and propagation - Google Patents

Method and apparatus for controlling freezing nucleation and propagation Download PDF

Info

Publication number
WO2005120238A2
WO2005120238A2 PCT/US2005/016883 US2005016883W WO2005120238A2 WO 2005120238 A2 WO2005120238 A2 WO 2005120238A2 US 2005016883 W US2005016883 W US 2005016883W WO 2005120238 A2 WO2005120238 A2 WO 2005120238A2
Authority
WO
WIPO (PCT)
Prior art keywords
heat exchanger
zone
surface area
volume ratio
fluid
Prior art date
Application number
PCT/US2005/016883
Other languages
French (fr)
Other versions
WO2005120238A3 (en
Inventor
Girish Upadhya
Richard G. Brewer
Mark Mcmaster
Original Assignee
Cooligy, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooligy, Inc. filed Critical Cooligy, Inc.
Priority to JP2007515166A priority Critical patent/JP2008503071A/en
Priority to DE112005001254T priority patent/DE112005001254T5/en
Publication of WO2005120238A2 publication Critical patent/WO2005120238A2/en
Publication of WO2005120238A3 publication Critical patent/WO2005120238A3/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/14Safety or protection arrangements; Arrangements for preventing malfunction for preventing damage by freezing, e.g. for accommodating volume expansion

Definitions

  • the present invention relates generally to an apparatus and method of controlling freezing in a liquid system, such as may be useful for transferring heat from electronic devices and components thereof.
  • the invention protects against expansion of fluid during freezing by initiating the expansion of frozen fluid in the direction of zones having progressively decreasing surface area to volume ratios.
  • Freezing is a transient non-equilibrium process, during which phase change occurs with release of latent heat as liquid or fluid cools below freezing temperature due to ambient cooling conditions.
  • water or some water based-mixtures are cooled below freezing, the material changes from a liquid state to a solid state, and undergoes a significant expansion in volume, which is as much as 10% or more for water or water-based mixtures.
  • water freezes in a pipe or other confined spaces its volume expands. Water that has frozen in confined spaces does more than simply clog the pipes and block flow.
  • freezing occurs in a confined space like a steel pipe, the ice will expand and exert extreme pressure which often leads to bursting of the pipe or separation of a joint and cause serious damage.
  • This phenomenon is a common failure mode in hot-water heating systems and automotive cooling systems. Ice forming in a confined space does not always cause cracking where ice blockage occurs. Rather, following a complete ice blockage in a confined space, continued freezing and expansion inside the confined space can cause water pressure to increase downstream, which could lead to pipe failure and/or cracking in these areas. Upstream from the ice blockage the water can retreat back towards its inlet source, and there is little pressure buildup to cause cracking. Relative to other liquids, water-based mixtures are preferred for use in liquid cooling systems due to advantages in thermal properties and health and safety concerns. Liquid cooling systems for electronic devices are occasionally subjected to sub- freezing environments during shipping, storage, or in use.
  • the system must be designed to tolerate any volume expansion that would occur.
  • Additives used to lower the freezing point, such as antifreeze, are potentially poisonous and flammable and can damage mechanical components, sensitive sensors, and electronics. Therefore, to use pure water or substantially pure water in such a system, an apparatus for and method of controlling freezing nucleation and propagation is needed, such that the system can tolerate the volume expansion caused by freezing of the aforementioned fluid without damaging electronic components or affecting system performance.
  • the present invention protects components and pipes of a liquid cooling system from cracking related to an expansion of volume due to freezing of the fluid within the system.
  • the present invention provides an apparatus for and method of controlling freezing nucleation and propagation in a liquid system having one or more components coupled and characterized by a plurality of surface area to volume ratios so that when freezing occurs, the fluid expands from an initial zone having a highest surface area to volume ratio in the direction of one or more zones having progressively decreasing surface area to volume ratios.
  • the present invention manages and designs surface area to volume ratios of one or more components as well as regions within the components, including heat exchangers, inlet and outlet ports and tubular members, so that when freezing occurs, the volume expands in the direction that can accept the expanded volume.
  • an apparatus for controlling freezing nucleation and propagation in a liquid system includes a heat exchanger having multiple zones characterized by surface area to volume ratio.
  • the apparatus also includes means for initiating freezing of a fluid from an initial zone which results in volume expansion during freezing through the multiple zones having progressively lower surface area to volume ratios in the direction of a member having a final zone characterized by a final surface area to volume ratio.
  • the heat exchanger can be replaced by any member in a liquid system.
  • the surface area to volume ratio of the final zone is preferably lower than the surface area to volume ratio of the initial zone.
  • the final zone can accommodate an expanded volume of at least 10% of all the liquid volume present in each zone, including the final zone, when the fluid freezes.
  • the final zone can be a tubular member.
  • the tubular member can have elasticity sufficient to expand outwardly to accommodate the volume expansion caused by the freezing of the fluid.
  • the initial zone is internal to a heat exchanger.
  • the heat exchanger can include an inlet port extending through a first opening of the heat exchanger for conveying the fluid to a plurality of channels and passages and an outlet port extending through a second opening for discharging the fluid from the plurality of channels and passages.
  • the plurality of channels and passages can be formed in porous copper foam.
  • the plurality of channels and passages can be formed of microchannels.
  • the plurality of channels of passages can be formed of micropins or a layered meshed structure. Multiple fluid pathways emanating from the initial zone may necessitate identification of multiple zones.
  • the apparatus includes a plurality of zones located between the initial and final zones, wherein a zone surface area to volume ratio is calculated for each zone. Preferably, the zone surface area to volume ratio of each zone progressively decreases from the initial zone in the direction of the final zone.
  • the apparatus can include one or more compressible objects coupled within the final zone wherein pressure exerted on the compressible object by the freezing fluid increases a volume of the final zone. The compressible objects are preferably confined within the final zone.
  • the compressible objects can be made of one of the following: sponge, foam, air-filled bubbles, and balloons.
  • the sponge and foam are hydrophobi
  • the apparatus can also include at least one air pocket disposed in the final zone wherein the air pocket accommodates the expansion by the freezing fluid.
  • the apparatus can include at least one flexible object coupled to the final zone wherein pressure exerted on the flexible object by the freezing fluid increases a volume of the final zone.
  • the flexible object is secured within the final zone.
  • the flexible object can be made of one of the following: rubber, plastic, and foam.
  • a method of controlling freezing nucleation and propagation in a liquid system comprises the steps of initiating freezing of fluid from an initial zone of a heat exchanger and characterized by an initial surface area to volume ratio; and directing the frozen fluid to a final zone which is a tubular member characterized by a final surface area to volume ratio.
  • Figure 1 illustrates one embodiment of a closed-loop fluid system for implementing embodiments of the present invention.
  • Figure 2 illustrates one embodiment of a heat exchanger divided into logical zones characterized by surface area to volume ratios, in accordance with the present invention.
  • FIG. 1 shows a schematic diagram of a closed-loop fluid system 100 for implementing embodiments of the present invention.
  • the system 100 includes a heat exchanger 20 attached to a heat producing device 55 (shown as an integrated circuit attached to a circuit board, but which could also be a circuit board or other heat producing device), a pump 30 for circulating fluid, a heat rejector 40, which can include a plurality of fins 46 for further assisting in conducting heat away from the system 100, and a controller 50 for a pump input voltage based on a temperature measured at the heat exchanger 20.
  • a heat producing device 55 shown as an integrated circuit attached to a circuit board, but which could also be a circuit board or other heat producing device
  • a pump 30 for circulating fluid
  • a heat rejector 40 which can include a plurality of fins 46 for further assisting in conducting heat away from the system 100
  • a controller 50 for a pump input voltage based on a temperature measured at the heat exchanger 20.
  • the fluid travels through microchannels 24 of the heat exchanger 20, the heat rejector 40, and through tubing lengths 114, 112 and 110 before being returned to the inlet of the pump 30.
  • a spreader (not shown) is preferably coupled between the heat producing device 55 and the microchannels 24.
  • the controller 50 is understood to be an electronic circuit that may take input signals from thermometers in the heat exchanger 20, or from thermometers in the device 55 being cooled, through which signals are transmitted along signal lines 120.
  • the controller 50 based upon the input signals may regulate flow through the pump 30 by applying signals to a power supply (not shown) associated with the pump 30 along signal lines 122 to achieve the desired performance. While this embodiment specifies a flow direction, it will be understood that the present invention can be implemented with the reverse flow direction.
  • FIG. 2 illustrates one embodiment of a heat exchanger 200 divided into zones 1, 2, 3A and 3B and characterized by surface area to volume ratios.
  • the heat exchanger 200 is coupled to tubular members 210 and 260 disposed in zone 4A and 4B, respectively, and also characterized by surface area to volume ratios.
  • zone 1 is the initial zone and the tubular members represent a final zone or zones.
  • Zone 1 is preferably one or more microchannels (not shown) or a porous structure (not shown). Alternatively, Zone 1 can be one or more micropins (not shown).
  • Surface areas are calculated for each zone, preferably based directly on model geometry.
  • a zone can be constructed of one or more structures, such as copper foam, to have a desired surface area to volume ratio throughout the heat exchanger 200. Volumes are calculated for each zone, preferably based directly on model geometry. The surface to volume ratio of each zone is calculated by dividing the surface area of each zone by the volume of each zone. The resulting surface to volume ratio values of adjacent zones are compared.
  • Freeze progression is deemed favorable when the surface area to volume ratio of the heat exchanger 200 progressively decreases outward from zone 1 to the tubular members at the onset of freezing, hi particular, the surface area to volume ratio of zone 1 is relatively high and the surface area to volume ratios of the tubular members (zones 4A, 4B) are relatively low.
  • the fluid expands from a zone having the highest surface area to volume ratio in the direction of one or more zones having progressively decreasing surface area to volume ratios.
  • the heat exchanger 200 including the tubular members 210 and 260, can include many zones each with a different surface area to volume ratio.
  • the zone surface area to volume ratio of adjacent zones progressively decreases from the heat exchanger 200 in the direction of the tubular members 210 and 260; the zone surface area to volume ratio decreases in the following order of zones: 1>2>3B>4B and 1>2>3A>4A.
  • the tubular members 210 and 260 are designed to accommodate the necessary volume expansion.
  • the tubular members 210 and 260 preferably include compliant materials to accommodate an expanded volume of at least 10% when the fluid freezes.
  • the tubular members 210 and 260 have elasticity sufficient to expand outwardly to accommodate the volume expansion caused by the freezing of the fluid.
  • the one or more compressible objects can be coupled to the tubular member 210 and 260 wherein pressure exerted on the compressible object by the freezing fluid increases a volume of the tubular members 210 and 260.
  • the compressible objects are confined within the tubular member and made of one of the following: sponge, foam, air-filled bubbles, sealed tubes and balloons. Other types of compressible objects can be used.
  • the sponge and foam can be hydrophobi
  • at least one air pocket (not shown) can be disposed in the tubular members 210 and 260 wherein the air pocket (not shown) accommodates the expansion by the freezing fluid.
  • At least one flexible object is coupled to the tubular members 210 and 260 wherein pressure exerted on the flexible object (now shown) by the freezing fluid increases a volume of the tubular members 210 and 260.
  • the flexible object (not shown) is preferably secured within the tubular member and made of one of the following: rubber, plastic, and foam. It will be appreciated that additional compliant materials may also be employed to withstand the expansion of freezing fluid.

Abstract

An apparatus and method of controlling freezing in a liquid system is disclosed. The apparatus includes a heat exchanger having a initial zone characterized by a surface area to volume ratio. The apparatus also includes means for initiating freezing of a fluid from the initial zone to facilitate volume expansion during freezing in the direction of a final zone characterized by a final zone surface area to volume ratio. The apparatus can further include a plurality of zones located between the initial zone and the final zone, wherein a zone surface area to volume ratio is calculated for each zone. Preferably, the zone surface area to volume ratio of each zone progressively decreases from the initial zone in the direction of the final zone. Preferably, the final freezing zone has the lowest surface area to volume ratio and has sufficient elasticity to accommodate the volume expansion of all the fluid that has frozen from the initial zone.

Description

METHOD AND APPARATUS FOR CONTROLLING FREEZING NUCLEATION AND PROPAGATION
Related Application This application claims priority under 35 U.S.C. § 119(e) of the co-pending U.S. provisional patent application Serial Number 60/577,262, filed on June 4, 2004, and titled "MULTIPLE COOLING TECHNIQUES." The provisional patent application Serial Number 60/577,262, filed on June 4, 2004, and titled "MULTIPLE COOLING TECHNIQUES" is hereby incorporated by reference.
Field of the Invention: The present invention relates generally to an apparatus and method of controlling freezing in a liquid system, such as may be useful for transferring heat from electronic devices and components thereof. In particular, the invention protects against expansion of fluid during freezing by initiating the expansion of frozen fluid in the direction of zones having progressively decreasing surface area to volume ratios.
Background of the Invention: Freezing is a transient non-equilibrium process, during which phase change occurs with release of latent heat as liquid or fluid cools below freezing temperature due to ambient cooling conditions. When water or some water based-mixtures are cooled below freezing, the material changes from a liquid state to a solid state, and undergoes a significant expansion in volume, which is as much as 10% or more for water or water-based mixtures. When water freezes in a pipe or other confined spaces, its volume expands. Water that has frozen in confined spaces does more than simply clog the pipes and block flow. When freezing occurs in a confined space like a steel pipe, the ice will expand and exert extreme pressure which often leads to bursting of the pipe or separation of a joint and cause serious damage. This phenomenon is a common failure mode in hot-water heating systems and automotive cooling systems. Ice forming in a confined space does not always cause cracking where ice blockage occurs. Rather, following a complete ice blockage in a confined space, continued freezing and expansion inside the confined space can cause water pressure to increase downstream, which could lead to pipe failure and/or cracking in these areas. Upstream from the ice blockage the water can retreat back towards its inlet source, and there is little pressure buildup to cause cracking. Relative to other liquids, water-based mixtures are preferred for use in liquid cooling systems due to advantages in thermal properties and health and safety concerns. Liquid cooling systems for electronic devices are occasionally subjected to sub- freezing environments during shipping, storage, or in use. If the liquid freezes, the system must be designed to tolerate any volume expansion that would occur. Additives used to lower the freezing point, such as antifreeze, are potentially poisonous and flammable and can damage mechanical components, sensitive sensors, and electronics. Therefore, to use pure water or substantially pure water in such a system, an apparatus for and method of controlling freezing nucleation and propagation is needed, such that the system can tolerate the volume expansion caused by freezing of the aforementioned fluid without damaging electronic components or affecting system performance.
Summary of the Invention: The present invention protects components and pipes of a liquid cooling system from cracking related to an expansion of volume due to freezing of the fluid within the system. In particular, the present invention provides an apparatus for and method of controlling freezing nucleation and propagation in a liquid system having one or more components coupled and characterized by a plurality of surface area to volume ratios so that when freezing occurs, the fluid expands from an initial zone having a highest surface area to volume ratio in the direction of one or more zones having progressively decreasing surface area to volume ratios. Thus, the present invention manages and designs surface area to volume ratios of one or more components as well as regions within the components, including heat exchangers, inlet and outlet ports and tubular members, so that when freezing occurs, the volume expands in the direction that can accept the expanded volume. In accordance with one embodiment of the present invention, an apparatus for controlling freezing nucleation and propagation in a liquid system is disclosed. The apparatus includes a heat exchanger having multiple zones characterized by surface area to volume ratio. The apparatus also includes means for initiating freezing of a fluid from an initial zone which results in volume expansion during freezing through the multiple zones having progressively lower surface area to volume ratios in the direction of a member having a final zone characterized by a final surface area to volume ratio. Alternatively, the heat exchanger can be replaced by any member in a liquid system. In accordance with the present invention, the surface area to volume ratio of the final zone is preferably lower than the surface area to volume ratio of the initial zone. For a water based system the final zone can accommodate an expanded volume of at least 10% of all the liquid volume present in each zone, including the final zone, when the fluid freezes. For example, the final zone can be a tubular member. In one embodiment, the tubular member can have elasticity sufficient to expand outwardly to accommodate the volume expansion caused by the freezing of the fluid. In the preferred embodiment, the initial zone is internal to a heat exchanger. The heat exchanger can include an inlet port extending through a first opening of the heat exchanger for conveying the fluid to a plurality of channels and passages and an outlet port extending through a second opening for discharging the fluid from the plurality of channels and passages. The plurality of channels and passages can be formed in porous copper foam.
Alternatively, the plurality of channels and passages can be formed of microchannels. Alternatively, the plurality of channels of passages can be formed of micropins or a layered meshed structure. Multiple fluid pathways emanating from the initial zone may necessitate identification of multiple zones. In one embodiment, the apparatus includes a plurality of zones located between the initial and final zones, wherein a zone surface area to volume ratio is calculated for each zone. Preferably, the zone surface area to volume ratio of each zone progressively decreases from the initial zone in the direction of the final zone. The apparatus can include one or more compressible objects coupled within the final zone wherein pressure exerted on the compressible object by the freezing fluid increases a volume of the final zone. The compressible objects are preferably confined within the final zone. The compressible objects can be made of one of the following: sponge, foam, air-filled bubbles, and balloons. Preferably, the sponge and foam are hydrophobi The apparatus can also include at least one air pocket disposed in the final zone wherein the air pocket accommodates the expansion by the freezing fluid. Alternatively, the apparatus can include at least one flexible object coupled to the final zone wherein pressure exerted on the flexible object by the freezing fluid increases a volume of the final zone. Preferably, the flexible object is secured within the final zone. The flexible object can be made of one of the following: rubber, plastic, and foam. In accordance with another embodiment of the present invention, a method of controlling freezing nucleation and propagation in a liquid system is disclosed. The method comprises the steps of initiating freezing of fluid from an initial zone of a heat exchanger and characterized by an initial surface area to volume ratio; and directing the frozen fluid to a final zone which is a tubular member characterized by a final surface area to volume ratio.
Brief Description of the Drawings: Figure 1 illustrates one embodiment of a closed-loop fluid system for implementing embodiments of the present invention. Figure 2 illustrates one embodiment of a heat exchanger divided into logical zones characterized by surface area to volume ratios, in accordance with the present invention.
Detailed Description Of The Preferred Embodiment: Reference will now be made in detail to the preferred and alternative embodiments of the invention, examples of which are illustrated in the accompanying drawings. While the invention will be described in conjunction with the preferred embodiments, it will be understood that they are not intended to limit the invention to these embodiments. On the contrary, the invention is intended to cover alternatives, modifications and equivalents, which maybe included within the spirit and scope of the invention as defined by the appended claims. Furthermore, in the following detailed description of the present invention, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, it should be noted that the present invention can be practiced without these specific details. In other instances, well known methods, procedures and components have not been described in detail as not to unnecessarily obscure aspects of the present invention. Figure 1 shows a schematic diagram of a closed-loop fluid system 100 for implementing embodiments of the present invention. The system 100 includes a heat exchanger 20 attached to a heat producing device 55 (shown as an integrated circuit attached to a circuit board, but which could also be a circuit board or other heat producing device), a pump 30 for circulating fluid, a heat rejector 40, which can include a plurality of fins 46 for further assisting in conducting heat away from the system 100, and a controller 50 for a pump input voltage based on a temperature measured at the heat exchanger 20. Fluid flows from an inlet of the pump 30, passes through a porous structure (not shown) within the pump 30 by electroosmotic forces, and exits through an outlet of the pump 30. While this embodiment uses an electroosmotic pump, it will be understood that the present invention can be implemented in a system using other types of pumps, such as a mechanical pump. The fluid travels through microchannels 24 of the heat exchanger 20, the heat rejector 40, and through tubing lengths 114, 112 and 110 before being returned to the inlet of the pump 30. A spreader (not shown) is preferably coupled between the heat producing device 55 and the microchannels 24. The controller 50 is understood to be an electronic circuit that may take input signals from thermometers in the heat exchanger 20, or from thermometers in the device 55 being cooled, through which signals are transmitted along signal lines 120. The controller 50, based upon the input signals may regulate flow through the pump 30 by applying signals to a power supply (not shown) associated with the pump 30 along signal lines 122 to achieve the desired performance. While this embodiment specifies a flow direction, it will be understood that the present invention can be implemented with the reverse flow direction. As fluid temperature drops below freezing, ice starts to form. The rate at which ice forms depends on the rate at which the fluid cools, which depends on a surface area to volume ratio. Continued growth of ice in areas of the system 100 can lead to excessive fluid pressure. The resulting pressure can rupture or damage individual elements, such as the microchannels 24, including walls 22 of the microchannels 24, in the heat exchanger 20 and the tubular members 110, 112 and 114. As will be explained and understood in further detail below, these elements are designed in a way that tolerates expansion of the fluid during freezing. Figure 2 illustrates one embodiment of a heat exchanger 200 divided into zones 1, 2, 3A and 3B and characterized by surface area to volume ratios. The heat exchanger 200 is coupled to tubular members 210 and 260 disposed in zone 4A and 4B, respectively, and also characterized by surface area to volume ratios. In this embodiment, zone 1 is the initial zone and the tubular members represent a final zone or zones. Zone 1 is preferably one or more microchannels (not shown) or a porous structure (not shown). Alternatively, Zone 1 can be one or more micropins (not shown). Surface areas are calculated for each zone, preferably based directly on model geometry. A zone can be constructed of one or more structures, such as copper foam, to have a desired surface area to volume ratio throughout the heat exchanger 200. Volumes are calculated for each zone, preferably based directly on model geometry. The surface to volume ratio of each zone is calculated by dividing the surface area of each zone by the volume of each zone. The resulting surface to volume ratio values of adjacent zones are compared. Freeze progression is deemed favorable when the surface area to volume ratio of the heat exchanger 200 progressively decreases outward from zone 1 to the tubular members at the onset of freezing, hi particular, the surface area to volume ratio of zone 1 is relatively high and the surface area to volume ratios of the tubular members (zones 4A, 4B) are relatively low. During freezing, the fluid expands from a zone having the highest surface area to volume ratio in the direction of one or more zones having progressively decreasing surface area to volume ratios. It will be appreciated that the heat exchanger 200, including the tubular members 210 and 260, can include many zones each with a different surface area to volume ratio. The zone surface area to volume ratio of adjacent zones progressively decreases from the heat exchanger 200 in the direction of the tubular members 210 and 260; the zone surface area to volume ratio decreases in the following order of zones: 1>2>3B>4B and 1>2>3A>4A. hi this embodiment, the tubular members 210 and 260 are designed to accommodate the necessary volume expansion. The tubular members 210 and 260 preferably include compliant materials to accommodate an expanded volume of at least 10% when the fluid freezes. Preferably, the tubular members 210 and 260 have elasticity sufficient to expand outwardly to accommodate the volume expansion caused by the freezing of the fluid. Alternatively, the one or more compressible objects (not shown) can be coupled to the tubular member 210 and 260 wherein pressure exerted on the compressible object by the freezing fluid increases a volume of the tubular members 210 and 260. Preferably, the compressible objects (not shown) are confined within the tubular member and made of one of the following: sponge, foam, air-filled bubbles, sealed tubes and balloons. Other types of compressible objects can be used. The sponge and foam can be hydrophobi In another embodiment, at least one air pocket (not shown) can be disposed in the tubular members 210 and 260 wherein the air pocket (not shown) accommodates the expansion by the freezing fluid. Alternatively, at least one flexible object (not shown) is coupled to the tubular members 210 and 260 wherein pressure exerted on the flexible object (now shown) by the freezing fluid increases a volume of the tubular members 210 and 260. The flexible object (not shown) is preferably secured within the tubular member and made of one of the following: rubber, plastic, and foam. It will be appreciated that additional compliant materials may also be employed to withstand the expansion of freezing fluid. This invention has been described in terms of specific embodiment in incorporating details to facilitate the understanding of the principles of construction and operation of the invention. Such reference herein to specific embodiment and the details thereof is not intended to limit the scope of the claims and hereto. It will be apparent to those of ordinary skill in the art that modifications can be made in the embodiment chosen for illustration without departing from the spirit and scope of the invention. Specifically, it will be apparent to one of ordinary skill in the art device of the present invention could be implemented in several different ways and the apparatus disclosed above is only illustrative of the before embodiment invention and is in no way limitation.

Claims

What is claimed is: 1. An apparatus for controlling freezing nucleation and propagation in a liquid system, comprising: a. a member having an initial zone characterized by an initial surface area to volume ratio; and b. means for initiating freezing of a fluid from the initial zone to facilitate volume expansion during freezing in a direction that progresses through a series of subzones, each characterized by calculated surface area to volume ratio, to a final zone characterized by a final zone surface area to volume ratio.
2. The apparatus of claim 1 wherein the member comprises a heat exchanger.
3. The apparatus of claim 1 wherein the final zone surface area to volume ratio is lower than the initial surface area to volume ratio.
4. The apparatus of claim 1 wherein the final zone accommodates an expanded volume when the fluid freezes.
5. The apparatus of claim 4 wherein the final zone resiliently expands.
6. The apparatus of claim 1 wherein at least one of the subzones is constructed of a structure to obtain a predetermined surface area to volume ratio.
7. The apparatus of claim 6 wherein the structure is a copper foam.
8. The apparatus of claim 1 wherein at least one of the zones is constructed of a structure to obtain a predetermined surface area to volume ratio.
9. The apparatus of claim 8 wherein the structure is a copper foam.
10. The apparatus of claim 2 wherein the heat exchanger includes an inlet port extending through a first opening of the heat exchanger for conveying the fluid to a plurality of channels and passages and an outlet port extending through a second opening for discharging the fluid from the plurality of channels and passages.
11. The apparatus of claim 10 wherein the heat exchanger includes multiple inlet ports and multiple outlet ports.
12. The apparatus of claim 1 wherein the calculated zone surface area to volume ratio of each subzone progressively decreases from the initial zone in the direction of the final zone.
13. The apparatus of claim 1 further including one or more compressible objects coupled to the final zone wherein pressure exerted on the compressible object by the freezing fluid increases a volume of the final zone.
14. The apparatus of claim 13 wherein the compressible objects are confined within the final zone.
15. The apparatus of claim 13 wherein the compressible obj ects are made of one of the following: sponge, foam, air-filled bubbles, sealed tubes and balloons.
16. The apparatus of claim 15 wherein the sponge is hydrophobic.
17. The apparatus of claim 15 wherein the foam is hydrophobic.
18. The apparatus of claim 1 further including at least one air pocket disposed in the final zone wherein the air pocket accommodates the expansion by the freezing fluid.
19. The apparatus of claim 1 further including at least one air pocket disposed along a freezing path in at least one of the zones and subzones.
20. A heat exchanger, comprising: a. an initial zone characterized by a initial surface area to volume ratio; and b. means for initiating freezing of a fluid from the initial zone to accommodate volume expansion during freezing in the direction of a final zone characterized by a final zone surface area to volume ratio.
21. The heat exchanger of claim 20 wherein the final zone surface area to volume ratio is lower than the initial surface area to volume ratio.
22. The heat exchanger of claim 20 wherein the final zone accommodates an expanded volume when the fluid freezes.
23. The heat exchanger of claim 20 wherein the heat exchanger includes an inlet port extending through a first opening of the heat exchanger for conveying the fluid to a plurality of microstructures and an outlet port extending through a second opening for discharging the fluid from the plurality of channels and passages.
24. The heat exchanger of claim 23 wherein the heat exchanger includes multiple inlet ports and multiple outlet ports.
25. The heat exchanger of claim 20 wherein the final zone elasticity is sufficient to expand outwardly to accommodate the volume expansion caused by the freezing of the fluid.
26. The heat exchanger of claim 20 further including a plurality of subzones located between the initial zone and the final zone, wherein a zone surface area to volume ratio of each subzone progressively decreases from the initial zone in the direction of the final zone.
27. The heat exchanger of claim 26 wherein at least one of the subzones is constructed of a structure to obtain a predetermined surface area to volume ratio.
28. The heat exchanger of claim 27 wherein the structure is a copper foam.
29. The heat exchanger of claim 20 wherein at least one of the zones is constructed of a structure to obtain a predetermined surface area to volume ratio.
30. The heat exchanger of claim 29 wherein the structure is a copper foam.
31. The heat exchanger of claim 20 further including one or more compressible obj ects coupled to the tubular member wherein pressure exerted on the compressible object by the freezing fluid increases a volume of the final zone.
32. The heat exchanger of claim 31 wherein the compressible objects are made of one of the following: sponge, foam, air-filled bubbles, sealed tubes and balloons.
33. The heat exchanger of claim 32 wherein the sponge is hydrophobic.
34. The heat exchanger of claim 32 wherein the foam is hydrophobic.
35. The heat exchanger of claim 20 further including at least one air pocket disposed in the final zone wherein the air pocket accommodates the expansion by the freezing fluid.
36. The heat exchanger of claim 20 further including at least one air pocket disposed along a freezing path in at least one of the zones and subzones.
37. A heat exchanger, comprising: a. an inlet port extending through a first opening of the heat exchanger for conveying a fluid to a plurality of channels and passages; b. an outlet port extending through a second opening for discharging the fluid from the plurality of channels and passages; and c. means for initiating freezing from an initial zone of the heat exchanger characterized by an initial zone surface area to volume ratio to facilitate volume expansion during freezing in the direction of the inlet and outlet ports to a tubular member having a final zone characterized by a final zone surface area to volume ratio lower than the initial zone surface area to volume ratio.
38. The heat exchanger of claim 37 wherein the final zone elasticity is sufficient to expand outwardly to accommodate the volume expansion caused by the freezing of the fluid.
39. The heat exchanger of claim 37 further including a plurality of subzones located between the initial zone and the final zone, wherein a zone surface area to volume ratio of each subzone progressively decreases from the initial zone in the direction of the final zone.
40. The heat exchanger of claim 39 wherein at least one of the subzones is constructed of a structure to obtain a predetermined surface area to volume ratio.
41. The heat exchanger of claim 40 wherein the structure is a copper foam.
42. The heat exchanger of claim 37 wherein at least one of the zones is constructed of a structure to obtain a predetermined surface area to volume ratio.
43. The heat exchanger of claim 42 wherein the structure is a copper foam.
44. The heat exchanger of claim 37 wherein the heat exchanger includes multiple inlet ports and multiple outlet ports.
45. A method of controlling freezing nucleation and propagation in a liquid system, comprising the steps of: a. initiating freezing of fluid from an initial zone of a heat exchanger and characterized by a an initial zone surface area to volume ratio; and b. directing the frozen fluid to a final zone characterized by a final, lower, surface area to volume ratio.
46. The method of claim 45 wherein the final zone accommodates an expanded volume when the fluid freezes.
47. The method of claim 45 wherein the heat exchanger includes an inlet port extending through a first opening of the heat exchanger for conveying the fluid to a plurality of channels and passages and an outlet port extending through a second opening for discharging the fluid from the plurality of channels and passages.
48. The method of claim 47 wherein the heat exchanger includes multiple inlet ports and multiple outlet ports.
49. The method of claim 45 wherein the final zone elasticity is sufficient to expand outwardly to accommodate the volume expansion caused by the freezing of the fluid.
50. The method of claim 45 wherein a plurality of subzones are located between the initial zone and the final zone, and wherein a zone surface area to volume ratio of each subzone progressively decreases from the initial zone in the direction of the final zone.
PCT/US2005/016883 2004-06-04 2005-05-12 Method and apparatus for controlling freezing nucleation and propagation WO2005120238A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007515166A JP2008503071A (en) 2004-06-04 2005-05-12 Freezing control device and freezing control method
DE112005001254T DE112005001254T5 (en) 2004-06-04 2005-05-12 Method and apparatus for controlling freezing nucleation and spreading

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US57726204P 2004-06-04 2004-06-04
US60/577,262 2004-06-04
US11/049,202 US7293423B2 (en) 2004-06-04 2005-02-01 Method and apparatus for controlling freezing nucleation and propagation
US11/049,202 2005-02-01

Publications (2)

Publication Number Publication Date
WO2005120238A2 true WO2005120238A2 (en) 2005-12-22
WO2005120238A3 WO2005120238A3 (en) 2007-05-24

Family

ID=35446177

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/016883 WO2005120238A2 (en) 2004-06-04 2005-05-12 Method and apparatus for controlling freezing nucleation and propagation

Country Status (5)

Country Link
US (1) US7293423B2 (en)
JP (1) JP2008503071A (en)
DE (1) DE112005001254T5 (en)
TW (1) TWI338115B (en)
WO (1) WO2005120238A2 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8464781B2 (en) 2002-11-01 2013-06-18 Cooligy Inc. Cooling systems incorporating heat exchangers and thermoelectric layers
US7836597B2 (en) 2002-11-01 2010-11-23 Cooligy Inc. Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system
US7806168B2 (en) 2002-11-01 2010-10-05 Cooligy Inc Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange
US7591302B1 (en) 2003-07-23 2009-09-22 Cooligy Inc. Pump and fan control concepts in a cooling system
US8157001B2 (en) 2006-03-30 2012-04-17 Cooligy Inc. Integrated liquid to air conduction module
US7715194B2 (en) 2006-04-11 2010-05-11 Cooligy Inc. Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers
CN200994225Y (en) * 2006-12-29 2007-12-19 帛汉股份有限公司 Circuit substrate structure
TW200934352A (en) 2007-08-07 2009-08-01 Cooligy Inc Internal access mechanism for a server rack
US8250877B2 (en) 2008-03-10 2012-08-28 Cooligy Inc. Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door
US20110056667A1 (en) * 2008-07-15 2011-03-10 Taras Michael F Integrated multi-circuit microchannel heat exchanger
CN102171378A (en) 2008-08-05 2011-08-31 固利吉股份有限公司 Bonded metal and ceramic plates for thermal management of optical and electronic devices
JP6439326B2 (en) 2014-08-29 2018-12-19 株式会社Ihi Reactor
US10175005B2 (en) * 2015-03-30 2019-01-08 Infinera Corporation Low-cost nano-heat pipe
AR105277A1 (en) * 2015-07-08 2017-09-20 Chart Energy & Chemicals Inc MIXED REFRIGERATION SYSTEM AND METHOD
US20190116693A1 (en) * 2016-03-31 2019-04-18 Clear Px Technologies Ltd Temperature controlling device and system having static cooling capacity

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4474172A (en) * 1982-10-25 1984-10-02 Chevron Research Company Solar water heating panel

Family Cites Families (156)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US596062A (en) 1897-12-28 Device for preventing bursting of freezing pipes
US2273505A (en) 1942-02-17 Container
US2039593A (en) * 1935-06-20 1936-05-05 Theodore N Hubbuch Heat transfer coil
US3267859A (en) 1964-02-18 1966-08-23 Sakari T Jutila Liquid dielectric pump
US3361195A (en) 1966-09-23 1968-01-02 Westinghouse Electric Corp Heat sink member for a semiconductor device
US3554669A (en) 1968-12-04 1971-01-12 Gen Electric Electric-fluid energy converter
US3771219A (en) 1970-02-05 1973-11-13 Sharp Kk Method for manufacturing semiconductor device
US3635727A (en) * 1970-02-24 1972-01-18 Gen Foods Corp Uniformly distributing ice crystals in a partially frozen coffee extract slush
US3654988A (en) * 1970-02-24 1972-04-11 American Standard Inc Freeze protection for outdoor cooler
DE2102254B2 (en) * 1971-01-19 1973-05-30 Robert Bosch Gmbh, 7000 Stuttgart COOLING DEVICE FOR POWER SEMICONDUCTOR COMPONENTS
FR2216537B1 (en) * 1973-02-06 1975-03-07 Gaz De France
US3823572A (en) 1973-08-15 1974-07-16 American Air Filter Co Freeze protection device in heat pump system
US3923426A (en) 1974-08-15 1975-12-02 Alza Corp Electroosmotic pump and fluid dispenser including same
US4072188A (en) 1975-07-02 1978-02-07 Honeywell Information Systems Inc. Fluid cooling systems for electronic systems
DE2658720C3 (en) 1976-12-24 1982-01-28 Deutsche Forschungs- und Versuchsanstalt für Luft- und Raumfahrt e.V., 5300 Bonn Latent heat storage for holding a heat-storing medium
US4138996A (en) * 1977-07-28 1979-02-13 Rheem Manufacturing Company Solar heater freeze protection system
US4312012A (en) * 1977-11-25 1982-01-19 International Business Machines Corp. Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant
US4450472A (en) * 1981-03-02 1984-05-22 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels
US4573067A (en) * 1981-03-02 1986-02-25 The Board Of Trustees Of The Leland Stanford Junior University Method and means for improved heat removal in compact semiconductor integrated circuits
US4574876A (en) * 1981-05-11 1986-03-11 Extracorporeal Medical Specialties, Inc. Container with tapered walls for heating or cooling fluids
US4485429A (en) 1982-06-09 1984-11-27 Sperry Corporation Apparatus for cooling integrated circuit chips
US4494171A (en) * 1982-08-24 1985-01-15 Sundstrand Corporation Impingement cooling apparatus for heat liberating device
US4516632A (en) * 1982-08-31 1985-05-14 The United States Of America As Represented By The United States Deparment Of Energy Microchannel crossflow fluid heat exchanger and method for its fabrication
US4467861A (en) 1982-10-04 1984-08-28 Otdel Fiziko-Tekhnicheskikh Problem Energetiki Uralskogo Nauchnogo Tsentra Akademii Nauk Sssr Heat-transporting device
GB8323065D0 (en) 1983-08-26 1983-09-28 Rca Corp Flux free photo-detector soldering
US4567505A (en) * 1983-10-27 1986-01-28 The Board Of Trustees Of The Leland Stanford Junior University Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like
JPH0673364B2 (en) 1983-10-28 1994-09-14 株式会社日立製作所 Integrated circuit chip cooler
US4561040A (en) 1984-07-12 1985-12-24 Ibm Corporation Cooling system for VLSI circuit chips
US4893174A (en) 1985-07-08 1990-01-09 Hitachi, Ltd. High density integration of semiconductor circuit
US4758926A (en) 1986-03-31 1988-07-19 Microelectronics And Computer Technology Corporation Fluid-cooled integrated circuit package
US4868712A (en) 1987-02-04 1989-09-19 Woodman John K Three dimensional integrated circuit package
US5072596A (en) * 1987-02-06 1991-12-17 Reaction Thermal Systems, Inc. Ice building chilled water system and method
US4903761A (en) * 1987-06-03 1990-02-27 Lockheed Missiles & Space Company, Inc. Wick assembly for self-regulated fluid management in a pumped two-phase heat transfer system
US5016138A (en) * 1987-10-27 1991-05-14 Woodman John K Three dimensional integrated circuit package
US4894709A (en) * 1988-03-09 1990-01-16 Massachusetts Institute Of Technology Forced-convection, liquid-cooled, microchannel heat sinks
US4896719A (en) * 1988-05-11 1990-01-30 Mcdonnell Douglas Corporation Isothermal panel and plenum
US4908112A (en) * 1988-06-16 1990-03-13 E. I. Du Pont De Nemours & Co. Silicon semiconductor wafer for analyzing micronic biological samples
US4866570A (en) 1988-08-05 1989-09-12 Ncr Corporation Apparatus and method for cooling an electronic device
US4938280A (en) 1988-11-07 1990-07-03 Clark William E Liquid-cooled, flat plate heat exchanger
CA2002213C (en) 1988-11-10 1999-03-30 Iwona Turlik High performance integrated circuit chip package and method of making same
US5145001A (en) 1989-07-24 1992-09-08 Creare Inc. High heat flux compact heat exchanger having a permeable heat transfer element
US5009760A (en) * 1989-07-28 1991-04-23 Board Of Trustees Of The Leland Stanford Junior University System for measuring electrokinetic properties and for characterizing electrokinetic separations by monitoring current in electrophoresis
CH681168A5 (en) 1989-11-10 1993-01-29 Westonbridge Int Ltd Micro-pump for medicinal dosing
US5083194A (en) * 1990-01-16 1992-01-21 Cray Research, Inc. Air jet impingement on miniature pin-fin heat sinks for cooling electronic components
US5179500A (en) * 1990-02-27 1993-01-12 Grumman Aerospace Corporation Vapor chamber cooled electronic circuit card
DE4006152A1 (en) 1990-02-27 1991-08-29 Fraunhofer Ges Forschung MICROMINIATURIZED PUMP
US6176962B1 (en) * 1990-02-28 2001-01-23 Aclara Biosciences, Inc. Methods for fabricating enclosed microchannel structures
US5858188A (en) * 1990-02-28 1999-01-12 Aclara Biosciences, Inc. Acrylic microchannels and their use in electrophoretic applications
US6054034A (en) * 1990-02-28 2000-04-25 Aclara Biosciences, Inc. Acrylic microchannels and their use in electrophoretic applications
US5070040A (en) 1990-03-09 1991-12-03 University Of Colorado Foundation, Inc. Method and apparatus for semiconductor circuit chip cooling
US5016090A (en) * 1990-03-21 1991-05-14 International Business Machines Corporation Cross-hatch flow distribution and applications thereof
US5096388A (en) * 1990-03-22 1992-03-17 The Charles Stark Draper Laboratory, Inc. Microfabricated pump
US5043797A (en) 1990-04-03 1991-08-27 General Electric Company Cooling header connection for a thyristor stack
US5265670A (en) 1990-04-27 1993-11-30 International Business Machines Corporation Convection transfer system
JPH07114250B2 (en) * 1990-04-27 1995-12-06 インターナショナル・ビジネス・マシーンズ・コーポレイション Heat transfer system
US5088005A (en) * 1990-05-08 1992-02-11 Sundstrand Corporation Cold plate for cooling electronics
US5161089A (en) 1990-06-04 1992-11-03 International Business Machines Corporation Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same
US5203401A (en) * 1990-06-29 1993-04-20 Digital Equipment Corporation Wet micro-channel wafer chuck and cooling method
US5057908A (en) 1990-07-10 1991-10-15 Iowa State University Research Foundation, Inc. High power semiconductor device with integral heat sink
US5420067A (en) 1990-09-28 1995-05-30 The United States Of America As Represented By The Secretary Of The Navy Method of fabricatring sub-half-micron trenches and holes
US5099910A (en) * 1991-01-15 1992-03-31 Massachusetts Institute Of Technology Microchannel heat sink with alternating flow directions
US5099311A (en) * 1991-01-17 1992-03-24 The United States Of America As Represented By The United States Department Of Energy Microchannel heat sink assembly
JPH06342990A (en) * 1991-02-04 1994-12-13 Internatl Business Mach Corp <Ibm> Integrated cooling system
US5131233A (en) 1991-03-08 1992-07-21 Cray Computer Corporation Gas-liquid forced turbulence cooling
US5232047A (en) 1991-04-02 1993-08-03 Microunity Systems Engineering, Inc. Heat exchanger for solid-state electronic devices
US5125451A (en) 1991-04-02 1992-06-30 Microunity Systems Engineering, Inc. Heat exchanger for solid-state electronic devices
US5263251A (en) 1991-04-02 1993-11-23 Microunity Systems Engineering Method of fabricating a heat exchanger for solid-state electronic devices
US5239200A (en) 1991-08-21 1993-08-24 International Business Machines Corporation Apparatus for cooling integrated circuit chips
US5228502A (en) 1991-09-04 1993-07-20 International Business Machines Corporation Cooling by use of multiple parallel convective surfaces
JP3161635B2 (en) 1991-10-17 2001-04-25 ソニー株式会社 Ink jet print head and ink jet printer
US5386143A (en) 1991-10-25 1995-01-31 Digital Equipment Corporation High performance substrate, electronic package and integrated circuit cooling process
JPH05217121A (en) 1991-11-22 1993-08-27 Internatl Business Mach Corp <Ibm> Method and apparatus for coupling of thermo- sensitive element such as chip provided with magnetic converter, etc.
US5218515A (en) 1992-03-13 1993-06-08 The United States Of America As Represented By The United States Department Of Energy Microchannel cooling of face down bonded chips
US5239443A (en) 1992-04-23 1993-08-24 International Business Machines Corporation Blind hole cold plate cooling system
US5317805A (en) 1992-04-28 1994-06-07 Minnesota Mining And Manufacturing Company Method of making microchanneled heat exchangers utilizing sacrificial cores
US5275237A (en) * 1992-06-12 1994-01-04 Micron Technology, Inc. Liquid filled hot plate for precise temperature control
US5308429A (en) * 1992-09-29 1994-05-03 Digital Equipment Corporation System for bonding a heatsink to a semiconductor chip package
DE4240082C1 (en) 1992-11-28 1994-04-21 Erno Raumfahrttechnik Gmbh Heat pipe
US5316077A (en) * 1992-12-09 1994-05-31 Eaton Corporation Heat sink for electrical circuit components
US5269372A (en) 1992-12-21 1993-12-14 International Business Machines Corporation Intersecting flow network for a cold plate cooling system
JP3477781B2 (en) * 1993-03-23 2003-12-10 セイコーエプソン株式会社 IC card
US5436793A (en) 1993-03-31 1995-07-25 Ncr Corporation Apparatus for containing and cooling an integrated circuit device having a thermally insulative positioning member
US5459352A (en) 1993-03-31 1995-10-17 Unisys Corporation Integrated circuit package having a liquid metal-aluminum/copper joint
US5427174A (en) 1993-04-30 1995-06-27 Heat Transfer Devices, Inc. Method and apparatus for a self contained heat exchanger
US5380956A (en) * 1993-07-06 1995-01-10 Sun Microsystems, Inc. Multi-chip cooling module and method
US5727618A (en) * 1993-08-23 1998-03-17 Sdl Inc Modular microchannel heat exchanger
US5704416A (en) * 1993-09-10 1998-01-06 Aavid Laboratories, Inc. Two phase component cooler
US5514906A (en) * 1993-11-10 1996-05-07 Fujitsu Limited Apparatus for cooling semiconductor chips in multichip modules
US5441613A (en) 1993-12-03 1995-08-15 Dionex Corporation Methods and apparatus for real-time monitoring, measurement and control of electroosmotic flow
US5534471A (en) 1994-01-12 1996-07-09 Air Products And Chemicals, Inc. Ion transport membranes with catalyzed mixed conducting porous layer
US5383340A (en) * 1994-03-24 1995-01-24 Aavid Laboratories, Inc. Two-phase cooling system for laptop computers
US5544696A (en) 1994-07-01 1996-08-13 The United States Of America As Represented By The Secretary Of The Air Force Enhanced nucleate boiling heat transfer for electronic cooling and thermal energy transfer
US5641400A (en) 1994-10-19 1997-06-24 Hewlett-Packard Company Use of temperature control devices in miniaturized planar column devices and miniaturized total analysis systems
US5508234A (en) * 1994-10-31 1996-04-16 International Business Machines Corporation Microcavity structures, fabrication processes, and applications thereof
JP3355824B2 (en) 1994-11-04 2002-12-09 株式会社デンソー Corrugated fin heat exchanger
US5585069A (en) * 1994-11-10 1996-12-17 David Sarnoff Research Center, Inc. Partitioned microelectronic and fluidic device array for clinical diagnostics and chemical synthesis
US5632876A (en) * 1995-06-06 1997-05-27 David Sarnoff Research Center, Inc. Apparatus and methods for controlling fluid flow in microchannels
US5876655A (en) * 1995-02-21 1999-03-02 E. I. Du Pont De Nemours And Company Method for eliminating flow wrinkles in compression molded panels
US6227809B1 (en) * 1995-03-09 2001-05-08 University Of Washington Method for making micropumps
US5548605A (en) 1995-05-15 1996-08-20 The Regents Of The University Of California Monolithic microchannel heatsink
US5575929A (en) 1995-06-05 1996-11-19 The Regents Of The University Of California Method for making circular tubular channels with two silicon wafers
US5696405A (en) 1995-10-13 1997-12-09 Lucent Technologies Inc. Microelectronic package with device cooling
US5685966A (en) 1995-10-20 1997-11-11 The United States Of America As Represented By The Secretary Of The Navy Bubble capture electrode configuration
JP3029792B2 (en) * 1995-12-28 2000-04-04 日本サーボ株式会社 Multi-phase permanent magnet type rotating electric machine
US6039114A (en) * 1996-01-04 2000-03-21 Daimler - Benz Aktiengesellschaft Cooling body having lugs
US6010316A (en) * 1996-01-16 2000-01-04 The Board Of Trustees Of The Leland Stanford Junior University Acoustic micropump
US5675473A (en) 1996-02-23 1997-10-07 Motorola, Inc. Apparatus and method for shielding an electronic module from electromagnetic radiation
US5885470A (en) * 1997-04-14 1999-03-23 Caliper Technologies Corporation Controlled fluid transport in microfabricated polymeric substrates
US5740013A (en) * 1996-07-03 1998-04-14 Hewlett-Packard Company Electronic device enclosure having electromagnetic energy containment and heat removal characteristics
US5692558A (en) 1996-07-22 1997-12-02 Northrop Grumman Corporation Microchannel cooling using aviation fuels for airborne electronics
US6167948B1 (en) * 1996-11-18 2001-01-02 Novel Concepts, Inc. Thin, planar heat spreader
US5870823A (en) * 1996-11-27 1999-02-16 International Business Machines Corporation Method of forming a multilayer electronic packaging substrate with integral cooling channels
KR100351531B1 (en) * 1997-04-25 2002-09-11 캘리퍼 테크놀로지스 코포레이션 Microfludic devices incorporating improved channel geometries
US5880524A (en) * 1997-05-05 1999-03-09 Intel Corporation Heat pipe lid for electronic packages
US5901037A (en) * 1997-06-18 1999-05-04 Northrop Grumman Corporation Closed loop liquid cooling for semiconductor RF amplifier modules
US6013164A (en) * 1997-06-25 2000-01-11 Sandia Corporation Electokinetic high pressure hydraulic system
US6019882A (en) * 1997-06-25 2000-02-01 Sandia Corporation Electrokinetic high pressure hydraulic system
US6001231A (en) * 1997-07-15 1999-12-14 Caliper Technologies Corp. Methods and systems for monitoring and controlling fluid flow rates in microfluidic systems
US6034872A (en) * 1997-07-16 2000-03-07 International Business Machines Corporation Cooling computer systems
US6907921B2 (en) * 1998-06-18 2005-06-21 3M Innovative Properties Company Microchanneled active fluid heat exchanger
US6012902A (en) * 1997-09-25 2000-01-11 Caliper Technologies Corp. Micropump
US5842787A (en) * 1997-10-09 1998-12-01 Caliper Technologies Corporation Microfluidic systems incorporating varied channel dimensions
US6174675B1 (en) * 1997-11-25 2001-01-16 Caliper Technologies Corp. Electrical current for controlling fluid parameters in microchannels
US6019165A (en) * 1998-05-18 2000-02-01 Batchelder; John Samuel Heat exchange apparatus
US6196307B1 (en) * 1998-06-17 2001-03-06 Intersil Americas Inc. High performance heat exchanger and method
US6032689A (en) * 1998-10-30 2000-03-07 Industrial Technology Research Institute Integrated flow controller module
US6553253B1 (en) * 1999-03-12 2003-04-22 Biophoretic Therapeutic Systems, Llc Method and system for electrokinetic delivery of a substance
US6388385B1 (en) * 1999-03-19 2002-05-14 Fei Company Corrugated style anode element for ion pumps
US6234240B1 (en) * 1999-07-01 2001-05-22 Kioan Cheon Fanless cooling system for computer
US6396706B1 (en) * 1999-07-30 2002-05-28 Credence Systems Corporation Self-heating circuit board
JP3518434B2 (en) * 1999-08-11 2004-04-12 株式会社日立製作所 Multi-chip module cooling system
US6216343B1 (en) * 1999-09-02 2001-04-17 The United States Of America As Represented By The Secretary Of The Air Force Method of making micro channel heat pipe having corrugated fin elements
US6210986B1 (en) * 1999-09-23 2001-04-03 Sandia Corporation Microfluidic channel fabrication method
JP2001110956A (en) * 1999-10-04 2001-04-20 Matsushita Electric Ind Co Ltd Cooling equipment for electronic component
US6729383B1 (en) * 1999-12-16 2004-05-04 The United States Of America As Represented By The Secretary Of The Navy Fluid-cooled heat sink with turbulence-enhancing support pins
US6337794B1 (en) * 2000-02-11 2002-01-08 International Business Machines Corporation Isothermal heat sink with tiered cooling channels
US6366467B1 (en) * 2000-03-31 2002-04-02 Intel Corporation Dual-socket interposer and method of fabrication therefor
DE60140837D1 (en) * 2000-04-19 2010-02-04 Thermal Form & Function Inc Cooling plate with cooling fins with a vaporizing coolant
US6366462B1 (en) * 2000-07-18 2002-04-02 International Business Machines Corporation Electronic module with integral refrigerant evaporator assembly and control system therefore
US6416672B1 (en) * 2000-08-25 2002-07-09 The Regents Of The University Of California Removal of dissolved and colloidal silica
US6388317B1 (en) * 2000-09-25 2002-05-14 Lockheed Martin Corporation Solid-state chip cooling by use of microchannel coolant flow
US6537437B1 (en) * 2000-11-13 2003-03-25 Sandia Corporation Surface-micromachined microfluidic devices
US6367544B1 (en) * 2000-11-21 2002-04-09 Thermal Corp. Thermal jacket for reducing condensation and method for making same
US6336497B1 (en) * 2000-11-24 2002-01-08 Ching-Bin Lin Self-recirculated heat dissipating means for cooling central processing unit
CA2329408C (en) * 2000-12-21 2007-12-04 Long Manufacturing Ltd. Finned plate heat exchanger
US6519151B2 (en) * 2001-06-27 2003-02-11 International Business Machines Corporation Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof
US6825127B2 (en) * 2001-07-24 2004-11-30 Zarlink Semiconductor Inc. Micro-fluidic devices
US6533029B1 (en) * 2001-09-04 2003-03-18 Thermal Corp. Non-inverted meniscus loop heat pipe/capillary pumped loop evaporator
US6981543B2 (en) * 2001-09-20 2006-01-03 Intel Corporation Modular capillary pumped loop cooling system
US6942018B2 (en) * 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
US6554669B1 (en) * 2001-12-18 2003-04-29 Stephen J. Motosko Inflatable flotation device
US6719535B2 (en) * 2002-01-31 2004-04-13 Eksigent Technologies, Llc Variable potential electrokinetic device
US6894899B2 (en) * 2002-09-13 2005-05-17 Hong Kong Cheung Tat Electrical Co. Ltd. Integrated fluid cooling system for electronic components
US6881039B2 (en) * 2002-09-23 2005-04-19 Cooligy, Inc. Micro-fabricated electrokinetic pump
US6889515B2 (en) * 2002-11-12 2005-05-10 Isothermal Systems Research, Inc. Spray cooling system
US7337832B2 (en) * 2003-04-30 2008-03-04 Valeo, Inc. Heat exchanger

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4474172A (en) * 1982-10-25 1984-10-02 Chevron Research Company Solar water heating panel

Also Published As

Publication number Publication date
US7293423B2 (en) 2007-11-13
TWI338115B (en) 2011-03-01
JP2008503071A (en) 2008-01-31
DE112005001254T5 (en) 2007-08-23
WO2005120238A3 (en) 2007-05-24
US20050268626A1 (en) 2005-12-08
TW200540381A (en) 2005-12-16

Similar Documents

Publication Publication Date Title
US7293423B2 (en) Method and apparatus for controlling freezing nucleation and propagation
US7402029B2 (en) Remedies to prevent cracking in a liquid system
JP2008503071A5 (en)
JP2009170877A (en) Apparatus and method for preventing cracking, and proof-freezing heat exchange apparatus
RU2500548C2 (en) System and device incorporating integrated condenser and evaporator
RU2018118546A (en) DISTRICT HEAT ENERGY DISTRIBUTION SYSTEM
US8365540B2 (en) System and method for heat transfer
JP2010513845A5 (en)
US20090107663A1 (en) System and Method for Cooling Structures Having Both an Active State and an Inactive State
EP3350523B1 (en) System and method of freeze protection for a chiller
JP2006038302A (en) Cooling device, and cooling control method
CN220829114U (en) Double-pipe heat exchanger and heating ventilation equipment with same
JPH05133693A (en) Water cooling device
JP3692171B2 (en) Supercooling water production equipment
EP1825205A1 (en) Evaporator protection
KR100479733B1 (en) Refrigerant distributor for split-type air conditioner
JPH0517365U (en) Water pipe
JP2010091252A (en) Heat exchanger
JPH0642847A (en) Method for controlling of anti-freezing at water feeding nozzle in ice block manufacturing device
Cerza et al. The Effect of Sink Temperature on a Capillary Pumped Loop Employing a Flat Evaporator and Shell and Tube Condenser
ZA200709902B (en) Protective element for pipes and ducts
JPH04332363A (en) Ice heat accumulating device
KR20150004116U (en) a pipe with froze and burst Protection
JP2006057966A (en) Liquid return device for cold heat generating system, its manufacturing method, and cold heat generating system
KR19990052871A (en) Radiator Coolant Reservoir Tank with Air Bag

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
DPEN Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed from 20040101)
WWE Wipo information: entry into national phase

Ref document number: 1120050012549

Country of ref document: DE

Ref document number: 2007515166

Country of ref document: JP

RET De translation (de og part 6b)

Ref document number: 112005001254

Country of ref document: DE

Date of ref document: 20070823

Kind code of ref document: P

122 Ep: pct application non-entry in european phase